JPS6237928U - - Google Patents
Info
- Publication number
- JPS6237928U JPS6237928U JP1985128842U JP12884285U JPS6237928U JP S6237928 U JPS6237928 U JP S6237928U JP 1985128842 U JP1985128842 U JP 1985128842U JP 12884285 U JP12884285 U JP 12884285U JP S6237928 U JPS6237928 U JP S6237928U
- Authority
- JP
- Japan
- Prior art keywords
- header
- semiconductor chip
- semiconductor device
- spacing member
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 125000006850 spacer group Chemical group 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 230000007613 environmental effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128842U JPH0519954Y2 (US07754267-20100713-C00021.png) | 1985-08-26 | 1985-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985128842U JPH0519954Y2 (US07754267-20100713-C00021.png) | 1985-08-26 | 1985-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6237928U true JPS6237928U (US07754267-20100713-C00021.png) | 1987-03-06 |
| JPH0519954Y2 JPH0519954Y2 (US07754267-20100713-C00021.png) | 1993-05-25 |
Family
ID=31024873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985128842U Expired - Lifetime JPH0519954Y2 (US07754267-20100713-C00021.png) | 1985-08-26 | 1985-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0519954Y2 (US07754267-20100713-C00021.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51123065A (en) * | 1975-04-21 | 1976-10-27 | Hitachi Ltd | Semiconductor device |
| JPS5989427A (ja) * | 1982-11-15 | 1984-05-23 | Sanken Electric Co Ltd | 半導体装置の製造方法 |
-
1985
- 1985-08-26 JP JP1985128842U patent/JPH0519954Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51123065A (en) * | 1975-04-21 | 1976-10-27 | Hitachi Ltd | Semiconductor device |
| JPS5989427A (ja) * | 1982-11-15 | 1984-05-23 | Sanken Electric Co Ltd | 半導体装置の製造方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016105508A (ja) * | 2016-02-29 | 2016-06-09 | 株式会社三社電機製作所 | 半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0519954Y2 (US07754267-20100713-C00021.png) | 1993-05-25 |
