JPS624157U - - Google Patents
Info
- Publication number
- JPS624157U JPS624157U JP1985094353U JP9435385U JPS624157U JP S624157 U JPS624157 U JP S624157U JP 1985094353 U JP1985094353 U JP 1985094353U JP 9435385 U JP9435385 U JP 9435385U JP S624157 U JPS624157 U JP S624157U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- led
- connection electrode
- attached
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図〜第５図は本考案の一実施例に係り、第
１図はチツプ部品型ＬＥＤを上方より見た斜視図
、第２図は同裏側から見た斜視図、第３図は同上
方より見た分解斜視図、第４図は第１の基板用の
母材基板を示し、同図ａはその要部上面図、同図
ｂはその底面図、第５図は第２の基板用の母材基
板の要部上面図、第６図は従来例を示す斜視図で
ある。
１０……ＬＥＤ、１１……第１の基板、１１ａ
……凹み、１２……第２の基板、１２ａ……窓、
１２ｂ……傾斜面、１３Ａ，１３Ｂ……ＬＥＤ接
続用電極、１４Ａ，１４Ｂ……上下面接続用電極
、１５Ａ，１５Ｂ……外部接続用電極、１６……
透孔、１７……ペイント、ＭＢ１……第１の基板
用の母材基板、ＭＢ２……第２の基板用の母材基
板。
Figures 1 to 5 relate to one embodiment of the present invention, in which Figure 1 is a perspective view of a chip component type LED seen from above, Figure 2 is a perspective view of the same as seen from the back side, and Figure 3 is the same as above. 4 shows the base material substrate for the first substrate, FIG. 4A shows a top view of its essential parts, FIG. FIG. 6 is a perspective view showing a conventional example. 10...LED, 11...first board, 11a
... recess, 12 ... second substrate, 12a ... window,
12b... Slanted surface, 13A, 13B... Electrode for LED connection, 14A, 14B... Electrode for upper and lower surface connection, 15A, 15B... Electrode for external connection, 16...
Through hole, 17... Paint, MB1... Base material substrate for the first substrate, MB2... Base material substrate for the second substrate.
Claims (1)
と、該第１の基板の上面に被着された前記ＬＥＤ
の電極に接続されるＬＥＤ接続用電極と、前記第
１の基板の下面に被着された外部接続用電極と、
前記ＬＥＤ接続用電極と外部接続用電極とを接続
するために、前記第１の基板の端面において透孔
を略縦半分に切断することによつて形成された凹
みの壁面に被着された上下面接続用電極と、前記
第１の基板上に密着・固定され且つ前記ＬＥＤを
外部に臨ませるための窓を形成した第２の基板と
を、具備したことを特徴とするチツプ部品型ＬＥ
Ｄ。 a first substrate for mounting an LED on its upper surface; and the LED adhered to the upper surface of the first substrate.
an LED connection electrode connected to the electrode of the first substrate; an external connection electrode attached to the lower surface of the first substrate;
In order to connect the LED connection electrode and the external connection electrode, a top plate is attached to the wall surface of a recess formed by cutting a through hole approximately in half vertically on the end surface of the first substrate. A chip component type LE characterized by comprising a lower surface connection electrode, and a second substrate that is closely attached and fixed on the first substrate and has a window for exposing the LED to the outside.
D.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985094353U JPH0416462Y2 (en) | 1985-06-21 | 1985-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985094353U JPH0416462Y2 (en) | 1985-06-21 | 1985-06-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS624157U true JPS624157U (en) | 1987-01-12 |
| JPH0416462Y2 JPH0416462Y2 (en) | 1992-04-13 |
Family
ID=30652834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985094353U Expired JPH0416462Y2 (en) | 1985-06-21 | 1985-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0416462Y2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01231772A (en) * | 1988-03-11 | 1989-09-18 | Toyota Autom Loom Works Ltd | Device for translocating cross roll of weaving machine |
| JP2005035864A (en) * | 2002-10-15 | 2005-02-10 | Kenichiro Miyahara | Substrate for mounting luminous element |
| JP2005538550A (en) * | 2002-09-04 | 2005-12-15 | クリー インコーポレイテッド | Power surface mounted light emitting die package |
| KR20150081120A (en) * | 2014-01-03 | 2015-07-13 | 엘지이노텍 주식회사 | Lighting source module and light system having the same |
| JP2016004946A (en) * | 2014-06-18 | 2016-01-12 | ローム株式会社 | Optical device, mounting structure for optical device and method of manufacturing optical device |
| WO2019160062A1 (en) * | 2018-02-16 | 2019-08-22 | 京セラ株式会社 | Multipiece element storage package, and multipiece optical semiconductor device |
-
1985
- 1985-06-21 JP JP1985094353U patent/JPH0416462Y2/ja not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01231772A (en) * | 1988-03-11 | 1989-09-18 | Toyota Autom Loom Works Ltd | Device for translocating cross roll of weaving machine |
| JP2005538550A (en) * | 2002-09-04 | 2005-12-15 | クリー インコーポレイテッド | Power surface mounted light emitting die package |
| JP2005035864A (en) * | 2002-10-15 | 2005-02-10 | Kenichiro Miyahara | Substrate for mounting luminous element |
| KR20150081120A (en) * | 2014-01-03 | 2015-07-13 | 엘지이노텍 주식회사 | Lighting source module and light system having the same |
| JP2016004946A (en) * | 2014-06-18 | 2016-01-12 | ローム株式会社 | Optical device, mounting structure for optical device and method of manufacturing optical device |
| WO2019160062A1 (en) * | 2018-02-16 | 2019-08-22 | 京セラ株式会社 | Multipiece element storage package, and multipiece optical semiconductor device |
| CN111684673A (en) * | 2018-02-16 | 2020-09-18 | 京瓷株式会社 | Multi-chip component housing package and multi-chip optical semiconductor device |
| JPWO2019160062A1 (en) * | 2018-02-16 | 2021-02-12 | 京セラ株式会社 | Multi-cavity element storage package and multi-capture optical semiconductor device |
| US11172571B2 (en) | 2018-02-16 | 2021-11-09 | Kyocera Corporation | Multipiece element storage package and multipiece optical semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0416462Y2 (en) | 1992-04-13 |
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