JPS62295029A - Liquid crystal display element - Google Patents
Liquid crystal display elementInfo
- Publication number
- JPS62295029A JPS62295029A JP13805286A JP13805286A JPS62295029A JP S62295029 A JPS62295029 A JP S62295029A JP 13805286 A JP13805286 A JP 13805286A JP 13805286 A JP13805286 A JP 13805286A JP S62295029 A JPS62295029 A JP S62295029A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid crystal
- resin
- crystal display
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004973 liquid crystal related substance Substances 0.000 title claims description 13
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 30
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 239000000945 filler Substances 0.000 claims abstract description 12
- 229920003986 novolac Polymers 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 239000002245 particle Substances 0.000 claims description 9
- -1 imidazole compound Chemical class 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 12
- 239000000377 silicon dioxide Substances 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052593 corundum Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract 1
- 239000000565 sealant Substances 0.000 description 12
- 239000000758 substrate Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 229910002012 Aerosil® Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Liquid Crystal (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
本発明は液晶表示素子１こ係り、特に対向配置された２
枚の電極板のギャップが５〜６μｍと狭く、更５こ大型
である液晶表示素子の電極板のシール（こ用いるシール
剤組成に関する。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a liquid crystal display element 1, and in particular, to a liquid crystal display element 1 which is arranged opposite to each other.
The gap between the electrode plates is as narrow as 5 to 6 μm, and the gap between the electrode plates is as narrow as 5 to 6 μm, and the electrode plates of the liquid crystal display element are even larger.
液晶表示素子ｆこ用いられているシール剤の組成は、主
剤となるエポキシ系樹脂、硬化剤、充填剤、溶剤、シラ
ンカップリング剤、スペーサ材ｆこ大別される。シール
剤の硬度は主剤及び硬化剤に左右され、またギャップの
制御は主剤及び硬化剤の粘度、更にフィラーの粒径に左
右される。The composition of the sealant used in the liquid crystal display element is roughly divided into the following: epoxy resin as the main ingredient, curing agent, filler, solvent, silane coupling agent, and spacer material. The hardness of the sealant depends on the base material and hardening agent, and the control of the gap depends on the viscosity of the base material and hardening agent, as well as the particle size of the filler.
液晶表示素子は、小型のものは一度ｆこ大きな基板に多
数個の電極を形成し、上下基板を組立た後に１個１個の
素子に分断するマルチ加工プロセスが取られている。大
型の液晶表示素子であっても、基板全面を１個の素子に
用いることは少なく、周辺を素子組立硬化後に切断して
取り除くプロセスが取られる。基板を切断する場合には
、素子が大型であればより大きな剥離の力がシール部ｌ
こ加わる結果となり、更にその力は衝撃的に加わる。For small liquid crystal display elements, a multi-processing process is used in which a large number of electrodes are formed on a substrate as large as f, and then the upper and lower substrates are assembled and then cut into individual elements. Even in the case of large-sized liquid crystal display elements, the entire surface of the substrate is rarely used for one element, and a process is used in which the periphery is cut and removed after the element is assembled and cured. When cutting the substrate, if the device is large, a greater peeling force will be applied to the seal portion l.
As a result, the force is added even more shockingly.
ところで、従来のシール剤組成は、例えば特公昭５９−
２４４０３号公報に示すよう１こ、基本組成として三核
体以上のフェノールノボラック樹脂を硬化剤として用い
た系となっている。By the way, the conventional sealant composition is, for example,
As shown in Japanese Patent No. 24403, this is a system in which a trinuclear or higher phenol novolac resin is used as a curing agent as a basic composition.
上記従来例のシール剤におけるフェノール樹脂系は硬化
温度が高く、更に硬化後の硬度が高い傾向にある。この
ため、電極板のギャップが５〜６μｍと狭く、更に大型
の液晶表示素子は、基板切断時にシール部１こクラック
が入り、またシール部剥離が生じ、またギャップ不良が
生じるなどの問題点があった。The phenolic resin-based sealants in the conventional sealants have a high curing temperature and also tend to have high hardness after curing. For this reason, the gap between the electrode plates is as narrow as 5 to 6 μm, and even larger liquid crystal display elements have problems such as cracks in one seal part when cutting the substrate, peeling of the seal part, and defective gaps. there were.
本発明の目的は、耐湿性などの信頼性が高く、しかも耐
衝撃性ｌこ優れ、更に５〜６μｍのギャップ形成が容易
なシール剤を用いた液晶表示素子を提供することにある
。An object of the present invention is to provide a liquid crystal display element using a sealant that has high reliability such as moisture resistance, excellent impact resistance, and can easily form a gap of 5 to 6 μm.
上記問題点は、主剤としてエポキシ樹脂を用い、フェノ
ールノボラック樹脂を硬化剤とし、可とう性エポキシ樹
脂を全エポキシ樹脂の１０ｗｔ％以上含み、更にＡ１２
０１、ＳｔＯ，で表わされるフィラーを平均粒径が０．
０５μｍ以下で、接着剤全体の２０ｖｏ１％以下含み、
更に硬化促進剤としてイミダゾール化合物を１．０重量
部（主剤エポキシ樹脂を１００とした時の重量）以下添
加したシール剤でシールすることにより解決される。The above problem is solved by using epoxy resin as the main resin, using phenol novolac resin as a hardening agent, containing 10 wt% or more of flexible epoxy resin based on the total epoxy resin, and using A12
01, StO, with an average particle size of 0.
05μm or less, containing 20vo1% or less of the entire adhesive,
Furthermore, the problem can be solved by sealing with a sealant containing 1.0 parts by weight or less (weight based on the base epoxy resin as 100) of an imidazole compound as a curing accelerator.
主剤のエポキシ樹脂に可とう性エポキシ樹脂を添加する
ことにより、耐衝撃性が向上する。更ｌこ人ｚ、ｏ、
、ｓｔｏ、で表わされるフィラーを少なくとも０．０５
μ輿以下の平均粒径で、接着剤全体の２０ ｖｏｌチ以
下添加すること−こより、５〜６μｍのギャップを良好
ｌこ形成することができる。更に硬化促進剤としてイミ
ダゾール化合物を１．０重量部以下添加することにより
、硬化をできるたけ低温で行うことができる。By adding a flexible epoxy resin to the base epoxy resin, impact resistance is improved. More people z, o,
, sto, at least 0.05
By adding 20 vol or less of the entire adhesive with an average particle diameter of less than 100 μm, a gap of 5 to 6 μm can be formed satisfactorily. Further, by adding 1.0 parts by weight or less of an imidazole compound as a curing accelerator, curing can be carried out at as low a temperature as possible.
主剤としてノボラック型のエポキシ樹脂あるいはビスフ
ェノールＡ型のエポキシ樹脂を用い、可とう性エポキシ
樹脂として例えば側鎖型エポキシ樹脂を用い、両者を混
合する。一般式を下記に示す０
式中、几、Ｒ′、几”はアルキル基ＣｎＨ２５＋１又は
官能基ＯＨを示す。襲、＾は繰り返しの数を示す。A novolak type epoxy resin or a bisphenol A type epoxy resin is used as the main resin, and a side chain type epoxy resin, for example, is used as the flexible epoxy resin, and both are mixed. The general formula is shown below. In the formula, 几, R', 几" represent an alkyl group CnH25+1 or a functional group OH.
実験１：可とう性エポキシ樹脂の添加量による実験
ビスフェノールＡ型樹脂（エポキシ当量的１ｓｓ）を主
剤とし、ノボラック屋フェノール樹脂を硬化剤とし、前
記側鎖型エポキシ樹脂の添加量を全エポキシ樹脂ｌこ対
する割合を種々変え、更にシリカ系充填剤を１０ ｖｏ
ｌ ％加えた系を作り、更ｌこ硬化促進剤としてイミダ
ゾール塩を加えた。これをシール剤として表示面［２０
０ｃｄ以上の素子Ｉこ実装し、素子切断工程を通したと
ころ、次のような結果が得られた。ここで、シール剤の
硬化条件は１８０℃、２時間である。Experiment 1: Experiment with the amount of flexible epoxy resin added Bisphenol A type resin (epoxy equivalent 1ss) was used as the main agent, Novolac phenol resin was used as the curing agent, and the amount of side chain type epoxy resin added was changed to the total amount of epoxy resin. The ratio of silica-based filler was varied, and 10 vo of silica-based filler was added.
A system was prepared in which 1% was added, and an imidazole salt was added as a hardening accelerator. Use this as a sealant on the display surface [20
When I mounted an element of 0 cd or more and passed the element cutting process, the following results were obtained. Here, the curing conditions for the sealant were 180°C and 2 hours.
このように、主剤のエポキシ樹脂に可とう性エポキシ樹
脂を全エポキシ樹脂の１９ｗｔ４以上添加すると、耐衝
撃性が向上し、シール部のはがれ率が著しく低下する。As described above, when a flexible epoxy resin is added to the base epoxy resin at 19wt4 or more of the total epoxy resin, the impact resistance is improved and the peeling rate of the seal portion is significantly reduced.
実験２：フィラーの平均粒径及び添加量による実験
前記実験１で用いたシール剤におけるフィラーの平均粒
径及び添加量を変え、ギャップ形成の実験を行ったとこ
ろ、次のような結果が得られた。Experiment 2: Experiment using the average particle size and amount of filler added When we conducted a gap formation experiment by changing the average particle size and amount of filler added in the sealant used in Experiment 1, we obtained the following results. Ta.
フィラーとして、シリカ粉（Ｓｉｎ、）またはアルミを
粉（人４０ｓ）を用いた。シリカ粉またはアルミナ粉を
用いた理由は、耐湿同上剤として添加するノランカップ
リング剤の効果を高めるためである。As a filler, silica powder (Sin) or aluminum powder (40s) was used. The reason for using silica powder or alumina powder is to enhance the effect of the Nolan coupling agent added as a moisture-resistant agent.
表中、上段は５μ肌のスペーサを用い、下段は１０μ汎
のスペーサを用いた場合を示す。またＯはギヤツブ形成
良、Δは部分的Ｉこゼヤツプがでない。In the table, the upper row shows the case where a 5μ spacer is used, and the lower row shows the case where a 10μ spacer is used. Also, O indicates that the gear is well formed, and Δ indicates that there is no partial I coupling.
１ｋｇメー以上の大きな荷重によりでる。Ｘはギャップ
形成できないを示す。This occurs due to a large load of 1 kg or more. X indicates that no gap can be formed.
このようＩこ、５μ風のギャップを形成するため憂こは
、０．０５μｍ以下の平均粒径で、添加ｔ１０ ｖｏｌ
チ以下か、０．０１μｍの平均粒径で２ Ｑ ｖｏｌ
％以下の添加量にする必要がある。In order to form a gap of 5 μm in this way, it is necessary to add t10 vol with an average particle size of 0.05 μm or less.
2 Q vol with an average particle size of 0.01 μm or less
% or less.
実験３二具体的な商品名及び添加量
主剤のエポキシ樹脂として、油化シェルエポキシ製のエ
ピコー）１００１を６０１１旭日電化製のアデカレジン
ＥＰ−４０００を４０．９、ノボラック型フェノールと
して、日立化成製のヒタノールＨＰ−６０７Ｎを２８．
７１、溶剤として、プチルセａソルプを５０１！、フィ
ラーとして、日本ア工ａジル製のアエロジル＃１３０を
１３．８１？、パイコツスキー製のパイコフスキーｒ−
アルミフＣＲ−１２５を２５１．硬化促進剤として、四
国ファインケミカル製のイミダゾール２Ｅ４ＭＺ−ＣＮ
を０．５重量部（主剤エポキシ樹脂を１００とした時の
重量）それぞれ添加した。この結果、シール部はがれが
生じなく、５〜６μｍのギャップを形成することができ
た。Experiment 32 Specific product name and addition amount As the main epoxy resin, Epicor 1001 manufactured by Yuka Shell Epoxy was used as 6011, Adekal Resin EP-4000 manufactured by Asahi Nichidenka was used as 40.9, and as novolac type phenol, 40.9% of Adekal resin EP-4000 manufactured by Hitachi Chemical was used as the novolak type phenol. Hytanol HP-607N at 28.
71. As a solvent, use Puchircea Solp 501! As a filler, Aerosil #130 manufactured by Japan Aerosil was used at 13.81? , Paikovsky r- made by Paikovsky
Aluminum CR-125 at 251. As a curing accelerator, Imidazole 2E4MZ-CN manufactured by Shikoku Fine Chemicals was used.
0.5 parts by weight (weight based on the base epoxy resin as 100) were added respectively. As a result, a gap of 5 to 6 μm could be formed without peeling of the seal portion.
前記硬化促進剤の種類及び添加量によってシール剤の硬
化条件を種々変えることができるが、ここでは１５０℃
、６０分硬化の組成とし、更に各種有機溶剤−こ対し溶
解度の高い２Ｅ４ＭＺ−ＣＮを選んだ。硬化温度に対す
る性質としては２００℃を超ると、シール剤部ｌこクラ
ンクが発生したり、耐衝撃性が落ちる結果となった。The curing conditions of the sealant can be varied depending on the type and amount of the curing accelerator, but here the curing conditions are 150°C.
2E4MZ-CN, which has a composition that can be cured in 60 minutes and has high solubility in various organic solvents, was selected. As for the properties with respect to curing temperature, when the temperature exceeds 200°C, cracking occurs in the sealant part and the impact resistance decreases.
以上の説明から明らかなように、主剤としてエポキシ樹
脂を用い、フェノールノボラック樹脂を硬化剤とし、可
とう性エポキシ樹脂を全エポキシ樹脂の１０ｗｔ慢以上
含み、更にＡＡ！ｔＯ，，８ｉ０．で表わされるフィラ
ーを平均粒径が０．０５μｍ以下で、シール剤全体の２
０ＶＯ１％以下含み、更に硬化促進剤としてイミダゾー
ル化合物を１．０重量部以下添加してシール剤を構成し
てなるので、耐湿性の信頼性が高く、シかも耐衝撃性に
優れ、更に５〜６μｍのギャップ形成が容易な液晶表示
素子が得られる。As is clear from the above explanation, an epoxy resin is used as the main resin, a phenol novolak resin is used as a curing agent, a flexible epoxy resin is contained in an amount of 10 wt or more of the total epoxy resin, and AA! tO,,8i0. The filler represented by the formula has an average particle size of 0.05 μm or less and is
Since the sealing compound contains 0 VO 1% or less and furthermore contains 1.0 parts by weight or less of an imidazole compound as a curing accelerator, it has high reliability in moisture resistance, excellent scratch resistance, and excellent impact resistance. A liquid crystal display element in which a gap of 6 μm can be easily formed can be obtained.
Claims (1)
に液晶を充填してなる液晶表示素子において、主剤とし
てエポキシ樹脂を用い、フェノールノボラック樹脂を硬
化剤とし、可とう性エポキシ樹脂を全エポキシ樹脂の１
０ｗｔ％以上含み、更にＡｌ＿２Ｏ＿３、ＳｉＯ＿２で
表わされるフィラーを平均粒径が０．０５μｍ以下で、
シール剤全体の２０ｖｏｌ％以下含み、更に硬化促進剤
としてイミダゾール化合物を１．０重量部（主剤エポキ
シ樹脂を１００とした時の重量）以下添加したシール剤
でシールしたことを特徴とする液晶表示素子。In a liquid crystal display element in which liquid crystal is filled between one or two electrode plates arranged opposite to each other and sealed at the periphery, an epoxy resin is used as the main material, a phenol novolak resin is used as a hardening agent, and a flexible epoxy resin is used as a total epoxy resin. resin 1
Contains 0 wt% or more, and further contains fillers represented by Al_2O_3 and SiO_2 with an average particle size of 0.05 μm or less,
A liquid crystal display element sealed with a sealing agent containing 20 vol% or less of the entire sealing agent and further adding 1.0 parts by weight or less of an imidazole compound as a curing accelerator (weight when the base epoxy resin is 100). .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13805286A JPS62295029A (en) | 1986-06-16 | 1986-06-16 | Liquid crystal display element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13805286A JPS62295029A (en) | 1986-06-16 | 1986-06-16 | Liquid crystal display element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62295029A true JPS62295029A (en) | 1987-12-22 |
Family
ID=15212862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13805286A Pending JPS62295029A (en) | 1986-06-16 | 1986-06-16 | Liquid crystal display element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62295029A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996031572A1 (en) * | 1995-04-03 | 1996-10-10 | Institut für Neue Materialien Gemeinnützige GmbH | Composite adhesive for optical and opto-electronic applications |
| WO2000079582A1 (en) * | 1999-06-17 | 2000-12-28 | Loctite Corporation | Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| US7012120B2 (en) | 2000-03-31 | 2006-03-14 | Henkel Corporation | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
| JP2010122612A (en) * | 2008-11-21 | 2010-06-03 | Sekisui Chem Co Ltd | Sealing agent for liquid crystal display element, vertically conductive material, and liquid crystal display element |
| US8053587B2 (en) | 2000-03-31 | 2011-11-08 | Henkel Corporation | Reworkable thermosetting resin composition |
| JP2013101398A (en) * | 2013-02-20 | 2013-05-23 | Sekisui Chem Co Ltd | Sealing agent for liquid crystal display element, vertically conducting material, and liquid crystal display element |
-
1986
- 1986-06-16 JP JP13805286A patent/JPS62295029A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996031572A1 (en) * | 1995-04-03 | 1996-10-10 | Institut für Neue Materialien Gemeinnützige GmbH | Composite adhesive for optical and opto-electronic applications |
| WO2000079582A1 (en) * | 1999-06-17 | 2000-12-28 | Loctite Corporation | Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| JP2003502484A (en) * | 1999-06-17 | 2003-01-21 | ヘンケル ロックタイト コーポレイション | Controllable degradable compositions of heteroatom carbocyclic or epoxy resins and curing agents |
| JP4718070B2 (en) * | 1999-06-17 | 2011-07-06 | ヘンケル コーポレイション | Underfill sealing and repair method |
| US7012120B2 (en) | 2000-03-31 | 2006-03-14 | Henkel Corporation | Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent |
| US8053587B2 (en) | 2000-03-31 | 2011-11-08 | Henkel Corporation | Reworkable thermosetting resin composition |
| JP2010122612A (en) * | 2008-11-21 | 2010-06-03 | Sekisui Chem Co Ltd | Sealing agent for liquid crystal display element, vertically conductive material, and liquid crystal display element |
| JP2013101398A (en) * | 2013-02-20 | 2013-05-23 | Sekisui Chem Co Ltd | Sealing agent for liquid crystal display element, vertically conducting material, and liquid crystal display element |
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