JPS6235595Y2 - - Google Patents
Info
- Publication number
- JPS6235595Y2 JPS6235595Y2 JP1981163600U JP16360081U JPS6235595Y2 JP S6235595 Y2 JPS6235595 Y2 JP S6235595Y2 JP 1981163600 U JP1981163600 U JP 1981163600U JP 16360081 U JP16360081 U JP 16360081U JP S6235595 Y2 JPS6235595 Y2 JP S6235595Y2
- Authority
- JP
- Japan
- Prior art keywords
- welding
- push
- cap
- rod
- sleeve
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000003466 welding Methods 0.000 claims description 26
- 239000000428 dust Substances 0.000 claims description 5
- 239000002893 slag Substances 0.000 claims description 5
- 230000013011 mating Effects 0.000 claims 1
- 239000008188 pellet Substances 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 206010010904 Convulsion Diseases 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
Landscapes
- Die Bonding (AREA)
- Resistance Welding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981163600U JPS5871482U (ja) | 1981-10-30 | 1981-10-30 | 溶接装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1981163600U JPS5871482U (ja) | 1981-10-30 | 1981-10-30 | 溶接装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5871482U JPS5871482U (ja) | 1983-05-14 |
JPS6235595Y2 true JPS6235595Y2 (cs) | 1987-09-10 |
Family
ID=29955891
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1981163600U Granted JPS5871482U (ja) | 1981-10-30 | 1981-10-30 | 溶接装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5871482U (cs) |
-
1981
- 1981-10-30 JP JP1981163600U patent/JPS5871482U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5871482U (ja) | 1983-05-14 |
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