JPS6234153B2 - - Google Patents

Info

Publication number
JPS6234153B2
JPS6234153B2 JP56134566A JP13456681A JPS6234153B2 JP S6234153 B2 JPS6234153 B2 JP S6234153B2 JP 56134566 A JP56134566 A JP 56134566A JP 13456681 A JP13456681 A JP 13456681A JP S6234153 B2 JPS6234153 B2 JP S6234153B2
Authority
JP
Japan
Prior art keywords
electrode
pair
electrodes
flat
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56134566A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5834951A (ja
Inventor
Yasuo Matsumura
Juji Tomita
Shigeshizu Fujita
Shoji Kumano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP56134566A priority Critical patent/JPS5834951A/ja
Publication of JPS5834951A publication Critical patent/JPS5834951A/ja
Publication of JPS6234153B2 publication Critical patent/JPS6234153B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)
JP56134566A 1981-08-26 1981-08-26 ダブルヒ−トシンク形半導体装置の製造方法 Granted JPS5834951A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56134566A JPS5834951A (ja) 1981-08-26 1981-08-26 ダブルヒ−トシンク形半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56134566A JPS5834951A (ja) 1981-08-26 1981-08-26 ダブルヒ−トシンク形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5834951A JPS5834951A (ja) 1983-03-01
JPS6234153B2 true JPS6234153B2 (ref) 1987-07-24

Family

ID=15131327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56134566A Granted JPS5834951A (ja) 1981-08-26 1981-08-26 ダブルヒ−トシンク形半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS5834951A (ref)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE246840T1 (de) * 1994-06-10 2003-08-15 Avx Corp Vorformen für die herstellung von oberflächenmontierbaren festelektrolytkondensatoren und herstellungsverfahren der genannten kondensatoren
EP1742265B1 (en) * 2000-04-19 2013-08-07 Denso Corporation Coolant cooled type semiconductor device
JP4479121B2 (ja) * 2001-04-25 2010-06-09 株式会社デンソー 半導体装置の製造方法
JP5141076B2 (ja) * 2006-06-05 2013-02-13 株式会社デンソー 半導体装置
ITMI20112300A1 (it) * 2011-12-19 2013-06-20 St Microelectronics Srl Realizzazione di dispositivi elettronici di tipo dsc tramite inserto distanziatore

Also Published As

Publication number Publication date
JPS5834951A (ja) 1983-03-01

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