JPS6239215A - 樹脂封止型半導体装置の製造方法および樹脂成形用金型 - Google Patents

樹脂封止型半導体装置の製造方法および樹脂成形用金型

Info

Publication number
JPS6239215A
JPS6239215A JP17772585A JP17772585A JPS6239215A JP S6239215 A JPS6239215 A JP S6239215A JP 17772585 A JP17772585 A JP 17772585A JP 17772585 A JP17772585 A JP 17772585A JP S6239215 A JPS6239215 A JP S6239215A
Authority
JP
Japan
Prior art keywords
temperature
pot
cavity
main runner
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17772585A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0431285B2 (enrdf_load_stackoverflow
Inventor
Shizukatsu Nakamura
中村　倭勝
Yoshimori Tone
戸根　義守
Yasuhito Suzuki
康仁 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP17772585A priority Critical patent/JPS6239215A/ja
Publication of JPS6239215A publication Critical patent/JPS6239215A/ja
Publication of JPH0431285B2 publication Critical patent/JPH0431285B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C2045/7343—Heating or cooling of the mould heating or cooling different mould parts at different temperatures
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP17772585A 1985-08-14 1985-08-14 樹脂封止型半導体装置の製造方法および樹脂成形用金型 Granted JPS6239215A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17772585A JPS6239215A (ja) 1985-08-14 1985-08-14 樹脂封止型半導体装置の製造方法および樹脂成形用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17772585A JPS6239215A (ja) 1985-08-14 1985-08-14 樹脂封止型半導体装置の製造方法および樹脂成形用金型

Publications (2)

Publication Number Publication Date
JPS6239215A true JPS6239215A (ja) 1987-02-20
JPH0431285B2 JPH0431285B2 (enrdf_load_stackoverflow) 1992-05-26

Family

ID=16036018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17772585A Granted JPS6239215A (ja) 1985-08-14 1985-08-14 樹脂封止型半導体装置の製造方法および樹脂成形用金型

Country Status (1)

Country Link
JP (1) JPS6239215A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0167012U (enrdf_load_stackoverflow) * 1987-10-22 1989-04-28
US5368805A (en) * 1992-03-24 1994-11-29 Fuji Electric Co., Ltd. Method for producing resin sealed type semiconductor device
NL1026407C2 (nl) * 2004-06-11 2005-12-14 Fico Bv Werkwijze en inrichting voor het beheersbaar omhullen van elektronische componenten.

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140040A (ja) * 1983-01-31 1984-08-11 Polyplastics Co ビデオテ−プリ−ルの成形法
JPS59232809A (ja) * 1983-06-16 1984-12-27 Shigeru Ikemoto 合成樹脂製品成形用金型装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140040A (ja) * 1983-01-31 1984-08-11 Polyplastics Co ビデオテ−プリ−ルの成形法
JPS59232809A (ja) * 1983-06-16 1984-12-27 Shigeru Ikemoto 合成樹脂製品成形用金型装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0167012U (enrdf_load_stackoverflow) * 1987-10-22 1989-04-28
US5368805A (en) * 1992-03-24 1994-11-29 Fuji Electric Co., Ltd. Method for producing resin sealed type semiconductor device
NL1026407C2 (nl) * 2004-06-11 2005-12-14 Fico Bv Werkwijze en inrichting voor het beheersbaar omhullen van elektronische componenten.
WO2005120799A1 (en) * 2004-06-11 2005-12-22 Fico B.V. Method and device for controllable encapsulation of electronic components
JP2008502516A (ja) * 2004-06-11 2008-01-31 フィーコ ビー．ブイ． 電子部品の制御可能な封入のための方法およびデバイス
US8425826B2 (en) 2004-06-11 2013-04-23 Fico B.V. Method and device for controllable encapsulation of electronic components

Also Published As

Publication number Publication date
JPH0431285B2 (enrdf_load_stackoverflow) 1992-05-26

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