JPS6228760Y2 - - Google Patents
Info
- Publication number
- JPS6228760Y2 JPS6228760Y2 JP2779286U JP2779286U JPS6228760Y2 JP S6228760 Y2 JPS6228760 Y2 JP S6228760Y2 JP 2779286 U JP2779286 U JP 2779286U JP 2779286 U JP2779286 U JP 2779286U JP S6228760 Y2 JPS6228760 Y2 JP S6228760Y2
- Authority
- JP
- Japan
- Prior art keywords
- protruding electrode
- lead
- melting point
- protruding
- point metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229920006015 heat resistant resin Polymers 0.000 claims description 4
- 238000000034 method Methods 0.000 description 9
- 229920001721 polyimide Polymers 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000009719 polyimide resin Substances 0.000 description 5
- 238000007747 plating Methods 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920003192 poly(bis maleimide) Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2779286U JPS6228760Y2 (US07321065-20080122-C00020.png) | 1986-02-27 | 1986-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2779286U JPS6228760Y2 (US07321065-20080122-C00020.png) | 1986-02-27 | 1986-02-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6249241U JPS6249241U (US07321065-20080122-C00020.png) | 1987-03-26 |
| JPS6228760Y2 true JPS6228760Y2 (US07321065-20080122-C00020.png) | 1987-07-23 |
Family
ID=30830154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2779286U Expired JPS6228760Y2 (US07321065-20080122-C00020.png) | 1986-02-27 | 1986-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228760Y2 (US07321065-20080122-C00020.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5855361B2 (ja) * | 2011-05-31 | 2016-02-09 | 三菱電機株式会社 | 半導体装置 |
-
1986
- 1986-02-27 JP JP2779286U patent/JPS6228760Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6249241U (US07321065-20080122-C00020.png) | 1987-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5874784A (en) | Semiconductor device having external connection terminals provided on an interconnection plate and fabrication process therefor | |
| EP1020903B1 (en) | A semiconductor device using a lead frame and its manufacturing method | |
| JP2003133508A (ja) | 半導体装置 | |
| JPS6228760Y2 (US07321065-20080122-C00020.png) | ||
| JP3951462B2 (ja) | 電子部品実装体及びその製造方法 | |
| JPS62169433A (ja) | 半導体装置の製造方法 | |
| JP2514291B2 (ja) | 半導体回路装置の製造方法 | |
| JPH053280A (ja) | 半導体装置 | |
| JP2979880B2 (ja) | 複合リードフレームおよびその製造方法 | |
| JPH0436114Y2 (US07321065-20080122-C00020.png) | ||
| JPH0442922Y2 (US07321065-20080122-C00020.png) | ||
| JP2986661B2 (ja) | 半導体装置の製造方法 | |
| JP3380058B2 (ja) | バンプ転写用フレーム | |
| JPS6334281Y2 (US07321065-20080122-C00020.png) | ||
| JP2593912B2 (ja) | リードフレーム | |
| JP2767978B2 (ja) | はんだパッドの製造方法とはんだパッド | |
| JPH07135203A (ja) | 半導体装置 | |
| JP2848373B2 (ja) | 半導体装置 | |
| JPS5815252A (ja) | バンプ構造 | |
| JPH0214536A (ja) | フリップチップ実装構造 | |
| JP3304447B2 (ja) | 電子部品搭載用基板 | |
| JPH0677285A (ja) | Ｉｃ素子の実装方法 | |
| JPH06209062A (ja) | 半導体装置とその製造方法 | |
| JPS6232636A (ja) | 半導体装置 | |
| JPH0466384B2 (US07321065-20080122-C00020.png) |
