JPS6229198A - Mounting of chip-shaped electronic component - Google Patents

Mounting of chip-shaped electronic component

Info

Publication number
JPS6229198A
JPS6229198A JP60166822A JP16682285A JPS6229198A JP S6229198 A JPS6229198 A JP S6229198A JP 60166822 A JP60166822 A JP 60166822A JP 16682285 A JP16682285 A JP 16682285A JP S6229198 A JPS6229198 A JP S6229198A
Authority
JP
Japan
Prior art keywords
electronic component
lead
chip
mounting hole
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP60166822A
Other languages
Japanese (ja)
Inventor
勝 増島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Priority to JP60166822A priority Critical patent/JPS6229198A/en
Publication of JPS6229198A publication Critical patent/JPS6229198A/en
Pending legal-status Critical Current

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Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、チップコンデンサなどのチップ状電子部品に
リードを設けてプリント基板に装着するだめのチップ状
電子部品の装着方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting a chip-shaped electronic component such as a chip capacitor on a printed circuit board by providing leads on the chip-shaped electronic component.

〔従来の技術〕[Conventional technology]

従来、チップ状電子部品をプリント基板のプリント回路
に固定するには、チップ状電子部品をプリント回路にi
S!置し接触させた状態でエポキシ樹゛脂などの接着剤
で仮固定した後浸漬はんだ付は或いは炉中はんだ付けな
どによりはんだ付けすることにより行われている。
Conventionally, in order to fix a chip-shaped electronic component to a printed circuit of a printed circuit board, the chip-shaped electronic component was attached to the printed circuit.
S! After being temporarily fixed with an adhesive such as epoxy resin in a state where they are placed in contact with each other, soldering is carried out by immersion soldering or furnace soldering.

しかし、樹脂で仮固定すると樹脂のポットライフに基づ
く作業時間の制約、電極に樹脂が付着することによる接
続不良、樹脂の乾燥時間などの問題点があり、この問題
点を解決するために例えば特開昭57−42191号公
報に示される技術等が提案されている。
However, temporary fixation with resin has problems such as work time restrictions based on the pot life of the resin, connection failures due to resin adhering to the electrodes, and resin drying time. A technique such as that shown in JP-A No. 57-42191 has been proposed.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

このような構造のものにおいては、製造工程が簡単では
あるが、キャップ部と電子部品の電極部との接触が不十
分となるおそれがあった。
With such a structure, although the manufacturing process is simple, there is a risk that the contact between the cap portion and the electrode portion of the electronic component may be insufficient.

本発明は、このような従来のものの改良にかかわるもの
であり、チップ状電子部品とキャップ状端子との接触を
完全なものとなし、信頼性の高い装着を行うことができ
るチップ状電子部品の装着方法を提供することを目的と
するものである。
The present invention is concerned with improvements to such conventional devices, and provides a chip-shaped electronic component that can achieve complete contact between the chip-shaped electronic component and the cap-shaped terminal and can be mounted with high reliability. The purpose is to provide a mounting method.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は問題点を解決するための手段として、チップ状
電子部品の電極部に、リード部を溶着せしめてリード付
き電子部品を形成し、次に、該リード付き電子部品の、
前記電極部又は前記リード部と前記基板のパターン部と
の間をクリームはんだを介して接続せしめながら、前記
基板の取付穴に前記リード部を差し込んで固定し、その
後前記パターン部におけるクリームはんだによる接続部
を加熱してはんだ付けを行うことを特徴とするチップ状
電子部品の装着方法、 及び 基板の取付穴に差し込まれるリード部を連続せしめた帯
状の端子素材を2本平行に保持し、該2本の端子素材の
間に、チップ状電子部品を、前記端子素材に溶着固定せ
しめて電子部品連を形成し、該電子部品連より、一対の
リード部の間に一つのチップ状電子部品を挟持して形成
されたリード付き電子部品を一つづつ切り離し、該リー
ド付き電子部品の、前記電極部又はリード部と前記基板
のパターン部との間をクリームはんだを介して接続せし
めながら、前記基板の取付穴に前記リード部を差し込ん
で固定し、その後前記パターン部におけるクリームはん
だによる接続部を加熱してはんだ付けを行うことを特徴
とするチップ状電子部品の装着方法を提供せんとするも
のである。
As a means for solving the problems, the present invention forms a leaded electronic component by welding a lead part to the electrode part of a chip-shaped electronic component, and then:
Connecting between the electrode part or the lead part and the pattern part of the board through cream solder, inserting and fixing the lead part into the mounting hole of the board, and then connecting with the cream solder in the pattern part. A method for attaching a chip-shaped electronic component characterized by heating and soldering the parts, and holding two strip-shaped terminal materials in parallel, each having a continuous lead part to be inserted into a mounting hole of a board. A chip-shaped electronic component is welded and fixed to the terminal material between the terminal materials of the book to form an electronic component series, and one chip-shaped electronic component is sandwiched between a pair of lead parts from the electronic component series. The lead-equipped electronic components formed in this manner are separated one by one, and the electrode portions or lead portions of the lead-equipped electronic components and the pattern portion of the substrate are connected via cream solder. It is an object of the present invention to provide a method for mounting a chip-shaped electronic component, characterized in that the lead part is inserted into the mounting hole and fixed, and then the connection part made of cream solder in the pattern part is heated and soldered. .

〔実施例〕〔Example〕

本発明の実施例を図面を用いて説明する。 Embodiments of the present invention will be described using the drawings.

第1図、第2図、第3図、第4図において、チップ状電
子部品1は本体2とその両端に設けられた電極部3とよ
り成る。6はリード部である。
In FIG. 1, FIG. 2, FIG. 3, and FIG. 4, a chip-shaped electronic component 1 consists of a main body 2 and electrode portions 3 provided at both ends thereof. 6 is a lead portion.

このような電子部品を製造し、プリント基板7に装着す
る工程を説明すれば、先ず、本体2の両端に電極部3を
設けたチップ状電子部品lを製作し、その両側にリード
部6をスポット溶接などにより溶着部8において溶着せ
しめる。溶着は、スポット溶接のほか、レーザー加熱溶
着、超音波溶着などを用いてもよい。
To explain the process of manufacturing such an electronic component and mounting it on the printed circuit board 7, first, a chip-shaped electronic component 1 is manufactured with electrode portions 3 provided at both ends of the main body 2, and lead portions 6 are attached to both sides of the chip-shaped electronic component 1. Welding is performed at the welding portion 8 by spot welding or the like. For welding, in addition to spot welding, laser heating welding, ultrasonic welding, etc. may be used.

このようにして形成されたリード付き電子部品9をプリ
ント基板7に装着するには、プリント基板7に設けられ
た取付穴10の周囲のパターン部11の上にクリームは
んだ12を載せ、リード部6を取付穴10に押し込んで
クリームはんだ12を介してパターン部11と電極部3
とを接続する。
In order to mount the electronic component 9 with leads formed in this manner onto the printed circuit board 7, cream solder 12 is placed on the pattern section 11 around the mounting hole 10 provided in the printed circuit board 7, and the lead section 6 into the mounting hole 10 and connect the pattern part 11 and electrode part 3 via the cream solder 12.
Connect with.

クリームはんだ12は電極部3Hに塗っておいてもよい
、上記の接続は最終的には電極部3とパターン部11と
が電気的に導通ずればよいので、電極部3と導通してい
る部分(電極部3自体も含めてこれを導通部と称す)と
パターン部11との間をクリームはんだ12を介して接
続するようにしてもよい、導通部としては電極部3自体
、リード部6のいづれの部分でもよい。
The cream solder 12 may be applied to the electrode part 3H.The above connection is only necessary if the electrode part 3 and the pattern part 11 are electrically connected, so the part that is electrically connected to the electrode part 3 (This including the electrode part 3 itself is referred to as a conductive part) and the pattern part 11 may be connected via cream solder 12.The conductive part includes the electrode part 3 itself, the lead part 6. Either part is fine.

リード部6の先端は第3図に示す如くテーパー状になっ
ている。取付穴10の直径りに対して、リード部6のテ
ーパ一部の先端の幅B、と終端の幅B、とは B、<D Bg>D となっている、従ってリード部6を取付穴10に挿入す
るに当たり、最初は先端部が取付穴10に触れずに自由
に入るが、テーパ一部の終端部は取付穴IOに触れ、な
おも押し込むと取付穴10の縁の一部を変形せしめてリ
ード部6がくい込み、取付穴10の縁により強固に固定
され、リード付き電子部品9はプリント基板7に固定さ
れる。
The tip of the lead portion 6 is tapered as shown in FIG. With respect to the diameter of the mounting hole 10, the width B at the tip of the tapered part of the lead part 6 and the width B at the end are B,<D Bg>D.Therefore, the lead part 6 is attached to the mounting hole. When inserting it into the mounting hole 10, at first the tip enters freely without touching the mounting hole 10, but the terminal end of a part of the taper touches the mounting hole IO, and if it is pushed in further, a part of the edge of the mounting hole 10 will be deformed. At the very least, the lead portion 6 is inserted and firmly fixed by the edge of the mounting hole 10, and the leaded electronic component 9 is fixed to the printed circuit board 7.

リード部6が薄い場合は、取付穴10にくい込ませずに
第5図の如くリード部6自体を弾性変形せしめてその弾
性力により取付穴10に固定するようにしてもよい。
If the lead part 6 is thin, the lead part 6 itself may be elastically deformed as shown in FIG. 5 without being inserted into the mounting hole 10, and the lead part 6 may be fixed in the mounting hole 10 by its elastic force.

このようにして、リード付き電子部品9をプリント基板
に仮に固定した後に、はんだ付は炉、熱風吹き付け、赤
外線、レーザ、光ビームなどにより全体或いはクリーム
はんだ12の部品を加熱して電極部3とパターン部11
との間のクリームはんだ12を強固にはんだ付けし、電
気的及び機械的に十分に接続する。
After temporarily fixing the electronic component 9 with leads to the printed circuit board in this way, soldering is carried out by heating the whole part or the parts of the cream solder 12 using a furnace, hot air blowing, infrared rays, laser, light beam, etc. to connect the electrode part 3. Pattern part 11
A cream solder 12 is firmly soldered between the terminals and the terminals to provide a sufficient electrical and mechanical connection.

このようにしてリード部が確実に取付いているチップ状
電子部品1を、確実にプリント基板に取付け、電気的に
も機械的にも信頼性の高い装着を行うことができる。
In this way, the chip-shaped electronic component 1 with the lead portion securely attached can be reliably attached to the printed circuit board, and the attachment can be performed with high reliability both electrically and mechanically.

なお、リード部6をプリント基板7の取付穴1゜に固定
するのに、従来の如くプリント基板7の裏側に出たリー
ド部6を折り曲げる方法を用いてもよい。
Incidentally, in order to fix the lead portion 6 to the 1° mounting hole of the printed circuit board 7, the conventional method of bending the lead portion 6 protruding from the back side of the printed circuit board 7 may be used.

第6〜8図は別の実施例を示し、チップ状電子部品10
面に直角方向にリード部6を突出せしめたものである。
6 to 8 show another embodiment, in which a chip-shaped electronic component 10
The lead portion 6 is made to protrude in a direction perpendicular to the surface.

第1〜3図に示した実施例では完成したリード付き電子
部品9の幅が狭く、プリント基板7の狭い範囲に多数の
リード付き電子部品9を配備することができるが高さは
高くなる。この第6〜8図の実施例のものにおいては幅
は広くなるが、高さを低くすることができる。
In the embodiment shown in FIGS. 1 to 3, the width of the completed leaded electronic component 9 is narrow, and a large number of leaded electronic components 9 can be arranged in a narrow area of the printed circuit board 7, but the height is increased. In the embodiments shown in FIGS. 6 to 8, the width is increased, but the height can be reduced.

次に、第6〜8図に示す如きチップ状電子部品1の製造
及びプリント基板7への装着の工程の例につき説明する
。先ず製造工程につき説明する。
Next, an example of the process of manufacturing the chip-shaped electronic component 1 and mounting it on the printed circuit board 7 as shown in FIGS. 6 to 8 will be explained. First, the manufacturing process will be explained.

第9図、第1O図において、リード部G用の素材である
細長い端子素材13が2本、平行に、かつ扁平な面が向
き合うように並べて矢印14の向きに連続的に送られる
。端子素材13の材料は、鋼材前は鋼材にはんだメッキ
或いは錫メッキしたものが用いられる。
In FIGS. 9 and 1O, two elongated terminal materials 13, which are materials for the lead portion G, are arranged parallel to each other with their flat surfaces facing each other and are continuously fed in the direction of the arrow 14. The terminal material 13 is made of steel plated with solder or tin.

次にチップ状電子部品溶着ステーション(E)において
、(D)の如きチップ状電子部品lを、端子素材13の
間に挟んで、電極18を当てスポットウェルドにより第
8図8の如き溶着を行い固定する。
Next, at the chip-shaped electronic component welding station (E), the chip-shaped electronic component l as shown in (D) is sandwiched between the terminal materials 13, electrodes 18 are applied, and welding is performed by spot welding as shown in FIG. 8. Fix it.

このようにして(F)の如く、端子素材13に固定され
て、多数のチップ状電子部品lが等間隔に平行に保持さ
れている電子部品連が形成される。
In this way, as shown in (F), an electronic component chain is formed in which a large number of chip-shaped electronic components 1 are held in parallel at equal intervals while being fixed to the terminal material 13.

電子部品連製造機械と、電子部品挿入機とが分かれてい
て、製造工程と挿入工程とが連続しない場合には製造さ
れた電子部品連は適当な長さに切断されて保管される。
If the electronic component chain manufacturing machine and the electronic component insertion machine are separate, and the manufacturing process and the insertion process are not continuous, the manufactured electronic component chain is cut into appropriate lengths and stored.

製造装置と挿入装置とが一体になっている場合など、製
造工程と挿入工程とが連続する場合はここでは切断せず
に次の工程に入る。
If the manufacturing process and the insertion process are continuous, such as when the manufacturing device and the insertion device are integrated, the next process is started without cutting.

次に切断・挿入工程につき説明する。Next, the cutting/insertion process will be explained.

第9図、第10図において、(G)の如く、チップ状電
子部品1を保持した電子部品連が、前の製造工程から引
続き、或いは保管場所から運ばれて供給され石。
In FIGS. 9 and 10, as shown in (G), a series of electronic components holding a chip-shaped electronic component 1 is supplied continuously from the previous manufacturing process or transported from a storage location.

切断ステージ町ン(H)では内側に、平型カッター22
、山型カッター23が固定されて備えられ、外側には平
型カッター22と山型カッター23との間にはいる形状
をした谷型カッター24が端子素材13に対し直角の方
向に往復移動するように保持されている。
At the cutting stage (H), a flat cutter 22 is installed on the inside.
A chevron-shaped cutter 23 is fixedly provided, and a valley-shaped cutter 24 having a shape inserted between the flat cutter 22 and the chevron-shaped cutter 23 is reciprocated in a direction perpendicular to the terminal material 13 on the outside. It is maintained as such.

次に谷型カッター24が(1)の如く内方に移動し、平
型カッター22、山型カッター23との間で端子素材1
3を切断し、カッタ一部を過ぎた部分についてはチップ
状電子部品lより上方に出た端子素材13を直角に切断
し、カッタ一部に来る前の部分については端子素材13
の先端をテーパー状に切断し、(J)に示す如きリード
付き電子部品9が得られる。これは第6〜7図に示され
たものと同じ形状のものである。
Next, the valley cutter 24 moves inward as shown in (1) and cuts the terminal material 1 between the flat cutter 22 and the angle cutter 23.
3, the terminal material 13 protruding above the chip-shaped electronic component l is cut at a right angle for the part past the cutter part, and the terminal material 13 for the part before reaching the cutter part is cut at right angles.
By cutting the tip into a tapered shape, an electronic component 9 with a lead as shown in (J) is obtained. This is of the same shape as shown in FIGS. 6-7.

切断ステーション(H)においては、リード部6を挟持
する固定片25及び可動片26が備えられており、切断
作業の前に(I)に示す如く可動片26が動いてリード
部6を挟持する。このようにリード部6が挟持された後
切断を行い、リード付き電子部品9は、リード部6を挟
持された状態で下方に移動する。
The cutting station (H) is equipped with a fixed piece 25 and a movable piece 26 that sandwich the lead part 6, and before the cutting operation, the movable piece 26 moves to sandwich the lead part 6 as shown in (I). . After the lead portion 6 is clamped in this manner, cutting is performed, and the leaded electronic component 9 moves downward with the lead portion 6 being clamped.

挿入ステーション(K)においては、リード部6の先端
がプリント基板7の取付穴IOに挿入されるまで固定片
25及び可動片26により挟持して降下せしめ、その後
、リード付き電子部品9を上方から押し下げるブツシャ
−27を当て、固定片25、可動片26を外し、プッシ
ャー27にてリード付き電子部品9を押し下げる。この
ときクリームはんだ供給機28によりクリームはんだ2
9をパターン部11の上に塗布する。
At the insertion station (K), the lead part 6 is clamped and lowered by the fixed piece 25 and the movable piece 26 until the tip of the lead part 6 is inserted into the mounting hole IO of the printed circuit board 7, and then the leaded electronic component 9 is inserted from above. Apply the pusher 27 to push it down, remove the fixed piece 25 and the movable piece 26, and use the pusher 27 to push down the electronic component 9 with leads. At this time, cream solder 2 is supplied by the cream solder feeder 28.
9 is applied onto the pattern portion 11.

その後、さらにブツシャ−27を下降せしめて電子部品
9を押し下げ、(L)に示す如くクリームはんだ29を
介してキャップ部5とパターン部11とを接続せしめる
Thereafter, the pusher 27 is further lowered to push down the electronic component 9, and the cap portion 5 and the pattern portion 11 are connected via the cream solder 29 as shown in (L).

このとき、取付穴IOはリード部6のテーパ一部の終端
部の幅より小さいので、リード部6が取付穴10の縁に
くい込み、リード付き電子部品9はプリント基板7に強
固に取付される。
At this time, since the mounting hole IO is smaller than the width of the terminal end of the tapered part of the lead part 6, the lead part 6 is wedged into the edge of the mounting hole 10, and the leaded electronic component 9 is firmly mounted to the printed circuit board 7. .

その後プリント基板7をはんだ付は炉に入れ加熱するか
、熱風を吹き付けたり、赤外線を当てるなどにより全体
を加熱するか、レーザ或いは光ビームによりクリームは
んだ部を局部的にクリームはんだ19,21.29を加
熱して強固なはんだ付けを行う。
After that, the printed circuit board 7 is soldered by heating it by placing it in a furnace, by blowing hot air or by applying infrared rays, or by locally applying cream solder to the cream solder parts using a laser or light beam. Heat it to make a strong solder.

以上の例は平坦な端子素材13を用いたものを示したが
、電極部3が確実に当たるよう、嵌合する凹部を設けた
端子部材13を用いてもよい。
Although the above example uses a flat terminal material 13, it is also possible to use a terminal member 13 provided with a recess into which the electrode portion 3 fits securely.

リード部6をプリント基板に固定するのに裏側から差し
込みリード部6の先端を折り曲げて仮固定してもよい。
To fix the lead part 6 to the printed circuit board, it may be temporarily fixed by inserting it from the back side and bending the tip of the lead part 6.

リード部6は平板状に限らず、針金状であってもよい。The lead portion 6 is not limited to a flat plate shape, but may be wire shaped.

〔発明の効果〕〔Effect of the invention〕

本発明により、リード部とチップ状電子部品との電気的
接続が確実となり、簡単でありかつ信顛性の高いチップ
状電子部品の装着方法を提供することができ、実用上極
めて大なる効果を奏する。
According to the present invention, the electrical connection between the lead part and the chip-shaped electronic component is ensured, and it is possible to provide a simple and highly reliable mounting method for the chip-shaped electronic component, which has extremely great practical effects. play.

【図面の簡単な説明】[Brief explanation of the drawing]

図面は本発明の実施例に関するもので、第1図は正面図
、第2図及び第3図はその平面図及び側面図、第4図は
第3図のI−1線断面平面図、第5図は別の実施例の第
4図相当平面図第6図、第7図、第8図は別の実施例の
それぞれ正面図、平面図、側面図、第9図は製造工程及
び挿入工程を示す正面図((M)のみは(L)を矢印■
から見た背面図)、第1O図は第9図のm−m線断面側
面図(但し、ガイドI6、押型17、クリームはんだ供
給機18は示していない、また()()における谷型カ
ッター24は、第9図(H)のIV−IV線断面側面図
)、である。 ■・・・チップ状電子部品、2・・・本体、3・・・電
極部、6・・・リード部、7・・・プリント基板、8・
・・溶着部、9・・・リード付き電子部品、10・・・
取付穴、11・・・パターン部、12・・・クリームは
んだ、13・・・端子素材、14・・・矢印、15・・
・受型、16・・・ガイド、17・・・押型、18・・
・電極、22・・・平型カッター、23・・・山型カッ
ター、24・・・谷型カッター、25・・・固定片、2
6・・・可動片、27・・・ブツシャ−128・・・ク
リームはんだ供給機、29・・・クリームはんだ、31
・・・電子部品連、(E)チップ状電子部品溶着ステー
シッン、(H)切断ステーション、(K)挿入ステーシ
ョン。 特許 出願人  ティーディーケイ株式会社代理人弁理
士  高  木  正  行代理人弁理士  薬  師
      稔代理人弁理士  依  1) 孝  次
  邦画1図     第3図 第6図 第7図 銅8図
The drawings relate to an embodiment of the present invention, and FIG. 1 is a front view, FIGS. 2 and 3 are a plan view and a side view thereof, and FIG. 4 is a cross-sectional plan view taken along line I-1 in FIG. FIG. 5 is a plan view corresponding to FIG. 4 of another embodiment. FIGS. 6, 7, and 8 are a front view, top view, and side view of another embodiment, respectively. FIG. 9 is a manufacturing process and an insertion process. (For (M) only, mark (L) with arrow ■
1O is a cross-sectional side view taken along line mm in FIG. 24 is a cross-sectional side view taken along the line IV-IV in FIG. 9(H). ■... Chip-shaped electronic component, 2... Main body, 3... Electrode part, 6... Lead part, 7... Printed circuit board, 8...
...Welded part, 9...Electronic component with lead, 10...
Mounting hole, 11... Pattern part, 12... Cream solder, 13... Terminal material, 14... Arrow, 15...
・Receiving mold, 16... Guide, 17... Pressing die, 18...
・Electrode, 22... Flat cutter, 23... Mountain cutter, 24... Valley cutter, 25... Fixed piece, 2
6... Movable piece, 27... Butcher 128... Cream solder feeder, 29... Cream solder, 31
...Electronic component series, (E) Chip-shaped electronic component welding station, (H) Cutting station, (K) Insertion station. Patent Applicant: TDC Co., Ltd. Representative Patent Attorney Masayuki Takagi Representative Patent Attorney Minoru Yakushi Representative Patent Attorney Yoi 1) Takatsugu Japanese Movies 1 Figure 3 Figure 6 Figure 7 Bronze Figure 8

Claims (1)

【特許請求の範囲】 1、チップ状電子部品の電極部に、リード部を溶着せし
めてリード付き電子部品を形成し、次に、該リード付き
電子部品の、前記電極部又は前記リード部と前記基板の
パターン部との間をクリームはんだを介して接続せしめ
ながら、前記基板の取付穴に前記リード部を差し込んで
固定し、 その後前記パターン部におけるクリームはんだによる接
続部を加熱してはんだ付けを行うことを特徴とするチッ
プ状電子部品の装着方法。 2、前記基板の取付穴への前記リード部の差し込み固定
が、該リード部先端を前記基板裏面で折り曲げることに
より行われる特許請求の範囲第1項記載の方法。 3、前記基板の取付穴への前記リード部の差し込み固定
が、前記取付穴の直径よりやや大きい幅を有する前記リ
ード部を前記取付穴に無理に挿入した場合の前記リード
部及び/又は前記取付穴の変形により行われる特許請求
の範囲第1項記載の方法。 4、前記リード部の先端がテーパー状に形成されている
特許請求の範囲第3項の方法。 5、基板の取付穴に差し込まれるリード部を連続せしめ
た帯状の端子素材を2本平行に保持し、 該2本の端子素材の間に、チップ状電子部品を、前記端
子素材に溶着固定せしめて電子部品連を形成し、 該電子部品連より、一対のリード部の間に一つのチップ
状電子部品を挟持して形成されたリード付き電子部品を
一つづつ切り離し、該リード付き電子部品の、前記電極
部又はリード部と前記基板のパターン部との間をクリー
ムはんだを介して接続せしめながら、前記基板の取付穴
に前記リード部を差し込んで固定し、 その後前記パターン部におけるクリームはんだによる接
続部を加熱してはんだ付けを行うことを特徴とするチッ
プ状電子部品の装着方法。 6、前記リード付き電子部品を切り離すときに、前記リ
ード部先端をテーパー状に切断することを特徴とする特
許請求の範囲第5項記載の方法。 7、前記基板の取付穴への前記リード部の差し込み固定
が、前記取付穴の直径よりやや大きい幅を有する前記リ
ード部を前記取付穴に無理に挿入した場合の前記リード
部及び/又は前記取付穴の変形により行われる特許請求
の範囲第6項記載の方法。
[Claims] 1. A lead-equipped electronic component is formed by welding a lead section to an electrode section of a chip-shaped electronic component, and then the electrode section or the lead section of the lead-equipped electronic component is welded to the electrode section of the chip-shaped electronic component. The lead part is inserted into the mounting hole of the board and fixed while connecting it to the pattern part of the board via cream solder, and then the cream solder connection part in the pattern part is heated and soldered. A method for mounting a chip-shaped electronic component, characterized by: 2. The method according to claim 1, wherein the lead portion is inserted and fixed into the mounting hole of the substrate by bending the tip of the lead portion on the back surface of the substrate. 3. The lead part and/or the mounting when the lead part is inserted into the mounting hole of the board and the lead part having a width slightly larger than the diameter of the mounting hole is forcefully inserted into the mounting hole. The method according to claim 1, which is carried out by deforming a hole. 4. The method according to claim 3, wherein the tip of the lead portion is formed in a tapered shape. 5. Hold two strip-shaped terminal materials with continuous lead parts inserted into the mounting holes of the board in parallel, and weld and fix the chip-shaped electronic component to the terminal materials between the two terminal materials. to form an electronic component chain, and from the electronic component chain, cut out one by one the leaded electronic components formed by sandwiching one chip-shaped electronic component between a pair of lead parts, and separate the leaded electronic components from the electronic component series. , while connecting the electrode part or lead part and the pattern part of the board through cream solder, inserting and fixing the lead part into the mounting hole of the board, and then connecting with cream solder in the pattern part. A method for attaching chip-shaped electronic components, characterized by heating and soldering the parts. 6. The method according to claim 5, characterized in that, when cutting off the leaded electronic component, the tip of the lead portion is cut into a tapered shape. 7. The lead portion and/or the mounting when the lead portion is inserted and fixed into the mounting hole of the board by forcefully inserting the lead portion having a width slightly larger than the diameter of the mounting hole into the mounting hole. 7. The method according to claim 6, which is carried out by deforming the hole.
JP60166822A 1985-07-30 1985-07-30 Mounting of chip-shaped electronic component Pending JPS6229198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60166822A JPS6229198A (en) 1985-07-30 1985-07-30 Mounting of chip-shaped electronic component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60166822A JPS6229198A (en) 1985-07-30 1985-07-30 Mounting of chip-shaped electronic component

Publications (1)

Publication Number Publication Date
JPS6229198A true JPS6229198A (en) 1987-02-07

Family

ID=15838306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60166822A Pending JPS6229198A (en) 1985-07-30 1985-07-30 Mounting of chip-shaped electronic component

Country Status (1)

Country Link
JP (1) JPS6229198A (en)

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