JPS62289365A - Automatic soldering device - Google Patents
Automatic soldering deviceInfo
- Publication number
- JPS62289365A JPS62289365A JP13137786A JP13137786A JPS62289365A JP S62289365 A JPS62289365 A JP S62289365A JP 13137786 A JP13137786 A JP 13137786A JP 13137786 A JP13137786 A JP 13137786A JP S62289365 A JPS62289365 A JP S62289365A
- Authority
- JP
- Japan
- Prior art keywords
- board
- warp
- warping
- automatic soldering
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 claims abstract description 26
- 238000001816 cooling Methods 0.000 claims abstract description 14
- 230000002265 prevention Effects 0.000 claims description 33
- 239000000758 substrate Substances 0.000 claims description 10
- 230000003449 preventive effect Effects 0.000 abstract description 7
- 230000005540 biological transmission Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔発明の目的〕
（産業上の利用分野）
本発明は、はんだ付けされるプリン１−配線３Ｊ板の反
り防止に特徴を右する自動は／Ｖだ伺は装置に関するも
のである。Detailed Description of the Invention 3. Detailed Description of the Invention [Object of the Invention] (Industrial Field of Application) The present invention provides an automatic method for preventing warpage of the printed circuit board 1-wiring 3J board to be soldered. /V is related to equipment.
（従来の技術）
従来、実公昭５９−２２９３３号公報に示されるように
、噴流式はんだ槽の上部に基板搬送方向に反り防止体が
設けられ、この反り防止体によってプリント配線基板の
下面が係止されることにより、前記はんだ槽の溶融はん
だから与えられる熱によるプリント配線基板の下反りが
防止されるものがある。(Prior Art) Conventionally, as shown in Japanese Utility Model Publication No. 59-22933, a warpage preventive body is provided at the top of a jet soldering bath in the board transport direction, and this warpage preventive body prevents the lower surface of the printed wiring board from being engaged. In some cases, the printed wiring board is prevented from warping due to the heat applied from the molten solder in the solder bath.
〈発明が解決しようとする問題点）
しかし、このようにはんだ檜の上部のみでプリント配線
基板の反り防止が図られても、その反り防止は効果的に
なされないものである。熱によるプリント配線基板の反
りが有効に防止されるには自動はんだ付け装置の全体に
わたってプリント配線基板の加熱温度がどのように変化
されるかを考慮しなければならない。(Problems to be Solved by the Invention) However, even if the printed wiring board is prevented from warping only by using the upper part of the solder cylindrical as described above, the warpage cannot be effectively prevented. In order to effectively prevent warping of the printed wiring board due to heat, it is necessary to consider how the heating temperature of the printed wiring board is changed throughout the automatic soldering apparatus.
本発明の目的は、噴流式はんだ槽の上部だけでなくプリ
ヒータの上部さらには冷却ファンの上部においてさえも
プリント配線基板の湿度が反りの原因となるほど高いこ
とに鑑みなされたもので、プリント配ｙＡ基板の熱によ
る反りを真に防止することにある。The object of the present invention was made in view of the fact that the humidity of printed wiring boards is high enough to cause warping not only in the upper part of the jet soldering bath but also in the upper part of the preheater and even the upper part of the cooling fan. The purpose is to truly prevent the board from warping due to heat.
（問題点を解決するための手段）
本発明は、はんだ付けされるプリント配線基板Ｐ＠搬送
するための搬送コンベヤ１１に沿って少なくともフラク
サ１２、プリヒータ１４、噴流式はんだ槽１６および冷
却ファン１７が順次配設された自動はんだ付け装置にお
ける反り防止に関するものであり、そして前記プリヒー
タ１４の上部にこのプリヒータ１４から与えられる熱に
よる前記基板Ｐの下反りをこの基板の下面にて防止する
ための第１の反り防止”体２１が基板搬送方向に設けら
れ、また前記はんだ槽１６の上部にこのはんだ槽の溶融
はんだから与えられる熱による前記基板の下反りをこの
基板の下面にて防止するための第２の反り防止体２２が
基板搬送方向に設けられ、さらに前記冷却ファン１７の
上部に前記はんだ槽１Ｇ上で与えられた余熱による前記
基板の下反りをこの基板の下面にて防止するための第３
の反り防止体２３が基板１′８送方向に設けられたもの
である。(Means for Solving the Problems) The present invention provides at least a fluxer 12, a preheater 14, a jet soldering bath 16, and a cooling fan 17 along a conveyor 11 for conveying printed wiring boards P@ to be soldered. This is related to warpage prevention in automatic soldering equipment that is sequentially arranged, and is a method for preventing downward warpage of the board P due to heat applied from the preheater 14 to the upper part of the preheater 14 on the lower surface of the board. A warpage prevention body 21 is provided in the board transport direction, and a warpage prevention body 21 is provided above the solder tank 16 to prevent the board from warping downward due to heat applied from molten solder in the solder tank on the bottom surface of the board. A second warp prevention body 22 is provided in the board transport direction, and is further provided above the cooling fan 17 to prevent the board from warping downward due to residual heat applied on the solder bath 1G on the bottom surface of the board. Third
A warpage prevention body 23 is provided in the feeding direction of the substrate 1'8.
（作用）
本発明は、第１の反り防止体２１によってプリヒータ１
４の上部でのプリント配Ｉ！Ｊｌ板Ｐの下方への反りを
防止し、また第２の反り防止体２２によって噴流式（よ
んだ槽１６の上部での基板の下方への反りを防止し、さ
らに第３の反り防止体２３によって冷却ファン１７の上
部での基板の下方への反りを防１１する。(Function) In the present invention, the first warp prevention body 21 prevents the preheater 1 from being heated.
Print arrangement at the top of 4! The Jl board P is prevented from warping downward, and the second warpage prevention body 22 prevents the board from warping downward at the top of the jet type (reading tank 16), and the third warpage prevention body 23 This prevents the board from bowing downward at the top of the cooling fan 17.
（実施例）
以下、本発明を第１図乃至第８図に示される第１実施例
と、第９図および第１０図に示される第２実施例とを参
照して詳細に説明する。(Example) Hereinafter, the present invention will be described in detail with reference to a first embodiment shown in FIGS. 1 to 8, and a second embodiment shown in FIGS. 9 and 10.
第１図に示される自動はんだ付け装置は、はんだ付けさ
れるプリント配線基板を搬送するためノ搬送コンベヤ１
１に沿って発泡式フラクサ１２、エアナイフ１３、プリ
ヒータ１４、熱風ヒータ１５．１０流式はんだ槽１６、
冷却ファン１７、型洗浄装置１８が順次配；Ωされてい
る。The automatic soldering apparatus shown in FIG. 1 includes a conveyor 1 for conveying printed wiring boards to be soldered.
1 along with a foaming fluxer 12, an air knife 13, a preheater 14, a hot air heater 15.
A cooling fan 17 and a mold cleaning device 18 are sequentially arranged.
そして前記プリヒータ１４の上部にこのプリヒータ１４
から与えられる熱による前記３Ｘｔ板の下方への反りを
この基板の下面にて防止するための第１の反り防止体２
１が基板搬送方向に設けられ、また前記はｌｖＰ槽１６
の上部にこのはんだ槽１６の溶融はんだから与えられる
熱による前記基板の不反りをこの基板の下面にて防止す
るための第２の反り防止体２２が基板搬送方向に設けら
れ、さらに前記冷却ファン１７の上部に＠記はんだ槽１
６上で与えられた余熱による前記基板の下反りをこの基
板の下面にて防止するための第３の反り防止体２３が基
板搬送方向に設けられている。なお前記搬送］ンベＸ７
１１の搬入側には基板挿入ガイド２４が設けられ、１″
Ｔｊ記搬送コ、ンベヤ１１の搬出側には基板取出ガイド
２５が設けられている。This preheater 14 is placed above the preheater 14.
A first warpage prevention body 2 for preventing the 3Xt board from warping downward due to heat applied from the bottom surface of the board.
1 is provided in the substrate transport direction, and the lvP tank 16 is
A second warp prevention body 22 is provided in the board transport direction on the top of the board to prevent the board from warping on the bottom surface of the board due to the heat applied from the molten solder in the solder bath 16. At the top of 17, solder bath 1 is marked @.
A third warpage prevention member 23 is provided in the substrate transport direction to prevent the substrate from warping downward due to residual heat applied on the substrate 6 on the lower surface of the substrate. In addition, the above-mentioned transportation] Nbe X7
A board insertion guide 24 is provided on the loading side of 11.
On the unloading side of the conveyor 11, a substrate unloading guide 25 is provided.
第２図に示されるように前記搬送コンベ１１は、左右両
側部にそれぞれ外側凹形板と内側凹形板とによって形成
されたコンベヤレール３１が平行に配設され、この両側
のコンベヤレール３１の内部に基板ｍ応用無端ヂエン３
２がＩｚ動自在に配設され、この両側の無端チェン３２
を構成する各々の」一部リンクプレ−１−３３に基板搬
送爪３４が所定ピッチで取付けられたものであり、この
両側の搬送爪３４によってプリント配線基板Ｐが挟持さ
れている。As shown in FIG. 2, the conveyor 11 has parallel conveyor rails 31 formed by an outer concave plate and an inner concave plate on both left and right sides, and the conveyor rails 31 on both sides are arranged in parallel. Internal board m application endless die 3
2 is disposed so as to be freely movable, and endless chains 32 on both sides thereof
Board conveying claws 34 are attached at a predetermined pitch to each of the partial link plates 1-33 constituting the board, and the printed wiring board P is held between the conveying claws 34 on both sides.
さらにこの第２図に示されるように、前記搬送コンベヤ
１１の両側のコンベヤレール３１の下面に取付板４１．
４２を介してバー４３が横設され、このバー４３によっ
て前記第１の反り防止体２１が支持されている。前記バ
ー４３は１個の反り防止体２１に対し２本が平行に設け
られ、この２本のバー４３に前記反り防止体２１の両端
部が摺動自在に嵌着され、バー４３に沿って幅方向に移
動調整可能となっている。Furthermore, as shown in FIG. 2, mounting plates 41.
A bar 43 is installed horizontally through the bar 42, and the first warp prevention body 21 is supported by the bar 43. Two bars 43 are provided in parallel to one warp preventer 21 , and both ends of the warp preventer 21 are slidably fitted to these two bars 43 . It can be moved and adjusted in the width direction.
そして前記反り防止体２１は、プリント配線基板Ｐの幅
寸法の変更や搭載部品の変更等に対応して手で幅方向に
移動調整され、基板Ｐの中央部分や搭載部品と干渉しな
い部分に位置される。前記バー４３には反り防止体２１
の幅調整位置を示すための目盛（図示せず）が加工され
ている。The warpage prevention body 21 is manually moved and adjusted in the width direction in response to changes in the width dimension of the printed wiring board P, changes in the mounted components, etc., and is positioned in the center of the board P or in a portion where it does not interfere with the mounted components. be done. The bar 43 has a warpage prevention body 21
A scale (not shown) is machined to indicate the width adjustment position.
第２および第３の反り防止体２２．２３も第１の反り防
止体２１と同様に搬送コンベヤ１１のコンベヤレール３
１に横設されたバーによって幅方向に移動調整可能に支
持されている。The second and third anti-warping bodies 22 and 23 are also attached to the conveyor rail 3 of the conveyor 11 in the same way as the first anti-warping body 21.
It is supported by a bar installed horizontally at 1 so as to be adjustable in movement in the width direction.
前記バー４３の一端部はその部分に螺合された固定ナツ
ト４４によって一側の取付板４１に固定され、これに対
しバー４３の他端部に螺着されたナツト４５はストッパ
として機能し、第３図に示されるように他側の取付板４
２はこれに一体的に嵌着された軸受ブツシュ４Ｇを介し
て前記バー４３に対し移動自在に設けられている。そし
て右側のコンベヤレール３１がプリント配線基板Ｐの幅
寸法の変更に対応して左右方向に移動調整されると、前
記取付板４２も固定バー４３に対し移動される。One end of the bar 43 is fixed to one side of the mounting plate 41 by a fixing nut 44 threaded onto that part, while a nut 45 threaded onto the other end of the bar 43 functions as a stopper. The mounting plate 4 on the other side as shown in FIG.
2 is movably provided with respect to the bar 43 via a bearing bush 4G that is integrally fitted therewith. When the conveyor rail 31 on the right side is adjusted to move in the left-right direction in response to a change in the width dimension of the printed wiring board P, the mounting plate 42 is also moved relative to the fixing bar 43.
第４図は前記プリヒータ１４における反り防止部分を示
し、ヒータケース５１の内部に設けられたヒータ本体５
２の上側に平行間隔を介し前記反り防止板２１が設けら
れ、この反り防止板２１の上面でプリント配線基板Ｐの
下面が押上げられる。第５図に示されるように前記反り
防止体２１は、両端部に前記バー４３と嵌合する座部５
３を有し、この両端の座部５３には前記バー４３との嵌
合溝５４が設けられ、前記バー４３に圧接される止めね
じ５５が螺合されている。FIG. 4 shows a warpage prevention portion of the preheater 14, which is provided in the heater main body 5 provided inside the heater case 51.
The warpage prevention plate 21 is provided on the upper side of the printed wiring board P with a parallel interval therebetween, and the lower surface of the printed wiring board P is pushed up by the upper surface of this warpage prevention plate 21. As shown in FIG. 5, the warp prevention body 21 has seat portions 5 at both ends that fit into the bars 43.
3, and the seat portions 53 at both ends thereof are provided with fitting grooves 54 for engaging the bar 43, and a set screw 55 that is pressed against the bar 43 is screwed into the seat portion 53.
第６図は前記噴流式はんだ槽１６における反り防止部分
を示し、溶融はんだ６１を噴流するノズル６２の上側に
前記第２の反り防止体２２が設けられている。この第２
の反り防止体２２の上面は、プリント配線基板Ｐの上背
傾斜状の搬送経路に対応して傾斜状に形成され、この反
り防止体２２の傾斜上面には、第７図にも示されるよう
に前記ノズル６２の噴出口の上側にて反り防止体２２と
プリント配置；Ａｍｍ板上の接触を一時的に解除して基
板Ｐに対する溶融はんだ６１の接触を確実にする第１の
凹溝６３と、基板搬入側で反り防止体２２とプリント配
線基板Ｐとの接触を−ｆｆ１的に解除してこの反り防止
体２２と基板Ｐとの接触面での酸化物（この酸化物は、
反り防止体２２とプリント配線基板Ｐとの接触部分が長
いとその部分に溜りやすく、プリント配線基板Ｐに附着
してはんだ付け特性を劣化さゼる）の溜りを防止する第
２の凹溝６４とが、プリント配線基板Ｐの落込みを防止
する凸部６５を介して設けられている。またこの第２の
反り防止体２２には、下部に前記ノズル６２の上部との
干渉を防ぐ凹溝６６が設けられ、さらに一端部の下面と
他端部の座部６７の下面とに前記支持バー４３との嵌合
溝６８が設けられ、そして座部６７には止めねじ６９が
設けられている。FIG. 6 shows a warpage preventing portion in the jet solder bath 16, in which the second warpage preventer 22 is provided above a nozzle 62 that jets molten solder 61. This second
The upper surface of the warpage prevention body 22 is formed in an inclined shape corresponding to the upwardly inclined conveyance path of the printed wiring board P. The anti-warpage body 22 is printed on the upper side of the spout of the nozzle 62; a first groove 63 that temporarily releases the contact on the Amm plate to ensure the contact of the molten solder 61 with the substrate P; , on the board loading side, the contact between the warp preventer 22 and the printed wiring board P is released in a -ff1 manner, and an oxide (this oxide is
If the contact area between the warpage prevention body 22 and the printed wiring board P is long, the second groove 64 prevents the accumulation of particles (which tend to accumulate in that area and adhere to the printed wiring board P and deteriorate the soldering characteristics). is provided via a convex portion 65 that prevents the printed wiring board P from falling. Further, this second anti-warp body 22 is provided with a groove 66 in its lower part to prevent interference with the upper part of the nozzle 62, and is further provided with the support on the lower surface of one end and the lower surface of the seat part 67 of the other end. A fitting groove 68 with the bar 43 is provided, and a set screw 69 is provided in the seat portion 67.
第８図は前記冷却ファン１７の反り防止部分を示し、こ
の冷却ファン１７には風′！１【ノ板７１が設けられ、
この風道は板７１によって前記溶融はんだ６１とプリン
ト配！９ＩＭ板Ｐとの１ｌｌ１１！ｌ１２部分に冷圧が
送られることが防止されるようになっているから、前記
第３の反り防止体２３の下部には前記風道は板７１との
干渉を防ぐ切欠部１２が設けられている。この反り防止
体２３の支持手段は第２の反り防止体２２と同様である
。FIG. 8 shows the warpage prevention portion of the cooling fan 17, and the cooling fan 17 has a wind '! 1 [No board 71 is provided,
This air passage is connected to the molten solder 61 by the plate 71! 1ll11 with 9IM board P! Since cold pressure is prevented from being sent to the portion 112, a notch 12 is provided in the lower part of the third anti-warp body 23 to prevent the air passage from interfering with the plate 71. There is. The support means for this anti-warp body 23 is the same as that for the second anti-warp body 22.
第９図および第１０図は第２実施例を示し、はんだ付け
されるプリント配線基板を搬送するための搬送コンベヤ
１１に沿って発泡式フラクサ１２、エアナイフ１３、プ
リヒータ１４、熱風ヒータ１５、イ１流式はんだ槽１６
、冷却ファン１７が順次配設されている点は第１実施例
と同様である。9 and 10 show a second embodiment, in which a foam fluxer 12, an air knife 13, a preheater 14, a hot air heater 15, and a Flow type solder bath 16
, the cooling fans 17 are arranged in sequence, which is the same as in the first embodiment.
第１実施例と異なる主な点は、プリヒータ１４上の第１
の反り防止体８１、はんだ槽１６上の第２の反り防止（
Ａｓ２および冷却ファン１７上の第３の反り防止体８３
がいずれ心幅調整用ねじによって幅方向に移動：Ｊ４整
されることと、第２および′；５３の反り防止体８２．
８３が片持ち支持されていることである。The main difference from the first embodiment is that the first
warpage prevention body 81 , a second warpage prevention body (
Third anti-warp body 83 on As2 and cooling fan 17
is eventually moved in the width direction by the core width adjustment screw: J4, and the second and '; 53 warp prevention bodies 82.
83 is supported in a cantilevered manner.
前記第１の反り防止体８１の移動調整線描は、前記ヒー
タ１４のケース両側部に取付板を介して幅′Ａ整用ねじ
棒８４が回動自在に軸支され、この両側のねじ捧８４に
前記反り防止体８１の両端部が螺合され、またヒータ１
４のケース中央部に取付板を介して回転軸８５が回転自
在に設けられ、この回転軸８５と前記両側のねじ棒８４
との間にスブ［１ケツト・エンドレス゛ＩＩンによる回
転伝達機構８６が設けられている。そうして、ハンドル
８７によって回転＠８５が回転されると、その回転が両
側の回転伝達ｎ ４ｂ１８６を介して両側のねじ棒８４
に伝えられ、この両側のねじ棒８４は同一方向に等しく
回転するので、この両側のねじ捧８４と螺合する第１の
反り防止体８１は、基板幅が変更された場合などに図示
する状７５と平行に幅方向へ移動調整され、基板の中央
部に移動調整される。The movement adjustment line of the first anti-warp body 81 is shown in that a width 'A adjustment threaded rod 84 is rotatably supported on both sides of the case of the heater 14 via a mounting plate, and the threaded rods 84 on both sides are rotatably supported. Both ends of the warpage prevention body 81 are screwed together, and the heater 1
A rotary shaft 85 is rotatably provided in the center of the case of No. 4 via a mounting plate, and this rotary shaft 85 and the threaded rods 84 on both sides are connected to each other.
A rotation transmission mechanism 86 using a single-ket endless tube is provided between the two. Then, when the rotation @85 is rotated by the handle 87, the rotation is transmitted to the threaded rods 84 on both sides via the rotation transmission n4b186 on both sides.
is transmitted, and the threaded rods 84 on both sides rotate equally in the same direction. Therefore, the first anti-warp body 81, which is threadedly engaged with the threaded rods 84 on both sides, is rotated in the shape shown in the figure when the board width is changed. It is moved and adjusted in the width direction parallel to 75, and is moved and adjusted to the center of the board.
さらに前記第２および第３の反り防止体８２゜８３は、
それぞれ下側のガイド軸９１に摺動自在にｉ矢金される
とともに上側の幅調整用ねじ棒９２に螺合され、このね
じ捧９２の一端に設けられたハンドル９３によってねじ
棒９２が回転されると、１１４記ｒ１持ち支持の反り防
止体８２．８３は基板幅の変更等に対応して幅方向に移
動調整される。Furthermore, the second and third anti-warpage bodies 82 and 83 are
They are each slidably attached to a lower guide shaft 91 and are screwed to an upper width adjustment threaded rod 92, and the threaded rod 92 is rotated by a handle 93 provided at one end of this threaded rod 92. Then, the anti-warping bodies 82 and 83 supported by r1 in No. 114 are moved and adjusted in the width direction in response to changes in the substrate width.
、なお前記第１実施例および第２実施例において、反り
防止体は１列に設けたが、本発明はこれに限定されるも
のではなく、第１、第２および第３の反り防止体はそれ
ぞれ複数列に配設してもよい。Note that in the first and second embodiments, the warp preventers are provided in one row, but the present invention is not limited to this, and the first, second, and third warp preventers are provided in one row. Each may be arranged in multiple rows.
本発明によれば、従来の基板反り防止でｙ２されていた
噴流式はんだ槽の上部だけでなく、ブリヒータの上部さ
らには冷却ファンの上部においてもそれぞれ反り防止体
によって熱による基板の反りを防止するようにしたから
、前記はんだ槽への搬入前の反りおよびはんだ槽から搬
出後の反りをそれぞれ防止することによって、はんだ槽
上での反り防止を実効あらしめ、基板の反りを真に防止
できる。According to the present invention, warping of the board due to heat is prevented by using warp prevention bodies not only at the top of the jet soldering bath, which was conventionally used to prevent board warping, but also at the top of the pre-heater and even the top of the cooling fan. By doing so, by preventing warpage before being carried into the solder bath and warping after being carried out from the solder bath, it is possible to effectively prevent warpage on the solder bath and to truly prevent warping of the board.
第１図は本発明の自動はんだ付け装置の一実施例を承り
平面図、第２図は第１図のＩ［−ＩＩ線ｒ９１面図、第
３図１．ｉ第２図の■−■線所筒所面図４図は第１図の
ＩＶ −ＩＶ線断面図、第５図はその第１の反り防止体
の斜視図、第６図は第１図の■−ｖｔ ａ断面図、第７
図（ユその第２の反り防止体の斜視図、第８図は第１図
の■−■線断面図、第９図は本発明の第２実Ｉ７１！例
を示す平面図、第１０図はその側面図である。
１１・・搬送コンベヤ、１２・・フラクサ、１４・・ブ
リヒータ、１６・・噴流式はんだ槽、１７・・冷Ｉｎフ
ァン、２１・・第１の反り防止体、２２・・第２の反り
防止体、２３・・第３の反り防止体、Ｐ・・プリント配
線基板。FIG. 1 is a plan view of an embodiment of the automatic soldering apparatus of the present invention, FIG. 2 is a plan view of line I[-II r91 in FIG. 1, and FIG. i Figure 4 is a cross-sectional view taken along the line IV--IV in Figure 1, Figure 5 is a perspective view of the first anti-warping body, and Figure 6 is a cross-sectional view of the first anti-warp body. ■-vt a cross-sectional view, 7th
(U) A perspective view of the second anti-warping body, FIG. 8 is a sectional view taken along the line ■-■ in FIG. 1, FIG. 9 is a plan view showing the second example of the present invention, and FIG. is a side view thereof. 11. Conveyor, 12. Fluxer, 14. Pre-heater, 16. Jet solder tank, 17. Cold In fan, 21. First warpage prevention body, 22. - Second warpage prevention body, 23.. Third warpage prevention body, P.. Printed wiring board.
Claims (3)
めの搬送コンベヤに沿つて少なくともフラクサ、プリヒ
ータ、噴流式はんだ槽、および冷却ファンが順次配設さ
れた自動はんだ付け装置において、前記プリヒータの上
部にこのプリヒータから与えられる熱による前記基板の
下反りをこの基板の下面にて防止するための第１の反り
防止体が基板搬送方向に設けられ、前記はんだ槽の上部
にこのはんだ槽の溶融はんだから与えられる熱による前
記基板の下反りをこの基板の下面にて防止するための第
２の反り防止体が基板搬送方向に設けられ、前記冷却フ
ァンの上部に前記はんだ槽上で与えられた余熱による前
記基板の下反りをこの基板の下面にて防止するための第
３の反り防止体が基板搬送方向に設けられたことを特徴
とする自動はんだ付け装置。(1) In an automatic soldering apparatus in which at least a fluxer, a preheater, a jet soldering bath, and a cooling fan are sequentially arranged along a conveyor for conveying printed wiring boards to be soldered, the upper part of the preheater is A first warpage prevention body is provided in the board transport direction to prevent the board from warping downward due to the heat applied from the preheater on the lower surface of the board, and is provided at the top of the solder tank from the molten solder in the solder tank. A second warp prevention body is provided in the board transport direction to prevent the board from warping downward due to the heat applied to the bottom surface of the board, and a second warp prevention body is provided in the board transport direction to prevent the board from warping downward due to the heat applied. An automatic soldering apparatus characterized in that a third warp prevention body for preventing downward warpage of the board on the lower surface of the board is provided in the board transport direction.
ベヤに横設されたバーによって幅方向に移動調整可能に
支持され、プリント配線基板の幅寸法の変更に対応して
移動調整されることを特徴とする特許請求の範囲第１項
記載の自動はんだ付け装置。(2) The first, second, and third anti-warping bodies are supported by bars installed horizontally on the conveyor so that they can be moved in the width direction, and their movements can be adjusted in response to changes in the width dimension of the printed wiring board. An automatic soldering device according to claim 1, characterized in that:
配線基板との接触を一時的に解除して基板に対する溶融
はんだの接触を確実にする第１の凹溝およびこの反り防
止体と基板との接触面での酸化物の溜りを防止する第２
の凹溝が設けられたものであることを特徴とする特許請
求の範囲第１項記載の自動はんだ付け装置。(3) The second anti-warp body includes a first concave groove that temporarily releases the contact between the anti-warp body and the printed wiring board to ensure contact of the molten solder to the board, and the anti-warp body. The second layer prevents oxide buildup on the contact surface with the substrate.
2. The automatic soldering device according to claim 1, wherein the automatic soldering device is provided with a concave groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13137786A JPS62289365A (en) | 1986-06-06 | 1986-06-06 | Automatic soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13137786A JPS62289365A (en) | 1986-06-06 | 1986-06-06 | Automatic soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62289365A true JPS62289365A (en) | 1987-12-16 |
Family
ID=15056519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13137786A Pending JPS62289365A (en) | 1986-06-06 | 1986-06-06 | Automatic soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62289365A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02202094A (en) * | 1989-01-31 | 1990-08-10 | Yokota Kikai Kk | Board warpage preventing method and device therefor |
| JP2017098313A (en) * | 2015-11-19 | 2017-06-01 | パナソニックＩｐマネジメント株式会社 | Anti-warp fitting and dip soldering machine using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5721880A (en) * | 1980-07-15 | 1982-02-04 | Toshiba Corp | Semiconductor light emitting element and manufacture thereof |
| JPS6127167A (en) * | 1984-07-18 | 1986-02-06 | Sharp Corp | Camber preventive device in automatic soldering device |
-
1986
- 1986-06-06 JP JP13137786A patent/JPS62289365A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5721880A (en) * | 1980-07-15 | 1982-02-04 | Toshiba Corp | Semiconductor light emitting element and manufacture thereof |
| JPS6127167A (en) * | 1984-07-18 | 1986-02-06 | Sharp Corp | Camber preventive device in automatic soldering device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02202094A (en) * | 1989-01-31 | 1990-08-10 | Yokota Kikai Kk | Board warpage preventing method and device therefor |
| JP2017098313A (en) * | 2015-11-19 | 2017-06-01 | パナソニックＩｐマネジメント株式会社 | Anti-warp fitting and dip soldering machine using the same |
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