JPS624140U - - Google Patents
Info
- Publication number
- JPS624140U JPS624140U JP1985092945U JP9294585U JPS624140U JP S624140 U JPS624140 U JP S624140U JP 1985092945 U JP1985092945 U JP 1985092945U JP 9294585 U JP9294585 U JP 9294585U JP S624140 U JPS624140 U JP S624140U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- circuit
- cooling
- pillar
- protect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Description
第1図は本考案の一実施例のモジユールの断面
図である。
1……回路基板、2……LSI、3……封止冷
却部、4……はんだ、5……側壁、6……支柱、
7……はんだ。
FIG. 1 is a sectional view of a module according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... LSI, 3... Sealing cooling part, 4... Solder, 5... Side wall, 6... Support column,
7...Solder.
Claims (1)
ための気密封止と冷却機構を兼ねた封止部とより
成るモジユールにおいて、回路基板上に冷却部と
接する柱を設けたことを特徴とするモジユールの
構造。 A module comprising a circuit board on which electronic components are mounted and a sealing part that is hermetically sealed to protect the circuit and also serves as a cooling mechanism, characterized in that a pillar is provided on the circuit board in contact with the cooling part. structure.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985092945U JPS624140U (en) | 1985-06-21 | 1985-06-21 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1985092945U JPS624140U (en) | 1985-06-21 | 1985-06-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS624140U true JPS624140U (en) | 1987-01-12 |
Family
ID=30650187
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1985092945U Pending JPS624140U (en) | 1985-06-21 | 1985-06-21 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS624140U (en) |
-
1985
- 1985-06-21 JP JP1985092945U patent/JPS624140U/ja active Pending
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