JPS6243345B2 - - Google Patents

Info

Publication number
JPS6243345B2
JPS6243345B2 JP57135109A JP13510982A JPS6243345B2 JP S6243345 B2 JPS6243345 B2 JP S6243345B2 JP 57135109 A JP57135109 A JP 57135109A JP 13510982 A JP13510982 A JP 13510982A JP S6243345 B2 JPS6243345 B2 JP S6243345B2
Authority
JP
Japan
Prior art keywords
holding
heat dissipation
board
component
transistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57135109A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5927556A (ja
Inventor
Tsuratoshi Hisamoto
Yukio Hosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hanshin Electric Co Ltd
Original Assignee
Hanshin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hanshin Electric Co Ltd filed Critical Hanshin Electric Co Ltd
Priority to JP57135109A priority Critical patent/JPS5927556A/ja
Publication of JPS5927556A publication Critical patent/JPS5927556A/ja
Publication of JPS6243345B2 publication Critical patent/JPS6243345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP57135109A 1982-08-04 1982-08-04 要放熱電気部品の取付方法 Granted JPS5927556A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57135109A JPS5927556A (ja) 1982-08-04 1982-08-04 要放熱電気部品の取付方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57135109A JPS5927556A (ja) 1982-08-04 1982-08-04 要放熱電気部品の取付方法

Publications (2)

Publication Number Publication Date
JPS5927556A JPS5927556A (ja) 1984-02-14
JPS6243345B2 true JPS6243345B2 (US20020051482A1-20020502-M00020.png) 1987-09-12

Family

ID=15144041

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57135109A Granted JPS5927556A (ja) 1982-08-04 1982-08-04 要放熱電気部品の取付方法

Country Status (1)

Country Link
JP (1) JPS5927556A (US20020051482A1-20020502-M00020.png)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59165443A (ja) * 1983-03-11 1984-09-18 Hitachi Denshi Ltd 割基板
JPS6184042A (ja) * 1984-09-29 1986-04-28 Nitto Electric Ind Co Ltd コネクタ−
FR3004058B1 (fr) * 2013-03-26 2016-12-16 Valeo Systemes Thermiques Module de commande d'un appareil electrique
FR3004056B1 (fr) * 2013-03-26 2016-10-21 Valeo Systemes Thermiques Module de commande d'un appareil electrique
FR3004057B1 (fr) * 2013-03-26 2017-02-17 Valeo Systemes Thermiques Module de commande d'un appareil electrique

Also Published As

Publication number Publication date
JPS5927556A (ja) 1984-02-14

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