JPS62298138A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS62298138A
JPS62298138A JP14012286A JP14012286A JPS62298138A JP S62298138 A JPS62298138 A JP S62298138A JP 14012286 A JP14012286 A JP 14012286A JP 14012286 A JP14012286 A JP 14012286A JP S62298138 A JPS62298138 A JP S62298138A
Authority
JP
Japan
Prior art keywords
wafer
scribing
region
manufacture
dicing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14012286A
Other languages
Japanese (ja)
Inventor
Satoshi Suzaki
Original Assignee
Hitachi Tokyo Electron Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electron Co Ltd, Hitachi Ltd filed Critical Hitachi Tokyo Electron Co Ltd
Priority to JP14012286A priority Critical patent/JPS62298138A/en
Publication of JPS62298138A publication Critical patent/JPS62298138A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To separate easily each unit block, by coating a solder layer on the back surface of a wafer except back surface part in the vicinity of a scribing region, and scribing a wafer to manufacture a pallet.
CONSTITUTION: A metal layer 2 providing solderbility is coated and formed on the back surface of a wafer 1 except the back surface part 5 in the vicinity of a scribing region. Recesses 6 are formed by half-dicing of the wafer in the scribe region. The wafer 1 is easily divided along the recesses 6 by breaking the wafer 1. A pellet 7 obtained after the scribing process mentioned above is joined in the ordinary manner to a pellet retaining substrate by soldering. As the result, each unit block is easily separated only by breaking after half- dicing of a wafer.
COPYRIGHT: (C)1987,JPO&Japio
JP14012286A 1986-06-18 1986-06-18 Manufacture of semiconductor device Pending JPS62298138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14012286A JPS62298138A (en) 1986-06-18 1986-06-18 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14012286A JPS62298138A (en) 1986-06-18 1986-06-18 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS62298138A true JPS62298138A (en) 1987-12-25

Family

ID=15261411

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14012286A Pending JPS62298138A (en) 1986-06-18 1986-06-18 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS62298138A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5786266A (en) * 1994-04-12 1998-07-28 Lsi Logic Corporation Multi cut wafer saw process

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5786266A (en) * 1994-04-12 1998-07-28 Lsi Logic Corporation Multi cut wafer saw process

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