JPS6235101B2 - - Google Patents

Info

Publication number
JPS6235101B2
JPS6235101B2 JP56140614A JP14061481A JPS6235101B2 JP S6235101 B2 JPS6235101 B2 JP S6235101B2 JP 56140614 A JP56140614 A JP 56140614A JP 14061481 A JP14061481 A JP 14061481A JP S6235101 B2 JPS6235101 B2 JP S6235101B2
Authority
JP
Japan
Prior art keywords
pattern
resist
mask
film
mark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56140614A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5842233A (ja
Inventor
Hiroaki Morimoto
Yaichiro Watakabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56140614A priority Critical patent/JPS5842233A/ja
Publication of JPS5842233A publication Critical patent/JPS5842233A/ja
Publication of JPS6235101B2 publication Critical patent/JPS6235101B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Electron Beam Exposure (AREA)
JP56140614A 1981-09-07 1981-09-07 パタ−ンマスクの作製方法 Granted JPS5842233A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56140614A JPS5842233A (ja) 1981-09-07 1981-09-07 パタ−ンマスクの作製方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56140614A JPS5842233A (ja) 1981-09-07 1981-09-07 パタ−ンマスクの作製方法

Publications (2)

Publication Number Publication Date
JPS5842233A JPS5842233A (ja) 1983-03-11
JPS6235101B2 true JPS6235101B2 (enrdf_load_stackoverflow) 1987-07-30

Family

ID=15272797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56140614A Granted JPS5842233A (ja) 1981-09-07 1981-09-07 パタ−ンマスクの作製方法

Country Status (1)

Country Link
JP (1) JPS5842233A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5309632A (en) * 1988-03-28 1994-05-10 Hitachi Chemical Co., Ltd. Process for producing printed wiring board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5835538A (ja) * 1981-08-27 1983-03-02 Mitsubishi Electric Corp パタ−ンマスクの作製方法

Also Published As

Publication number Publication date
JPS5842233A (ja) 1983-03-11

Similar Documents

Publication Publication Date Title
JP2001022051A (ja) レチクル及び半導体装置の製造方法
US7560197B2 (en) Mask pattern data producing method, patterning method, reticle correcting method, reticle manufacturing method, and semiconductor apparatus manufacturing method
US6828071B2 (en) Method of aligning a wafer and masks
JPS5968928A (ja) 半導体装置の製造方法
US3673018A (en) Method of fabrication of photomasks
JPS6215854B2 (enrdf_load_stackoverflow)
JPS6235101B2 (enrdf_load_stackoverflow)
JPH0215612A (ja) 半導体装置の認識符号形成方法
JPH05142745A (ja) 位相シフトマスク及びマスクの製造方法
JPH0544169B2 (enrdf_load_stackoverflow)
JPH0451151A (ja) 位相シフトレチクルの製作方法
JPH0766113A (ja) レチクル及び位置合わせ用バーニアの形成方法
JPH05165195A (ja) ガラスマスク並びに該ガラスマスクを使用した半導体装置の製造方法
JPH0355815B2 (enrdf_load_stackoverflow)
KR100299520B1 (ko) 반도체 소자의 레티클 및 이를 이용한 마스크 공정
JPS5914550B2 (ja) 微細加工方法
JPH08213302A (ja) 微細加工方法及びこの加工方法に用いる微細加工用フォトマスク
JPH06186730A (ja) 電子ビーム露光によるフォトマスクの製造方法
JPH06295053A (ja) 位相シフトマスクの形成方法
JPH0216571B2 (enrdf_load_stackoverflow)
JPS5835537A (ja) パタ−ンマスクの作製方法
JPS62271427A (ja) マスク位置合わせ方法
JPS6028230A (ja) 半導体装置の製造方法
JPS63196029A (ja) 半導体チツプにマ−クを形成する方法
JPS61117832A (ja) 半導体装置の製造方法