JPS62284734A - Manufacture of metal foil-clad laminated sheet - Google Patents
Manufacture of metal foil-clad laminated sheetInfo
- Publication number
- JPS62284734A JPS62284734A JP61128496A JP12849686A JPS62284734A JP S62284734 A JPS62284734 A JP S62284734A JP 61128496 A JP61128496 A JP 61128496A JP 12849686 A JP12849686 A JP 12849686A JP S62284734 A JPS62284734 A JP S62284734A
- Authority
- JP
- Japan
- Prior art keywords
- metal foils
- laminate
- metal foil
- prepreg
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 37
- 239000002184 metal Substances 0.000 title claims abstract description 37
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000011888 foil Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 5
- 238000010030 laminating Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- 238000000465 moulding Methods 0.000 abstract description 10
- 230000002950 deficient Effects 0.000 abstract 1
- 238000003825 pressing Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- 235000003385 Diospyros ebenum Nutrition 0.000 description 1
- 241000792913 Ebenaceae Species 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
3、発明の詳細な説明
〔技術分野〕
本発明は電気機器、電子機器、電子計X磯、通信機器等
に用いられる金属箔張積層板の製造方法に関するもので
ある。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Technical Field] The present invention relates to a method for manufacturing metal foil-clad laminates used in electrical equipment, electronic equipment, electronic meters, communication equipment, etc. .
最近のt弐嘘器、電子Fl器、電子計算幅、通信機器等
には数多くの性能が要望される。例えば回路についても
従来は銅箔からの回路で殆んどの要望を満たすことがで
きたが最近は金、銀、白金等の回路が要望されることも
多くなって1走。しかし電気用積層板の製造寸法は約1
m X 1 m或は約1、mX2mと比較的大寸法で
金、銀、白金等の高価な金属箔を厚み18〜70ミクロ
ンでlmX1mサイズで入手することは納期、ロフトサ
イズ等で困難であった。A large number of performances are required of recent electronic devices, electronic FL devices, electronic computing devices, communication devices, and the like. For example, in the past, most requests for circuits could be met with circuits made of copper foil, but recently there have been increasing requests for circuits made of gold, silver, platinum, etc. However, the manufacturing dimensions of electrical laminates are approximately 1
It is difficult to obtain expensive metal foil such as gold, silver, platinum, etc. with a thickness of 18 to 70 microns and a size of 1 m x 1 m, which has relatively large dimensions of 1 m x 1 m or about 1 m x 2 m, due to delivery times, loft size, etc. Ta.
本発明の目的とするところは外形寸法の小さい金属箔で
もって定尺サイズの!!l:用債層板を製造することの
できる金属箔張積層板の製造方法を提供することにある
。The object of the present invention is to produce a standard size metal foil with small external dimensions! ! l: An object of the present invention is to provide a method for manufacturing a metal foil-clad laminate that can produce a bond laminate.
本発明は所要枚数のプリプレグの上面及び又は下面に金
属箔を配設した積層体を8m層成形する金属箔張y1層
板の製造方法において、プリプレグ面積より小面積の金
属箔を用い、金属箔と金属箔とのラップ間距離を3a以
下にすることを特徴とする金属箔張積層板の製造方法の
ため外形寸法の小さい金属箔であっても定尺サイズの電
気用積層板を得ることができるもので、以下本発明を詳
細に説明する。The present invention relates to a method for manufacturing a metal foil-clad Y1-layer plate in which a laminate having a required number of prepregs with metal foil arranged on the upper and/or lower surfaces is formed into 8 m layers, in which a metal foil having an area smaller than the area of the prepreg is used. Since the method for producing a metal foil-clad laminate is characterized in that the distance between the laps and the metal foil is set to 3a or less, it is possible to obtain a standard-size electrical laminate even when the metal foil has a small external dimension. The present invention will now be described in detail.
本発明に用いるプリプレグとしては、樹脂としてフェノ
−μ樹脂、クレゾー/%/樹脂、エボキV樹脂、不飽和
ポリエステ/L/#Ijt脂、メラミンイ對脂、ポリイ
ミド樹月旨、ポリアミドイミド樹脂、ジアリルフタレー
ト樹脂等の単独、混合物、変性物等の熱硬化性樹脂全般
を用いることができ特に限定するものではない。The prepreg used in the present invention includes resins such as pheno-μ resin, creso/%/resin, ebony V resin, unsaturated polyester/L/#Ijt resin, melamine resin, polyimide resin, polyamideimide resin, and diallyl phthalate. Thermosetting resins in general, including resins alone, mixtures, and modified products, can be used without any particular limitation.
基材としてはガラス、アスベスト等の無機繊維やホリエ
ステtv樹脂、ポリアミド樹脂、ポリビニルアルコ−I
v樹脂、ポリアクリ/I/樹脂、ポリウレタン樹脂等の
有機合成繊維や木綿等の天然繊維からなる織布、不織布
、寒冷紗、マット或は紙又はこれらの組合せ基材等でこ
れiた特に限定するものではない。金属箔としては銅、
アルミニウム、真鍮、ニッケμ、白金、金、銀郷のよう
な金属箔全般を用いることができ、必要に応じて金属箔
の片面に接着剤層を設はプリプレグとの接着性を更に向
上させることもできるものである。金属箔と金属箔との
ラップ間距離は3W以下であることが必要である。即ち
3履をこえると高圧多段プレス成形時の圧力を均一にす
ることができず積層成形不良が発生するためである。又
、金属箔と金属箔との間にラップがなければ積層成形時
にプリプレグから滲出する樹脂が金属箔表面を汚染した
り、成形プレートを汚染するためラップ間距離をとるこ
とは必要である。Base materials include glass, inorganic fibers such as asbestos, Holieste TV resin, polyamide resin, polyvinyl alcohol-I
v. Woven fabrics, non-woven fabrics, cheesecloth, mats, paper, or combinations of these materials made of organic synthetic fibers such as resins, polyacrylic/I/resins, and polyurethane resins, and natural fibers such as cotton, which are particularly limited. isn't it. Copper as metal foil,
All metal foils such as aluminum, brass, nickel μ, platinum, gold, and silver can be used, and if necessary, an adhesive layer can be provided on one side of the metal foil to further improve the adhesiveness with the prepreg. It is also possible. It is necessary that the distance between the laps between the metal foils is 3W or less. That is, if the number exceeds 3, the pressure during high-pressure multi-stage press molding cannot be made uniform and lamination molding defects will occur. Furthermore, if there is no wrap between the metal foils, the resin exuding from the prepreg during lamination molding will contaminate the metal foil surface and the molding plate, so it is necessary to provide a distance between the wraps.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
実施例
厚さ02Mで1050 gun x 1050 wxの
エポキシmり旨含浸ガラス布プリプレグ8枚を重ねた上
面に、厚さ坊ミクロンで1050 X 526層の金箔
2枚を1050財の端部でラップ間距離を21mとして
重ね合せた後、成形圧力開−,170″Cで90分間l
1lI層成形して厚さり、S Mlの金張漬層板を得た
。Example: On the upper surface of 8 sheets of 1050 gun x 1050 wx epoxy impregnated glass cloth prepreg with a thickness of 02M, two sheets of gold foil with a thickness of 1050 x 526 layers were wrapped between the ends of the 1050 pieces. After overlapping at a distance of 21 m, molding pressure was opened and molded at 170″C for 90 minutes.
A gold-plated laminate of S Ml was obtained by molding a 1lI layer and increasing the thickness.
比較例1
実施例と同じプリプレグ8枚を重ねた上面に、厚さ坊ミ
クロンで1050 m x 525Nの金箔2枚を10
50 mの端部で突合せ状態にした後、実施例 と同様
に処理して厚さ1.61Elの金張債層板を得た。Comparative Example 1 Two sheets of gold foil of 1050 m x 525N were placed on the upper surface of 8 sheets of the same prepreg as in the example stacked together for 10 minutes.
After the ends of 50 m were brought into a butt state, they were treated in the same manner as in Example to obtain a gold-plated bond laminate having a thickness of 1.61 El.
比較例2
実施例と同じプリプレグ8枚を重ねた上面に、厚さ摺ミ
クロンで1050 # X 527層の金箔2枚を10
50層の端部でラップ間距離を4Mとして重ね合せた後
、実施例と同様に処理して厚さ1.6麿の金張債層板t
−潟九。Comparative Example 2 Two sheets of gold foil with a thickness of 1050 # x 527 microns were placed on the top surface of a stack of 8 sheets of the same prepreg as in the example.
After overlapping the 50 layers with a distance between laps of 4M at the end, the layers were treated in the same manner as in the example to form a gold-plated bond layer plate with a thickness of 1.6 mm.
- Lagoon.
本発明の金属箔張積層板にあっては、外形寸法の小さい
金属箔でもって定尺サイズの電気用偵層板を効率よく製
造することができ、金、銀、白金等のような汎用金倶箔
でなくても金属箔張積層板とすることができ、本発明の
優れていることを確認した。With the metal foil-clad laminate of the present invention, it is possible to efficiently produce a fixed-size electrical laminate using metal foil with a small external dimension, and it is possible to efficiently manufacture a regular-sized electrical laminate using metal foil with a small external dimension. It was confirmed that the present invention is superior because a metal foil-clad laminate can be made even if it is not a metal foil.
Claims (1)
箔を配設した積層体を積層成形する金属箔張積層板の製
造方法において、プリプレグ面積より小面積の金属箔を
用い、金属箔と金属箔とのラップ間距離を3mm以下に
することを特徴とする金属箔張積層板の製造方法。(1) In a method for manufacturing a metal foil-clad laminate in which a laminate is formed by laminating a required number of prepregs with metal foil arranged on the upper and/or lower surfaces, the metal foil and metal A method for producing a metal foil-clad laminate, characterized in that the distance between the wraps and the foil is 3 mm or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61128496A JPS62284734A (en) | 1986-06-03 | 1986-06-03 | Manufacture of metal foil-clad laminated sheet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61128496A JPS62284734A (en) | 1986-06-03 | 1986-06-03 | Manufacture of metal foil-clad laminated sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62284734A true JPS62284734A (en) | 1987-12-10 |
Family
ID=14986181
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61128496A Pending JPS62284734A (en) | 1986-06-03 | 1986-06-03 | Manufacture of metal foil-clad laminated sheet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62284734A (en) |
-
1986
- 1986-06-03 JP JP61128496A patent/JPS62284734A/en active Pending
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