JPS6229197A - Mounting of chip-shaped electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting a chip-shaped electronic component, such as a chip capacitor, on a printed circuit board by providing leads on the chip-shaped electronic component.

[Conventional technology]

Conventionally, in order to fix a chip-shaped electronic component to a printed circuit of a printed circuit board, the chip-shaped electronic component was attached to the printed circuit by
After being temporarily fixed with an adhesive such as an epoxy resin in a state where they are placed in contact with each other, soldering is carried out by immersion soldering or furnace soldering.

However, temporary fixation with resin has problems such as restrictions on working time based on the pot life of the resin, poor connection due to resin adhering to the electrodes, and drying time of the resin. A technique such as that shown in JP-A No. 57-42191 has been proposed.

[Problem that the invention seeks to solve]

With such a structure, although the manufacturing process is simple, there is a risk that the contact between the cap portion and the electrode portion of the electronic component may be insufficient.

The present invention is concerned with improvements to such conventional devices, and provides a chip-shaped electronic component that can be attached with high reliability by making perfect contact between the chip-shaped electronic component and the cap-shaped terminal. The purpose of this invention is to provide a method for attaching the device.

[Means for solving problems]

As a means for solving the problems, the present invention provides a cap-like terminal comprising a cap part into which the electrode part is fitted into an electrode part of a chip-shaped electronic component and a lead part inserted into a mounting hole of a board. are fitted and held together via cream solder to form a leaded electronic component, and then cream solder is inserted between the cap-shaped terminal of the leaded electronic component and the pattern section of the substrate. 1; The lead part is inserted into the mounting hole of the board described in 1 and fixed, and then the cream solder connection part in the electrode part and pattern part is heated and soldered. A method for mounting a chip-shaped electronic component, and a cap-shaped terminal in which a lead part inserted into a mounting hole of a board and a cap part for fitting and holding a chip-shaped electronic component are formed continuously and alternately at a constant pitch in the longitudinal direction. 2 consecutive
A chip-shaped electronic component is held between the two leads in parallel, and its electrode part is fitted to the cap part via cream solder to form an electronic component chain. From an electronic component series, leaded electronic components formed by sandwiching one chip-shaped electronic component between a pair of cap-shaped terminals are separated one by one, and the leaded electronic components are separated.
While connecting the cap-shaped terminal and the pattern portion of the substrate through cream solder, inserting and fixing the lead portion into the mounting hole of the substrate, and then connecting the electrode portion and the pattern portion with cream solder. It is an object of the present invention to provide a method for mounting a chip-shaped electronic component, which is characterized in that soldering is performed by heating the parts.

〔Example〕

Embodiments of the present invention will be described using the drawings.

In FIG. 1, FIG. 2, FIG. 3, and FIG. 4, a chip-shaped electronic component 1 consists of a main body 2 and electrode portions 3 provided at both ends thereof. The cap-shaped terminal 4 includes a curved cap portion 5 and a lead portion 6.

To explain the process of manufacturing such an electronic component and mounting it on the printed circuit board 7, first, a chip-shaped electronic component 1 with electrode portions 3 provided at both ends of the main body 2 is manufactured, and a cap portion 5 is attached in advance.
A cream solder 7 is interposed between the four parts of the cap part 5 of the cap-shaped terminal 4 formed by bending the cap-shaped terminal 4 to fit and hold the electrode part 3, thereby forming a leaded electronic component 9.

When making the cap-shaped terminal 4, it is preferable to make the curved inner width of the cap part 5 smaller than the width of the electrode part 3 so that the electrode part 3 is firmly held by elastic force.

In order to mount the electronic component 9 with leads formed in this manner onto the printed circuit board 7, cream solder 12 is placed on the pattern section 11 around the mounting hole 10 provided in the printed circuit board 7, and the lead section 6 The pattern part 11 and the cap part 5 are connected through the cream solder 12 by pushing the cap part 5 into the mounting hole 10. Cream solder 12 is attached to cap portion 5
The above connection can be made by coating the electrode part 3 and the pattern part 11 electrically. (all of which are referred to as conductive parts) and the pattern part 11 may be connected via cream solder 12. part, a part perpendicular to the lead part 6 of the cap part 5,
Any part of the lead portion 6 may be used.

The tip of the lead portion 6 is tapered as shown in FIG. With respect to the diameter of the mounting hole 10, the width B at the tip of the tapered part of the lead part 6 and the width B2 at the end are Bl<D SZ>O. Therefore, the lead part 6 can be attached to the mounting hole 10. When inserting it, at first the tip enters freely without touching the mounting hole IO, but the terminal end of a part of the taper touches the mounting hole 10, and if it is pushed in further, it deforms a part of the edge of the mounting hole 10. The lead portion 6 is inserted and firmly fixed by the edge of the mounting hole 10, and the leaded electronic component 9 is fixed to the printed circuit board 7.

If the lead part 6 is thin, the lead part 6 itself may be elastically deformed as shown in FIG. 5 without being inserted into the mounting hole 10, and the lead part 6 may be fixed in the mounting hole 10 by its elastic force.

After temporarily fixing the electronic component 9 with leads to the printed circuit board in this way, soldering is carried out by heating the whole part or the cream solder parts 8 and 12 using a furnace, hot air blowing, infrared rays, laser, light beam, etc. The cream solder 8 between the cap terminal 3 and the cap terminal, and the cream solder 12 between the cap terminal and the pattern section 11 are firmly soldered to ensure sufficient electrical and mechanical connection.

In this way, the chip-shaped electronic component 1 with the lead portion securely attached can be reliably attached to the printed circuit board, and the attachment can be performed with high reliability both electrically and mechanically.

Note that in order to fix the lead portion 6 to the mounting hole 10 of the printed circuit board 7, a conventional method of bending the lead portion 6 protruding from the back side of the printed circuit board 7 may be used.

6 to 8 show another embodiment, in which lead portions 6 are made to protrude in a direction perpendicular to the surface of a chip-shaped electronic component 1.

In the embodiment shown in FIGS. 1 to 3, the width of the completed leaded electronic component 9 is narrow, and a large number of leaded electronic components 9 can be arranged in a narrow area of the printed circuit board 7, but the brightness is high. In the embodiments shown in FIGS. 6 to 8, the width is increased, but the height can be reduced.

Next, an example of the process of manufacturing the chip-shaped electronic component 1 and mounting it on the printed circuit board 7 as shown in FIGS. 6 to 8 will be explained. First, the manufacturing process will be explained.

In FIGS. 9 and 1O, two elongated terminal materials 13, which are materials for the cap-shaped terminals 4, are arranged parallel to each other with their flat surfaces facing each other and are continuously fed in the direction of the arrow 14. The terminal material 13 is made of steel or steel plated with solder or tin.

The cap forming station (A) is provided with a receiving mold 15 on the outside and a pressing mold 17 held by a guide 16 and slidingly protruding on the inside. is deformed to form a cap portion 5, and a cap-shaped terminal chain 30 is formed.

Next, at the cream solder application station (C),
Cream solder 19 is supplied and applied to the inner recessed part of the cap part 5 using a cream solder supplying machine.

Next, in the chip-shaped electronic component fitting station (E), the chip-shaped electronic component 1 whose electrode portion 3 has been coated with cream solder 21 in advance by the cream solder feeder 20 is placed in the recess of the cap portion 5 as shown in (D). The cap portion 5 and the electrode portion 3 are fitted together and connected via the cream solder 19, 21 or partially directly.

Cream solder 19 and 21 may be applied only to either one.

In this way, as shown in (F), an electronic component chain is formed in which a large number of chip-shaped electronic components 1 are held in parallel at equal intervals by being fitted and fixed in the recessed portion of the cap portion 5.

If the electronic component chain manufacturing machine and the electronic component insertion machine are separate, and the manufacturing process and the insertion process are not continuous, the manufactured electronic component chain is cut into appropriate lengths and stored.

If the manufacturing process and the insertion process are continuous, such as when the manufacturing device and the insertion device are integrated, the next process is started without cutting.

Next, the cutting/insertion process will be explained.

In FIGS. 9 and 10, as shown in (G), a series of electronic components holding chip-shaped electronic components 1 is supplied continuously from the previous manufacturing process or transported from a storage location.

At the cutting station (H), a flat cuffer 22 is installed on the inside.
A chevron-shaped cutter 23 is fixedly provided, and a valley-shaped cutter 24 having a shape inserted between the flat cutter 22 and the chevron-shaped cutter 23 is reciprocated in a direction perpendicular to the terminal material 13 on the outside. It is maintained as such.

Next, the valley cutter 24 moves inward as shown in (1) and cuts the terminal material 1 between the flat cutter 22 and the angle cutter 23.
3, the terminal material 13 protruding above the chip-shaped electronic component 1 is cut at a right angle for the part past a part of the cutter, and the terminal material 13 for the part before reaching the cutter part is cut at right angles.
By cutting the tip into a tapered shape, an electronic component 9 with a lead as shown in (J) is obtained. This is of the same shape as that shown in FIGS. 6-7.

The cutting station (H) is equipped with a fixed piece 25 and a movable piece 26 that clamp the lead part 6, and before the cutting operation, the movable piece 26 moves as shown by (+) to clamp the lead part 6. . After the lead portion 6 is clamped in this manner, cutting is performed, and the leaded electronic component 9 moves downward with the lead portion 6 being clamped.

In the insertion station run (K), the lead part 6 is held and lowered by the fixed piece 25 and the movable piece 26 until the tip of the lead part 6 is inserted into the mounting hole 10 of the printed circuit board 7, and then the leaded electronic component 9 is inserted from above. Apply the pusher 27 to push it down, remove the fixed piece 25 and the movable piece 26, and push down the leaded electronic component 9 with the pusher 27. At this time, cream solder 2 is supplied by the cream solder feeder 28.
9 is applied onto the pattern portion 11.

Thereafter, the pusher 27 is further lowered to push down the electronic component 9, and the cap portion 5 and the pattern portion 11 are connected via the cream solder 29 as shown in (L).

At this time, since the width of the mounting hole 10 is smaller than the width of the terminal end of the tapered part of the lead portion 6, the lead portion 6 is embedded in the green of the installer 10, and the electronic component 9 with leads is firmly attached to the printed circuit board 7. be done.

After that, the printed circuit board 7 is soldered by heating it by placing it in a furnace, by blowing hot air or by applying infrared rays, or by locally applying cream solder to the cream solder parts using a laser or light beam. Heat it to make a strong solder.

11-13 show another embodiment.

In FIG. 11, 30 is a cap-shaped terminal series, which is formed by connecting cap parts 5 and lead parts 6 alternately and continuously. The cap portion 5 has a shape and dimensions to which the electrode portion 3 of the chip-shaped electronic component 1 is fitted, and the lead portion 6
has the shape and dimensions to be inserted into the mounting hole 10 of the printed circuit board 7 shown in FIG.

When assembling, one cap-shaped terminal 4 is cut off from the cap-shaped terminal chain 30 as shown by the dashed line, and the concave part of the cap part 5 or the electrode part 3 of the chip-shaped electronic component 1 is cut out.
Cream solder (paste solder) on either or both
Coat it on both sides as shown in Figure 12. ? The cap part 5 is placed over the pole part 3 and fitted, and the cap-shaped terminal 3 is temporarily fixed to the chip-shaped electronic component 1.

Thereafter, as shown in FIG. 13, the cap-shaped terminal 4, which is a conductive part that is electrically connected to the electrode part 3, and the pattern part 11 are provided on the printed circuit board 7 while being brought into contact with each other via the cream solder 12. The lead portion 6 is inserted into the mounting hole 10. At this time, the lead portion 6 may be temporarily fixed by inserting it from the back side and bending the tip of the lead portion 6.

After that, the whole printed circuit board 7 is heated in a heating furnace or heated locally to heat the cream solder part to make a strong solder joint between the electrode part 3 and the cap part 5. The electrical connection and the electrical connection between the pattern portion 11 and the cap-shaped terminal 4 are ensured.

The lead portion 6 is not limited to a flat plate shape, but may be wire shaped.

Although the above example shows an example in which the lead portion 6 is connected to the short side of the cap portion 5, it may be connected to the long side.

〔Effect of the invention〕

According to the present invention, the electrical connection between the cap-shaped terminal and the chip-shaped electronic component is ensured, and it is possible to provide a simple and highly reliable mounting method for the chip-shaped electronic component, which has extremely great practical effects. play.

[Brief explanation of the drawing]

The drawings relate to an embodiment of the present invention, and FIG. 1 is a front view, FIGS. 2 and 3 are a plan view and a side view thereof, and FIG. 4 is a cross-sectional plan view taken along the line 1-1 in FIG. FIG. 5 is a plan view corresponding to FIG. 4 of another embodiment. FIGS. 6, 7, and 8 are a front view, top view, and side view of another embodiment, respectively. FIG. 9 is a manufacturing process and an insertion process. (For (M) only, mark (L) with arrow ■
10 is a cross-sectional side view taken along the line ■-■ in FIG. 24 is a cross-sectional side view taken along the line IV-IV in FIG. 9 (H))
, FIG. 11, FIG. 12, and FIG. 13 are a perspective view of a cap-shaped terminal chain of another embodiment, a perspective view, and a front view showing the assembly of an electronic component with a lead. DESCRIPTION OF SYMBOLS 1... Chip-shaped electronic component, 2... Main body, 3... Electrode part, 4... Cap-shaped terminal, 5... Cap part,
6...Lead part, 7...Printed circuit board, 8...Cream solder, 9...Electronic component with lead, lO...
・Mounting hole, 11...Pattern part, 12...Cream solder, 13...Terminal material, 14...Arrow, 15.
... Receiving mold, 16... Guide, I7... Embossing mold, 18.
... cream solder feeder, 19... cream solder, 20... cream solder feeder, 21... cream solder, 22... flat cutter, 23... chevron cutter, 24... Valley cutter, 25... fixed piece,
26...Movable piece, 27...Button shear, 28...
Cream solder feeder, 29...Cream solder, 3
0...Cap-shaped terminal connection, 31...Electronic component connection, (
A) Cap forming station, (C) Cream solder application station, (E) Chip-shaped electronic component fitting station, (H) Cutting station, (K) Insertion station. Patent Applicant TDC Co., Ltd. Representative Patent Attorney Masayuki Takagi Representative Patent Attorney Pharmaceutical
Teacher Minoru Patent attorney Yori 1) Takashi
Next Japanese movie Figure 1 Figure 3 Figure 4

Claims (1)

[Claims] 1. The cap portion of the cap-shaped terminal, which is composed of a cap portion into which the electrode portion is fitted and a lead portion inserted into the mounting hole of the board, is attached to the electrode portion of the chip-shaped electronic component using cream solder. to form a leaded electronic component by fitting and holding the leaded electronic component, and then connecting the cap-shaped terminal of the leaded electronic component to the pattern portion of the substrate via cream solder, A method for mounting a chip-shaped electronic component, comprising inserting and fixing the lead part into a mounting hole of the board, and then heating and soldering the cream solder connection part of the electrode part and the pattern part. 2. The method according to claim 1, wherein the lead portion is inserted and fixed into the mounting hole of the substrate by bending the tip of the lead portion on the back surface of the substrate. 3. The lead part and/or the mounting when the lead part is inserted into the mounting hole of the board and the lead part having a width slightly larger than the diameter of the mounting hole is forcefully inserted into the mounting hole. The method according to claim 1, which is carried out by deforming a hole. 4. The method according to claim 3, wherein the tip of the lead portion is formed in a tapered shape. 5. Two parallel cap-shaped terminal chains are formed in which the lead part that is inserted into the mounting hole of the board and the cap part that fits and holds the chip-shaped electronic component are formed continuously and alternately at a constant pitch in the longitudinal direction. holding a chip-shaped electronic component between the two cap-shaped terminal chains, and fitting the electrode part of the chip-shaped electronic component to the cap part via creamy solder to form an electronic component chain; Cut out leaded electronic components one by one, which are formed by sandwiching one chip-shaped electronic component between a pair of cap-shaped terminals, from a series of parts, and separate the cap-shaped terminal and the substrate of the leaded electronic component. The lead part is inserted into the mounting hole of the board and fixed while connecting with the pattern part via cream solder, and then the cream solder connection part of the electrode part and the pattern part is heated and soldered. A method for mounting a chip-shaped electronic component, characterized by: 6. The method according to claim 5, wherein when cutting off the leaded electronic component, the tip of the lead portion is cut into a tapered shape. 7. When inserting and fixing the lead part into the mounting hole of the board, the lead part and/or the mounting occurs when the lead part having a width slightly larger than the diameter of the mounting hole is forcefully inserted into the mounting hole. 7. The method according to claim 6, which is carried out by deforming the hole.