JPS6231818B2 - - Google Patents
Info
- Publication number
- JPS6231818B2 JPS6231818B2 JP56000041A JP4181A JPS6231818B2 JP S6231818 B2 JPS6231818 B2 JP S6231818B2 JP 56000041 A JP56000041 A JP 56000041A JP 4181 A JP4181 A JP 4181A JP S6231818 B2 JPS6231818 B2 JP S6231818B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bonding
- lead frame
- post
- television
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000008188 pellet Substances 0.000 claims description 13
- 238000001514 detection method Methods 0.000 description 9
- 239000011295 pitch Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56000041A JPS57113240A (en) | 1981-01-05 | 1981-01-05 | Wire bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56000041A JPS57113240A (en) | 1981-01-05 | 1981-01-05 | Wire bonding apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57113240A JPS57113240A (en) | 1982-07-14 |
JPS6231818B2 true JPS6231818B2 (US06252093-20010626-C00008.png) | 1987-07-10 |
Family
ID=11463220
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56000041A Granted JPS57113240A (en) | 1981-01-05 | 1981-01-05 | Wire bonding apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57113240A (US06252093-20010626-C00008.png) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0455079U (US06252093-20010626-C00008.png) * | 1990-09-17 | 1992-05-12 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5022574A (US06252093-20010626-C00008.png) * | 1973-06-26 | 1975-03-11 | ||
JPS5080763A (US06252093-20010626-C00008.png) * | 1973-11-14 | 1975-07-01 | ||
JPS5160410A (ja) * | 1974-11-25 | 1976-05-26 | Hitachi Ltd | Kotonaruichinisonzaisurufukusuno zahyono gentenitsuchiho |
JPS5174575A (US06252093-20010626-C00008.png) * | 1974-12-25 | 1976-06-28 | Shinkawa Seisakusho Kk | |
JPS54121672A (en) * | 1978-03-14 | 1979-09-20 | Nichiden Kikai Kk | Wire bonding device |
-
1981
- 1981-01-05 JP JP56000041A patent/JPS57113240A/ja active Granted
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5022574A (US06252093-20010626-C00008.png) * | 1973-06-26 | 1975-03-11 | ||
JPS5080763A (US06252093-20010626-C00008.png) * | 1973-11-14 | 1975-07-01 | ||
JPS5160410A (ja) * | 1974-11-25 | 1976-05-26 | Hitachi Ltd | Kotonaruichinisonzaisurufukusuno zahyono gentenitsuchiho |
JPS5174575A (US06252093-20010626-C00008.png) * | 1974-12-25 | 1976-06-28 | Shinkawa Seisakusho Kk | |
JPS54121672A (en) * | 1978-03-14 | 1979-09-20 | Nichiden Kikai Kk | Wire bonding device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0455079U (US06252093-20010626-C00008.png) * | 1990-09-17 | 1992-05-12 |
Also Published As
Publication number | Publication date |
---|---|
JPS57113240A (en) | 1982-07-14 |
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