JPS6238275A - Method for detecting residual amount of adhesive - Google Patents
Method for detecting residual amount of adhesiveInfo
- Publication number
- JPS6238275A JPS6238275A JP60177132A JP17713285A JPS6238275A JP S6238275 A JPS6238275 A JP S6238275A JP 60177132 A JP60177132 A JP 60177132A JP 17713285 A JP17713285 A JP 17713285A JP S6238275 A JPS6238275 A JP S6238275A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- amount
- coating
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、接着剤塗布後に規定量の接着剤が、プリント
基板上に塗布されていることを、確認することにより、
接着剤の残量を検出する、接着剤残量検出方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention provides a method for confirming that a specified amount of adhesive has been applied on a printed circuit board after applying the adhesive.
The present invention relates to a method for detecting the remaining amount of adhesive.
従来の技術
従来、接着剤の残量検出の方法としては、接着剤塗布の
回数をカウントし、その回数から接着剤の使用量を推定
する方法や、機械稼動時間から推定する方法がとられて
いた。Conventional technology Conventionally, the remaining amount of adhesive has been detected by counting the number of times the adhesive is applied and estimating the amount of adhesive used from that number, or by estimating the amount of adhesive used from the machine operating time. Ta.
発明が解決しようとする問題点
しかし、接着剤の粘度変化、吐出圧力の変化等があるた
め、実際の使用量を正確に推定するのには限界があり、
従って、オペレーターにより、接着剤残量の目視チェッ
クが行なわれていた。そのため、機械の稼動率の低下や
チェック工数の発生。Problems to be Solved by the Invention However, there are limits to accurately estimating the actual amount used due to changes in the viscosity of the adhesive, changes in the discharge pressure, etc.
Therefore, the operator visually checks the remaining amount of adhesive. As a result, the operating rate of the machine decreases and the number of man-hours required for checking occurs.
チェックを忘れた場合接着剤切れによる接着剤未塗布の
不良プリント基板発生の可能性が問題となっていた。If this check is forgotten, there is a possibility of a defective printed circuit board with no adhesive applied due to the adhesive running out.
問題点を解決するだめの手段
本発明の接着剤残量検出方法は、接着剤をプリント基板
に塗布する接着剤塗布工程と、前記プリント基板上の塗
布済接着剤の量を検知する検出工程と、塗布時に検出タ
イミング信号を発生し、前記接着剤の量を判別する工程
と、この判別工程だより接着剤の残量を検知する工程と
からなる。Means for Solving the Problems The method for detecting the amount of adhesive remaining according to the present invention includes an adhesive application step of applying adhesive to a printed circuit board, and a detection step of detecting the amount of applied adhesive on the printed circuit board. , a step of generating a detection timing signal during application to determine the amount of adhesive, and a step of detecting the remaining amount of adhesive from this determination step.
作 用
本発明は接着剤の残量が少なくなれば、塗布済接着剤の
量が少なくなったり、全く無くなったりする。その事を
利用して、プリント基板上の塗布済接着剤の量を検知す
ることにより、接着剤の残量の有無を判断することがで
きるものである。このように、自動的に、また確実に接
着剤切れを検知することができ、定期的な接着剤残量の
目視チェックが不要になる。Function According to the present invention, when the remaining amount of adhesive decreases, the amount of applied adhesive decreases or completely disappears. By utilizing this fact and detecting the amount of applied adhesive on the printed circuit board, it is possible to determine whether there is any remaining amount of adhesive. In this way, adhesive exhaustion can be detected automatically and reliably, making it unnecessary to periodically visually check the remaining amount of adhesive.
実施例
第２図は本発明を適用するチップ部品実装機の概略説明
図である。第１図は接着剤塗布ノズル部の詳細図である
。チップ部品の実装は接着剤塗布ノズル１によりプリン
ト基板５上にまず接着剤８を塗布しその上に、部品装着
ノズル２によりチップ部品を装着し完了する。Embodiment FIG. 2 is a schematic explanatory diagram of a chip component mounting machine to which the present invention is applied. FIG. 1 is a detailed view of the adhesive application nozzle section. Mounting of the chip components is completed by first applying adhesive 8 onto the printed circuit board 5 using the adhesive application nozzle 1, and then mounting the chip components thereon using the component mounting nozzle 2.
１枚のＰ板に対する塗布が全て行なわれた時にＮＣ装置
６より検出タイミング信号１０が発せられ、塗布位置如
焦点を合わせである光フアイバ光電センサ７が、Ｐ板５
と塗布隣接着剤８０反射率の差により接着剤有無判定信
号１するＮＣ装置６に送り接着剤が正常に塗布されたか
どうか、すなわち、接着剤が、接着剤タンク９Ｋまだ残
っていたかどうかがチェックされる。以上を第６図に基
づいて説明する。When all the coatings are applied to one P plate, the NC device 6 issues a detection timing signal 10, and the optical fiber photoelectric sensor 7, which focuses on the coating position, detects the P plate 5.
Based on the difference between the reflectance of the applied adhesive 80 and the applied adhesive 80, the adhesive presence determination signal 1 is sent to the NC device 6 to check whether the adhesive has been applied normally, that is, whether the adhesive still remains in the adhesive tank 9K. be done. The above will be explained based on FIG.
まず、オペレーターによりスタートがかけられ、接着剤
の塗布が行なわれる。塗布実行後、ＮＣ装置６が１枚の
プリント基板における最終塗布かどうか判断し、そうで
なければ、次の塗布を行なう。First, the operator starts the machine and applies the adhesive. After the coating is executed, the NC device 6 determines whether this is the final coating for one printed circuit board, and if not, performs the next coating.
最終塗布であれば、ＮＣ装置６より、検出タイミング信
号が発生され、光フアイバ光電センサ７により、プリン
ト基板上の塗布済接着剤の量を判定し、規定量あれば、
そのプリント基板に対する接着剤の塗布は完了したもの
とし、次のプリント基板をローディングし、塗布動作を
開始する。規定量なければ、接着剤切れと判断し、動作
を停止する。オペレーターにより接着剤の補充を行ない
、その後の接着剤の塗布を続行する。If it is the final application, the NC device 6 generates a detection timing signal, the optical fiber photoelectric sensor 7 determines the amount of applied adhesive on the printed circuit board, and if it is the specified amount,
It is assumed that the application of the adhesive to the printed circuit board is completed, and the next printed circuit board is loaded and the application operation is started. If the specified amount is not reached, it is determined that the adhesive has run out and the operation is stopped. The operator replenishes the adhesive and continues applying subsequent adhesives.
本発明の派生として、光フアイバ光電センサ７の焦点の
位置が構造上、塗布位置よりずれてしまう場合は、最終
塗布終了後、そのずれ量を、Ｘ−Ｙテーブル４の移動だ
より補正したのち、検出するという方法も考えられる。As a derivative of the present invention, if the focal point of the optical fiber photoelectric sensor 7 deviates from the coating position due to its structure, after the final coating is completed, the amount of deviation is corrected by the movement of the X-Y table 4. , a method of detection is also considered.
また、本実施例では最終塗布ポイントのみを検出するよ
うにしているが、塗布動作毎に毎回チェックすることも
可能である。Further, in this embodiment, only the final coating point is detected, but it is also possible to check it every time the coating operation is performed.
発明の詳細
な説明したように、本発明によれば、容易に自動的に、
また確実に、接着剤残量を検出することができ、従来の
間接的な方法によって、接着剤残量の推定及びオペレー
ターによるチェックを行なった場合と比較して、不良Ｐ
板の発生が皆無になり、また定期的な目視チェックが不
要になることによシ、工数削減が図れるという利点を挙
げることができる。As described in the detailed description of the invention, according to the present invention, it is possible to easily and automatically
In addition, it is possible to reliably detect the remaining amount of adhesive, and compared to the conventional indirect method of estimating the remaining amount of adhesive and checking it by an operator, it is possible to detect defects.
This method has the advantage of eliminating the occurrence of plates and eliminating the need for periodic visual checks, resulting in a reduction in man-hours.
第１図は接着剤塗布ノズルの斜視図、第２図はチップ部
品実装機の斜視図、第３図は制御システムのブロック図
、第４図は接着剤塗布後のプリント基板を示す説明図、
第６図は残量検出方法の動作フロ・−チャートである。
１・・・・・・接着剤塗布ノズル、７・・・・・・光フ
アイバ光電センサ、８・・・・・・塗布済接着剤、１０
・・・・・・検出タイミング信号、１１・・・・・・接
着剤有無判定信号。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
１−↑１１炉」堡ミ千ノス゛ル
５−−−フ１９ンＬト石更
７−゛−尤プアイに尤電Ｕ’ｆ
第 ２ 図
第３図
第 ５ 図FIG. 1 is a perspective view of the adhesive application nozzle, FIG. 2 is a perspective view of the chip component mounting machine, FIG. 3 is a block diagram of the control system, and FIG. 4 is an explanatory diagram showing the printed circuit board after adhesive application.
FIG. 6 is an operational flowchart of the remaining amount detection method. 1... Adhesive application nozzle, 7... Optical fiber photoelectric sensor, 8... Applied adhesive, 10
...Detection timing signal, 11...Adhesive presence/absence determination signal. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 1 - ↑ 11 Furnace 5 - - Furnace 19 - Ishisara 7 - Figure 2 Figure 3 Figure 5
Claims (2)
と、前記プリント基板上の塗布済接着剤の量を検知する
検出工程と、塗布時に検出タイミング信号を発生し、前
記接着剤の量を判別する判別工程と、この判別工程によ
り接着剤の残量を検知する工程とからなることを特徴と
する接着剤残量検出方法。(1) An adhesive application step of applying adhesive to a printed circuit board, a detection step of detecting the amount of applied adhesive on the printed circuit board, and a detection timing signal generated at the time of application to detect the amount of adhesive. A method for detecting the remaining amount of adhesive, comprising a step of determining the remaining amount of adhesive, and a step of detecting the amount of remaining adhesive by the step of determining.
着剤の残量を検知する特許請求の範囲第１項記載の接着
剤残量検出方法。(2) The method for detecting the remaining amount of adhesive according to claim 1, wherein the remaining amount of adhesive is detected during the final application of adhesive to a printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60177132A JPH0611424B2 (en) | 1985-08-12 | 1985-08-12 | Adhesive application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60177132A JPH0611424B2 (en) | 1985-08-12 | 1985-08-12 | Adhesive application method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6238275A true JPS6238275A (en) | 1987-02-19 |
| JPH0611424B2 JPH0611424B2 (en) | 1994-02-16 |
Family
ID=16025735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60177132A Expired - Lifetime JPH0611424B2 (en) | 1985-08-12 | 1985-08-12 | Adhesive application method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611424B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0410490A (en) * | 1990-04-19 | 1992-01-14 | Sanyo Electric Co Ltd | Spreading device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57132576A (en) * | 1981-02-10 | 1982-08-16 | Matsushita Electric Ind Co Ltd | Application device of viscous fluid |
| JPS6014629A (en) * | 1983-07-04 | 1985-01-25 | Hitachi Metals Ltd | Earthquake-resistant and vibration-isolating mount member |
-
1985
- 1985-08-12 JP JP60177132A patent/JPH0611424B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57132576A (en) * | 1981-02-10 | 1982-08-16 | Matsushita Electric Ind Co Ltd | Application device of viscous fluid |
| JPS6014629A (en) * | 1983-07-04 | 1985-01-25 | Hitachi Metals Ltd | Earthquake-resistant and vibration-isolating mount member |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0410490A (en) * | 1990-04-19 | 1992-01-14 | Sanyo Electric Co Ltd | Spreading device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0611424B2 (en) | 1994-02-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |