JPS6240832U - - Google Patents

Info

Publication number
JPS6240832U
JPS6240832U JP1985131893U JP13189385U JPS6240832U JP S6240832 U JPS6240832 U JP S6240832U JP 1985131893 U JP1985131893 U JP 1985131893U JP 13189385 U JP13189385 U JP 13189385U JP S6240832 U JPS6240832 U JP S6240832U
Authority
JP
Japan
Prior art keywords
package
flip chip
flip
bump group
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1985131893U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985131893U priority Critical patent/JPS6240832U/ja
Publication of JPS6240832U publication Critical patent/JPS6240832U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Wire Bonding (AREA)
JP1985131893U 1985-08-28 1985-08-28 Pending JPS6240832U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985131893U JPS6240832U (enrdf_load_stackoverflow) 1985-08-28 1985-08-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985131893U JPS6240832U (enrdf_load_stackoverflow) 1985-08-28 1985-08-28

Publications (1)

Publication Number Publication Date
JPS6240832U true JPS6240832U (enrdf_load_stackoverflow) 1987-03-11

Family

ID=31030765

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985131893U Pending JPS6240832U (enrdf_load_stackoverflow) 1985-08-28 1985-08-28

Country Status (1)

Country Link
JP (1) JPS6240832U (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302650A (ja) * 1993-04-14 1994-10-28 Nec Corp 半導体装置
JP2002313972A (ja) * 2001-04-18 2002-10-25 Matsushita Electric Ind Co Ltd 電子部品組立体および電子部品組立体の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06302650A (ja) * 1993-04-14 1994-10-28 Nec Corp 半導体装置
JP2002313972A (ja) * 2001-04-18 2002-10-25 Matsushita Electric Ind Co Ltd 電子部品組立体および電子部品組立体の製造方法

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