JPS6239020A - ワイヤボンデイング装置 - Google Patents
ワイヤボンデイング装置Info
- Publication number
- JPS6239020A JPS6239020A JP60179091A JP17909185A JPS6239020A JP S6239020 A JPS6239020 A JP S6239020A JP 60179091 A JP60179091 A JP 60179091A JP 17909185 A JP17909185 A JP 17909185A JP S6239020 A JPS6239020 A JP S6239020A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heater block
- wire bonding
- hole
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60179091A JPS6239020A (ja) | 1985-08-14 | 1985-08-14 | ワイヤボンデイング装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60179091A JPS6239020A (ja) | 1985-08-14 | 1985-08-14 | ワイヤボンデイング装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6239020A true JPS6239020A (ja) | 1987-02-20 |
JPH0528496B2 JPH0528496B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-04-26 |
Family
ID=16059904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60179091A Granted JPS6239020A (ja) | 1985-08-14 | 1985-08-14 | ワイヤボンデイング装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6239020A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
-
1985
- 1985-08-14 JP JP60179091A patent/JPS6239020A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPH0528496B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-04-26 |
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