JPS6239103B2 - - Google Patents
Info
- Publication number
- JPS6239103B2 JPS6239103B2 JP16756479A JP16756479A JPS6239103B2 JP S6239103 B2 JPS6239103 B2 JP S6239103B2 JP 16756479 A JP16756479 A JP 16756479A JP 16756479 A JP16756479 A JP 16756479A JP S6239103 B2 JPS6239103 B2 JP S6239103B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- thickness
- heat
- flexible copper
- polyparabanic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 229920006267 polyester film Polymers 0.000 claims description 21
- 239000002253 acid Substances 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000011889 copper foil Substances 0.000 claims description 16
- 239000002131 composite material Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 description 11
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 8
- 238000005476 soldering Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 229920000728 polyester Polymers 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 229920000459 Nitrile rubber Polymers 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 241000207439 Myra Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16756479A JPS5689942A (en) | 1979-12-25 | 1979-12-25 | Composite film base flexible copper lined plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16756479A JPS5689942A (en) | 1979-12-25 | 1979-12-25 | Composite film base flexible copper lined plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5689942A JPS5689942A (en) | 1981-07-21 |
| JPS6239103B2 true JPS6239103B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-08-21 |
Family
ID=15852060
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16756479A Granted JPS5689942A (en) | 1979-12-25 | 1979-12-25 | Composite film base flexible copper lined plate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5689942A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1979
- 1979-12-25 JP JP16756479A patent/JPS5689942A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5689942A (en) | 1981-07-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3744970B2 (ja) | フレックスリジッド配線板の製造方法 | |
| JPH09148695A (ja) | フレキシブルプリント回路基板及びその製造方法 | |
| JPS6239103B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JPH0858020A (ja) | フレキシブル銅張積層フィルムとその製造方法 | |
| JP2729063B2 (ja) | フレキシブル金属箔積層板の製造方法 | |
| JPH04290495A (ja) | 多層フレキシブルプリント配線板及びその製造方法 | |
| JPH10209583A (ja) | フレキシブル金属箔ポリイミド積層板 | |
| JPH04105392A (ja) | フレキシブルプリント回路基板及びその製造方法 | |
| JP2002052614A (ja) | 積層板の製造方法 | |
| JPH02217240A (ja) | 表面実装用積層板とその製造方法 | |
| JP2653583B2 (ja) | 表面にポリアミック酸層を有するポリイミドフィルム及びこれを用いたフレキシブル印刷回路用基板 | |
| JPS61183374A (ja) | フレキシブル印刷配線板用接着剤組成物 | |
| JPS6034842A (ja) | 金属ベ−ス銅張板 | |
| JP4111596B2 (ja) | フレキシブル金属積層体 | |
| JPH0366825B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JP3840744B2 (ja) | 多層板の製造方法 | |
| JPH0582966A (ja) | フレクスリジツトプリント配線板 | |
| JP2000052481A (ja) | ステンレス箔を使用した金属積層板 | |
| JPH1034820A (ja) | 非対称両面フレキシブル金属箔積層板の製造方法 | |
| JPH07120854B2 (ja) | 多層配線板 | |
| JPS6335418B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | ||
| JP2000058989A (ja) | フレキシブル金属箔積層板 | |
| JPS6369633A (ja) | 電気用積層板 | |
| JPH03278587A (ja) | 金属ベース金属箔張り積層板 | |
| JPH04119685A (ja) | 回路用基板 |