JPS6229198A - Mounting of chip-shaped electronic component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting a chip-shaped electronic component such as a chip capacitor on a printed circuit board by providing leads on the chip-shaped electronic component.

[Conventional technology]

Conventionally, in order to fix a chip-shaped electronic component to a printed circuit of a printed circuit board, the chip-shaped electronic component was attached to the printed circuit.
S! After being temporarily fixed with an adhesive such as epoxy resin in a state where they are placed in contact with each other, soldering is carried out by immersion soldering or furnace soldering.

However, temporary fixation with resin has problems such as work time restrictions based on the pot life of the resin, connection failures due to resin adhering to the electrodes, and resin drying time. A technique such as that shown in JP-A No. 57-42191 has been proposed.

[Problem that the invention seeks to solve]

With such a structure, although the manufacturing process is simple, there is a risk that the contact between the cap portion and the electrode portion of the electronic component may be insufficient.

The present invention is concerned with improvements to such conventional devices, and provides a chip-shaped electronic component that can achieve complete contact between the chip-shaped electronic component and the cap-shaped terminal and can be mounted with high reliability. The purpose is to provide a mounting method.

[Means for solving problems]

As a means for solving the problems, the present invention forms a leaded electronic component by welding a lead part to the electrode part of a chip-shaped electronic component, and then:
Connecting between the electrode part or the lead part and the pattern part of the board through cream solder, inserting and fixing the lead part into the mounting hole of the board, and then connecting with the cream solder in the pattern part. A method for attaching a chip-shaped electronic component characterized by heating and soldering the parts, and holding two strip-shaped terminal materials in parallel, each having a continuous lead part to be inserted into a mounting hole of a board. A chip-shaped electronic component is welded and fixed to the terminal material between the terminal materials of the book to form an electronic component series, and one chip-shaped electronic component is sandwiched between a pair of lead parts from the electronic component series. The lead-equipped electronic components formed in this manner are separated one by one, and the electrode portions or lead portions of the lead-equipped electronic components and the pattern portion of the substrate are connected via cream solder. It is an object of the present invention to provide a method for mounting a chip-shaped electronic component, characterized in that the lead part is inserted into the mounting hole and fixed, and then the connection part made of cream solder in the pattern part is heated and soldered. .

〔Example〕

Embodiments of the present invention will be described using the drawings.

In FIG. 1, FIG. 2, FIG. 3, and FIG. 4, a chip-shaped electronic component 1 consists of a main body 2 and electrode portions 3 provided at both ends thereof. 6 is a lead portion.

To explain the process of manufacturing such an electronic component and mounting it on the printed circuit board 7, first, a chip-shaped electronic component 1 is manufactured with electrode portions 3 provided at both ends of the main body 2, and lead portions 6 are attached to both sides of the chip-shaped electronic component 1. Welding is performed at the welding portion 8 by spot welding or the like. For welding, in addition to spot welding, laser heating welding, ultrasonic welding, etc. may be used.

In order to mount the electronic component 9 with leads formed in this manner onto the printed circuit board 7, cream solder 12 is placed on the pattern section 11 around the mounting hole 10 provided in the printed circuit board 7, and the lead section 6 into the mounting hole 10 and connect the pattern part 11 and electrode part 3 via the cream solder 12.
Connect with.

The cream solder 12 may be applied to the electrode part 3H.The above connection is only necessary if the electrode part 3 and the pattern part 11 are electrically connected, so the part that is electrically connected to the electrode part 3 (This including the electrode part 3 itself is referred to as a conductive part) and the pattern part 11 may be connected via cream solder 12.The conductive part includes the electrode part 3 itself, the lead part 6. Either part is fine.

The tip of the lead portion 6 is tapered as shown in FIG. With respect to the diameter of the mounting hole 10, the width B at the tip of the tapered part of the lead part 6 and the width B at the end are B,<D Bg>D.Therefore, the lead part 6 is attached to the mounting hole. When inserting it into the mounting hole 10, at first the tip enters freely without touching the mounting hole 10, but the terminal end of a part of the taper touches the mounting hole IO, and if it is pushed in further, a part of the edge of the mounting hole 10 will be deformed. At the very least, the lead portion 6 is inserted and firmly fixed by the edge of the mounting hole 10, and the leaded electronic component 9 is fixed to the printed circuit board 7.

If the lead part 6 is thin, the lead part 6 itself may be elastically deformed as shown in FIG. 5 without being inserted into the mounting hole 10, and the lead part 6 may be fixed in the mounting hole 10 by its elastic force.

After temporarily fixing the electronic component 9 with leads to the printed circuit board in this way, soldering is carried out by heating the whole part or the parts of the cream solder 12 using a furnace, hot air blowing, infrared rays, laser, light beam, etc. to connect the electrode part 3. Pattern part 11
A cream solder 12 is firmly soldered between the terminals and the terminals to provide a sufficient electrical and mechanical connection.

In this way, the chip-shaped electronic component 1 with the lead portion securely attached can be reliably attached to the printed circuit board, and the attachment can be performed with high reliability both electrically and mechanically.

Incidentally, in order to fix the lead portion 6 to the 1° mounting hole of the printed circuit board 7, the conventional method of bending the lead portion 6 protruding from the back side of the printed circuit board 7 may be used.

6 to 8 show another embodiment, in which a chip-shaped electronic component 10
The lead portion 6 is made to protrude in a direction perpendicular to the surface.

In the embodiment shown in FIGS. 1 to 3, the width of the completed leaded electronic component 9 is narrow, and a large number of leaded electronic components 9 can be arranged in a narrow area of the printed circuit board 7, but the height is increased. In the embodiments shown in FIGS. 6 to 8, the width is increased, but the height can be reduced.

Next, an example of the process of manufacturing the chip-shaped electronic component 1 and mounting it on the printed circuit board 7 as shown in FIGS. 6 to 8 will be explained. First, the manufacturing process will be explained.

In FIGS. 9 and 1O, two elongated terminal materials 13, which are materials for the lead portion G, are arranged parallel to each other with their flat surfaces facing each other and are continuously fed in the direction of the arrow 14. The terminal material 13 is made of steel plated with solder or tin.

Next, at the chip-shaped electronic component welding station (E), the chip-shaped electronic component l as shown in (D) is sandwiched between the terminal materials 13, electrodes 18 are applied, and welding is performed by spot welding as shown in FIG. 8. Fix it.

In this way, as shown in (F), an electronic component chain is formed in which a large number of chip-shaped electronic components 1 are held in parallel at equal intervals while being fixed to the terminal material 13.

If the electronic component chain manufacturing machine and the electronic component insertion machine are separate, and the manufacturing process and the insertion process are not continuous, the manufactured electronic component chain is cut into appropriate lengths and stored.

If the manufacturing process and the insertion process are continuous, such as when the manufacturing device and the insertion device are integrated, the next process is started without cutting.

Next, the cutting/insertion process will be explained.

In FIGS. 9 and 10, as shown in (G), a series of electronic components holding a chip-shaped electronic component 1 is supplied continuously from the previous manufacturing process or transported from a storage location.

At the cutting stage (H), a flat cutter 22 is installed on the inside.
A chevron-shaped cutter 23 is fixedly provided, and a valley-shaped cutter 24 having a shape inserted between the flat cutter 22 and the chevron-shaped cutter 23 is reciprocated in a direction perpendicular to the terminal material 13 on the outside. It is maintained as such.

Next, the valley cutter 24 moves inward as shown in (1) and cuts the terminal material 1 between the flat cutter 22 and the angle cutter 23.
3, the terminal material 13 protruding above the chip-shaped electronic component l is cut at a right angle for the part past the cutter part, and the terminal material 13 for the part before reaching the cutter part is cut at right angles.
By cutting the tip into a tapered shape, an electronic component 9 with a lead as shown in (J) is obtained. This is of the same shape as shown in FIGS. 6-7.

The cutting station (H) is equipped with a fixed piece 25 and a movable piece 26 that sandwich the lead part 6, and before the cutting operation, the movable piece 26 moves to sandwich the lead part 6 as shown in (I). . After the lead portion 6 is clamped in this manner, cutting is performed, and the leaded electronic component 9 moves downward with the lead portion 6 being clamped.

At the insertion station (K), the lead part 6 is clamped and lowered by the fixed piece 25 and the movable piece 26 until the tip of the lead part 6 is inserted into the mounting hole IO of the printed circuit board 7, and then the leaded electronic component 9 is inserted from above. Apply the pusher 27 to push it down, remove the fixed piece 25 and the movable piece 26, and use the pusher 27 to push down the electronic component 9 with leads. At this time, cream solder 2 is supplied by the cream solder feeder 28.
9 is applied onto the pattern portion 11.

Thereafter, the pusher 27 is further lowered to push down the electronic component 9, and the cap portion 5 and the pattern portion 11 are connected via the cream solder 29 as shown in (L).

At this time, since the mounting hole IO is smaller than the width of the terminal end of the tapered part of the lead part 6, the lead part 6 is wedged into the edge of the mounting hole 10, and the leaded electronic component 9 is firmly mounted to the printed circuit board 7. .

After that, the printed circuit board 7 is soldered by heating it by placing it in a furnace, by blowing hot air or by applying infrared rays, or by locally applying cream solder to the cream solder parts using a laser or light beam. Heat it to make a strong solder.

Although the above example uses a flat terminal material 13, it is also possible to use a terminal member 13 provided with a recess into which the electrode portion 3 fits securely.

To fix the lead part 6 to the printed circuit board, it may be temporarily fixed by inserting it from the back side and bending the tip of the lead part 6.

The lead portion 6 is not limited to a flat plate shape, but may be wire shaped.

〔Effect of the invention〕

According to the present invention, the electrical connection between the lead part and the chip-shaped electronic component is ensured, and it is possible to provide a simple and highly reliable mounting method for the chip-shaped electronic component, which has extremely great practical effects. play.

[Brief explanation of the drawing]

The drawings relate to an embodiment of the present invention, and FIG. 1 is a front view, FIGS. 2 and 3 are a plan view and a side view thereof, and FIG. 4 is a cross-sectional plan view taken along line I-1 in FIG. FIG. 5 is a plan view corresponding to FIG. 4 of another embodiment. FIGS. 6, 7, and 8 are a front view, top view, and side view of another embodiment, respectively. FIG. 9 is a manufacturing process and an insertion process. (For (M) only, mark (L) with arrow ■
1O is a cross-sectional side view taken along line mm in FIG. 24 is a cross-sectional side view taken along the line IV-IV in FIG. 9(H). ■... Chip-shaped electronic component, 2... Main body, 3... Electrode part, 6... Lead part, 7... Printed circuit board, 8...
...Welded part, 9...Electronic component with lead, 10...
Mounting hole, 11... Pattern part, 12... Cream solder, 13... Terminal material, 14... Arrow, 15...
・Receiving mold, 16... Guide, 17... Pressing die, 18...
・Electrode, 22... Flat cutter, 23... Mountain cutter, 24... Valley cutter, 25... Fixed piece, 2
6... Movable piece, 27... Butcher 128... Cream solder feeder, 29... Cream solder, 31
...Electronic component series, (E) Chip-shaped electronic component welding station, (H) Cutting station, (K) Insertion station. Patent Applicant: TDC Co., Ltd. Representative Patent Attorney Masayuki Takagi Representative Patent Attorney Minoru Yakushi Representative Patent Attorney Yoi 1) Takatsugu Japanese Movies 1 Figure 3 Figure 6 Figure 7 Bronze Figure 8

Claims (1)

[Claims] 1. A lead-equipped electronic component is formed by welding a lead section to an electrode section of a chip-shaped electronic component, and then the electrode section or the lead section of the lead-equipped electronic component is welded to the electrode section of the chip-shaped electronic component. The lead part is inserted into the mounting hole of the board and fixed while connecting it to the pattern part of the board via cream solder, and then the cream solder connection part in the pattern part is heated and soldered. A method for mounting a chip-shaped electronic component, characterized by: 2. The method according to claim 1, wherein the lead portion is inserted and fixed into the mounting hole of the substrate by bending the tip of the lead portion on the back surface of the substrate. 3. The lead part and/or the mounting when the lead part is inserted into the mounting hole of the board and the lead part having a width slightly larger than the diameter of the mounting hole is forcefully inserted into the mounting hole. The method according to claim 1, which is carried out by deforming a hole. 4. The method according to claim 3, wherein the tip of the lead portion is formed in a tapered shape. 5. Hold two strip-shaped terminal materials with continuous lead parts inserted into the mounting holes of the board in parallel, and weld and fix the chip-shaped electronic component to the terminal materials between the two terminal materials. to form an electronic component chain, and from the electronic component chain, cut out one by one the leaded electronic components formed by sandwiching one chip-shaped electronic component between a pair of lead parts, and separate the leaded electronic components from the electronic component series. , while connecting the electrode part or lead part and the pattern part of the board through cream solder, inserting and fixing the lead part into the mounting hole of the board, and then connecting with cream solder in the pattern part. A method for attaching chip-shaped electronic components, characterized by heating and soldering the parts. 6. The method according to claim 5, characterized in that, when cutting off the leaded electronic component, the tip of the lead portion is cut into a tapered shape. 7. The lead portion and/or the mounting when the lead portion is inserted and fixed into the mounting hole of the board by forcefully inserting the lead portion having a width slightly larger than the diameter of the mounting hole into the mounting hole. 7. The method according to claim 6, which is carried out by deforming the hole.