JPS6242538Y2 - - Google Patents
Info
- Publication number
- JPS6242538Y2 JPS6242538Y2 JP6756383U JP6756383U JPS6242538Y2 JP S6242538 Y2 JPS6242538 Y2 JP S6242538Y2 JP 6756383 U JP6756383 U JP 6756383U JP 6756383 U JP6756383 U JP 6756383U JP S6242538 Y2 JPS6242538 Y2 JP S6242538Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- stage
- probe
- wafer
- container
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 46
- 239000000523 sample Substances 0.000 claims description 26
- 238000007689 inspection Methods 0.000 claims description 20
- 239000011810 insulating material Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 58
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000005259 measurement Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000005304 joining Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000000284 extract Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6756383U JPS59173338U (ja) | 1983-05-06 | 1983-05-06 | 半導体ウエハの検査装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6756383U JPS59173338U (ja) | 1983-05-06 | 1983-05-06 | 半導体ウエハの検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59173338U JPS59173338U (ja) | 1984-11-19 |
| JPS6242538Y2 true JPS6242538Y2 (cs) | 1987-10-31 |
Family
ID=30197752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6756383U Granted JPS59173338U (ja) | 1983-05-06 | 1983-05-06 | 半導体ウエハの検査装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59173338U (cs) |
-
1983
- 1983-05-06 JP JP6756383U patent/JPS59173338U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59173338U (ja) | 1984-11-19 |
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