JPS6242539Y2 - - Google Patents

Info

Publication number

JPS6242539Y2

JPS6242539Y2 JP1981013018U JP1301881U JPS6242539Y2 JP S6242539 Y2 JPS6242539 Y2 JP S6242539Y2 JP 1981013018 U JP1981013018 U JP 1981013018U JP 1301881 U JP1301881 U JP 1301881U JP S6242539 Y2 JPS6242539 Y2 JP S6242539Y2

Authority

JP

Japan

Prior art keywords

insulating substrate

insulating

integrated circuit

hybrid integrated

substrates

Prior art date

1981-01-30

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Expired

Links

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• 239000000758 substrate Substances 0.000 claims description 27
• 239000011347 resin Substances 0.000 claims description 15
• 229920005989 resin Polymers 0.000 claims description 15
• 239000004020 conductor Substances 0.000 claims description 11
• 239000003990 capacitor Substances 0.000 claims description 4
• 239000004065 semiconductor Substances 0.000 claims description 4
• 238000000034 method Methods 0.000 description 4
• 229910000679 solder Inorganic materials 0.000 description 3
• PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
• 238000000576 coating method Methods 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 239000000843 powder Substances 0.000 description 2
• 229910052709 silver Inorganic materials 0.000 description 2
• 239000004332 silver Substances 0.000 description 2
• 229910001369 Brass Inorganic materials 0.000 description 1
• 229910000906 Bronze Inorganic materials 0.000 description 1
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
• 239000010951 brass Substances 0.000 description 1
• 239000010974 bronze Substances 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1
• KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
• 238000004132 cross linking Methods 0.000 description 1
• 239000011810 insulating material Substances 0.000 description 1
• 230000010354 integration Effects 0.000 description 1
• 238000004519 manufacturing process Methods 0.000 description 1
• 239000002184 metal Substances 0.000 description 1
• 229910052751 metal Inorganic materials 0.000 description 1
• 238000004806 packaging method and process Methods 0.000 description 1
• SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
• 238000003825 pressing Methods 0.000 description 1
• 238000004080 punching Methods 0.000 description 1
• 238000007650 screen-printing Methods 0.000 description 1