JPS6236217Y2 - - Google Patents
Info
- Publication number
- JPS6236217Y2 JPS6236217Y2 JP6124382U JP6124382U JPS6236217Y2 JP S6236217 Y2 JPS6236217 Y2 JP S6236217Y2 JP 6124382 U JP6124382 U JP 6124382U JP 6124382 U JP6124382 U JP 6124382U JP S6236217 Y2 JPS6236217 Y2 JP S6236217Y2
- Authority
- JP
- Japan
- Prior art keywords
- bottom plate
- metal bottom
- metal
- airtight
- convex portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 45
- 239000011810 insulating material Substances 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000005476 soldering Methods 0.000 description 10
- 238000003780 insertion Methods 0.000 description 7
- 230000037431 insertion Effects 0.000 description 7
- 238000007598 dipping method Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6124382U JPS5967865U (ja) | 1982-04-28 | 1982-04-28 | 気密端子付き金属底板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6124382U JPS5967865U (ja) | 1982-04-28 | 1982-04-28 | 気密端子付き金属底板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5967865U JPS5967865U (ja) | 1984-05-08 |
JPS6236217Y2 true JPS6236217Y2 (US07122547-20061017-C00273.png) | 1987-09-14 |
Family
ID=30191458
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6124382U Granted JPS5967865U (ja) | 1982-04-28 | 1982-04-28 | 気密端子付き金属底板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5967865U (US07122547-20061017-C00273.png) |
-
1982
- 1982-04-28 JP JP6124382U patent/JPS5967865U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5967865U (ja) | 1984-05-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4654472A (en) | Electronic component package with multiconductive base forms for multichannel mounting | |
JP2724312B2 (ja) | Icチップ・キャリアパッケージ | |
US4594641A (en) | Decoupling capacitor and method of formation thereof | |
JPS60117609A (ja) | 減結合コンデンサー及びそれの製造方法 | |
JPS6236217Y2 (US07122547-20061017-C00273.png) | ||
US4630170A (en) | Decoupling capacitor and method of manufacture thereof | |
US4499519A (en) | Decoupling capacitor and method of manufacture thereof | |
US5132864A (en) | Printed circuit board | |
JPS6079770U (ja) | 積層型ハイブリツドic | |
US4494170A (en) | Decoupling capacitor and method of manufacture thereof | |
US4622619A (en) | Decoupling capacitor and method of manufacture thereof | |
JPH0832195A (ja) | 複合プリント基板の接続構造 | |
JPH0419788Y2 (US07122547-20061017-C00273.png) | ||
JPH04365396A (ja) | 高周波用面実装モジュール | |
JPS6032778Y2 (ja) | リ−ドレスチツプキヤリヤ | |
US4532572A (en) | Decoupling capacitor and method of manufacture thereof | |
JPS6011649Y2 (ja) | Lsiチツプ搭載用ケ−ス | |
JP2559104Y2 (ja) | 表面実装用コネクタ | |
JPH085561Y2 (ja) | 混成集積回路装置 | |
JP2840293B2 (ja) | Tab用テープ及びこれを用いた半導体装置 | |
JPS6134632Y2 (US07122547-20061017-C00273.png) | ||
JPS61199051U (US07122547-20061017-C00273.png) | ||
JPH0138918Y2 (US07122547-20061017-C00273.png) | ||
JPS5934128Y2 (ja) | 固体電解コンデンサ | |
JPH04111753U (ja) | 半導体素子収納用パツケージ |