JPS62277756A - Bending method for lead for ic package - Google Patents
Bending method for lead for ic packageInfo
- Publication number
- JPS62277756A JPS62277756A JP12073786A JP12073786A JPS62277756A JP S62277756 A JPS62277756 A JP S62277756A JP 12073786 A JP12073786 A JP 12073786A JP 12073786 A JP12073786 A JP 12073786A JP S62277756 A JPS62277756 A JP S62277756A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- package
- approximately
- bending
- tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005452 bending Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims description 22
- 238000003825 pressing Methods 0.000 claims description 5
- 238000007796 conventional method Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005336 cracking Methods 0.000 description 1
- 230000003811 curling process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔概 要〕
ＩＣパッケージからのリードをその引き出し部近傍で直
角に曲げ、さらにその先端をほぼ半円状にカーリング成
形する方法として、直角折り曲げにローラを用いること
により、リードの損傷を防止した成形を可能にする。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Summary] Right angle bending is a method of bending a lead from an IC package at a right angle near its lead-out portion and then curling its tip into a substantially semicircular shape. By using rollers, it is possible to mold the leads without damaging them.
この発明は、ＩＣ（インテグレイテドサーキット）パッ
ケージのリード折り曲げ加工法に係わり、さらに詳しく
言えば、リードに損傷の少ない直角折り曲げ方法に関す
る。The present invention relates to a lead bending method for an IC (integrated circuit) package, and more specifically, to a right angle bending method that causes less damage to the leads.
最近、【Ｃをプリント基板にはんだ付は面実装するパッ
ケージ形態の一種として、ＰＬＣＣ（Ｐｌａｓｔｉｃ
Ｌｃａｄｅｄ Ｃｈｉｐ Ｃａｒｒｉｅｒ）と呼ばれ、
ＩＣパッケージからのリードをその引き出し部近傍で直
角に曲げ、さらにその先端をパッケージ側にほぼ半円弧
状にカーリングしたものが採用されはじめている。Recently, PLCC (Plastic
It is called ``Lcaded Chip Carrier''.
The lead from the IC package is bent at a right angle near the lead-out part, and the tip is curled toward the package in an approximately semicircular arc shape.
従って、その複雑な構造にもかかわらず曲げ部分での微
小クランクやはんだ鍍金剥がれがなく、効率のよい成形
方法が要望されていた。Therefore, there has been a need for an efficient molding method that does not cause minute cranks or peeling of solder plating at bent portions despite its complicated structure.
［従来の技術と発明が解決しようとする問題点〕第６図
に示すごとく、従来のリード折り曲げ方法はリード先端
部３をカールさせた後、リードをプレス型２０．２０’
により挟みながら、擦りながら、押し曲げを行うために
、その曲がり部分２において、リードの微小なひび割れ
とはんだ鍍金の擦り取られが発生し、ＩＣの品質確保上
問題であった。[Prior art and problems to be solved by the invention] As shown in FIG. 6, the conventional lead bending method involves curling the lead tip 3 and then pressing the lead into a press mold 20.20'.
Since the lead is pressed and bent while being pinched and rubbed, small cracks in the lead and scraping off of the solder plating occur at the bent portion 2, which poses a problem in terms of ensuring the quality of the IC.
本発明はこのような点に鑑みて創作されたもので、簡易
な構成でＩＣリードに損傷を与えないＩＣリードの曲げ
加工法を提供することを目的としている。The present invention was created in view of the above points, and an object of the present invention is to provide a method for bending an IC lead with a simple structure and without damaging the IC lead.
そこで本発明では、従来技術によりＩＣリードの先端を
ほぼ３７８円弧状３に成形する第１の工程と、パフケー
ジ１からのＩＣリードの引き出し部近傍２をその板厚の
両面から挟持工具５，５゛により挟持しながら、折り曲
げの外側からローラ６により、そのリードの上記３７８
円弧部分の先端が挟持工具５にほぼ接触する程度に押し
曲げる第２の工程と、ｔＣパッケージ１を第２の挟持工
具７，７゛により挟持しながら、第２のローラ８が上記
ＩＣＩＪ−ドの外側４を直角折り曲げの方向に転動する
第３の工程と、ｒｃパッケージ１を第３の挟持工具９，
９゛により挟持し、かつ上記直角に折り曲がったリード
部分４を挟持工具１０．１０°により外部から挟持しな
がら、略半円状の凹部１２を有する工具１１が上記直角
に曲げられたリード部分４に平行に上記ほぼ３７８円弧
状のリード先端部分３をプレスすることによりほぼ半円
弧状にカーリングする第４の工程とを設ける。Therefore, in the present invention, the first step is to form the tip of the IC lead into an approximately 378-arc shape 3 using the conventional technique, and the gripping tools 5 and 5 are used to hold the IC lead from the puff cage 1 in the vicinity of the lead-out portion 2 from both sides of the plate thickness. While holding the lead with the roller 6 from the outside of the bend,
A second step of pressing and bending the tip of the circular arc portion to the extent that it almost contacts the clamping tool 5, and a second step of bending the tC package 1 by the second clamping tools 7, 7', while the second roller 8 a third step of rolling the outer side 4 of the rc package 1 in the direction of right-angled bending;
While holding the lead portion 4 bent at a right angle with the holding tool 10.9 and holding it from the outside with a holding tool 10. A fourth step is provided in which the lead tip portion 3 having a substantially 378-arc shape is pressed parallel to the curve 4 and curled into a substantially semi-circular arc shape.
上記問題点はこれらの工程によりなるＩＣパッケージの
リード折り曲げ法により解決される。The above-mentioned problems can be solved by the IC package lead bending method comprising these steps.
第１の工程は従来の技術のどのような方法によって加工
されてもよいので、特に説明はおこなわない。The first step may be processed by any conventional method, and therefore will not be particularly described.
第２の工程における挟持工具５，５゛はリード折り曲げ
によるリードの変形がパッケージ封止部におよんで、パ
ッケージを損傷することを防止すると共に、工具５の角
部は折り曲げの位置を規定している。折り曲げはローラ
６が回転することにより行われるのでリードを擦傷せず
、更にその当たりを柔らかくしてリードの損傷を防止し
ている。The holding tools 5, 5'' in the second step prevent lead deformation due to lead bending from reaching the package sealing part and damaging the package, and the corners of the tools 5 define the bending position. There is. Since the bending is performed by the rotation of the roller 6, the lead is not scratched, and the contact is made soft to prevent damage to the lead.
第３の工程における挟持工具７．７”はＩＣパッケージ
１の位置を固定し、第２工程で直角に至ってなかった曲
げを、ローラ８によって直角に仕上げるものである。ロ
ーラ８はリード上を転勤するためリードに擦傷を与えな
い、パフケージからの引き出し部近傍のり−ド２はこの
工程により幾分変形を受けるが、その変形量は僅かであ
りパッケージ封止部に損傷を与えない。The clamping tool 7.7'' in the third step fixes the position of the IC package 1, and the roller 8 finishes the bend that was not at a right angle in the second step.The roller 8 moves over the lead. The glue 2 near the lead-out part from the puff cage is deformed to some extent by this process, but the amount of deformation is so small that it does not damage the package sealing part.
第４工程における挟持工具９，９゛はパッケージ１を固
定し、カーリング工具１１はその半円状の凹部１２を、
すでに第１工程で略３７８円弧状に成形されているリー
ドの先端部３にプレスすることによりカーリングして半
円弧状に仕上げる。この際、挟持工具１０．１０’は第
３工程で既に直角に曲げられたリードを側面から挟持す
ることにより、このリードが外側に変形するのを防止し
ている。In the fourth step, the holding tools 9, 9' fix the package 1, and the curling tool 11 holds the semicircular recess 12.
The leading end portion 3 of the lead, which has already been formed into a substantially 378-arc shape in the first step, is pressed and curled into a semicircular arc shape. At this time, the clamping tool 10.10' clamps the lead that has already been bent at right angles in the third step from the side, thereby preventing the lead from deforming outward.
（実施例〕
以下図面に示す実施例により本発明の要旨を具体的に説
明する。企図を通じ同一符号は同一対象物を示す。(Examples) The gist of the present invention will be specifically explained below with reference to Examples shown in the drawings.The same reference numerals indicate the same objects throughout the plan.
第１図〜第４図は第５図に示すＰＬＣＣ型ＩＣバッケ−
ジへの適用実施例の工程をその成形工具とＩＣパッケー
ジの断面図で示すもので、第１図（ａ）および（ｂ）は
第１工程、第２図は第２工程、第３図は第３工程、第４
図は第４工程を示す。図において、１はプラスチック製
のＩＣパッケージ、２は同パッゲージからのリード引き
出し部近傍、３ばほぼ３７８円弧状に加工されたリード
先端部、４は直角に折り曲げられたリード部分、５，５
゛は挟持工具、６はローラ、７，７゛は第２の挟持工具
、８は第２のローラ、８”はローラ８を保持するプレス
工具、９．９″は第３の挟持工具、１０．１０’は第４
の挟持工具、１１はカーリング工具、１２ばカーリング
工具１１に設けられた断面がほぼ半円弧状の凹部、？印
はその方向にスプリングにより各プレス工具に働いてい
る押圧力である。Figures 1 to 4 show the PLCC type IC bag shown in Figure 5.
The steps of the application example to the IC package are shown in cross-sectional views of the molding tool and the IC package, with FIGS. 1(a) and (b) showing the first step, FIG. 3rd step, 4th step
The figure shows the fourth step. In the figure, 1 is a plastic IC package, 2 is the vicinity of the lead extraction part from the package, 3 is the lead tip processed into an approximately 378 arc shape, 4 is the lead portion bent at right angles, 5, 5
゛ is a clamping tool, 6 is a roller, 7, 7゛ is a second clamping tool, 8 is a second roller, 8'' is a press tool that holds roller 8, 9.9'' is a third clamping tool, 10 .10' is the fourth
11 is a curling tool, and 12 is a recess provided in the curling tool 11 and having a substantially semicircular arc cross section. The marks indicate the pressing force exerted on each press tool by the spring in that direction.
第１図（ａｌおよび（ｂｌに示す第１工程は板厚０．２
１１ＩＩ１１のリードの先端を略３〕８円弧状に成形す
る工程の説明図であるが、−見して判るごと〈従来の技
術により容易に実施できる方法である。The first process shown in Figure 1 (al and (bl) has a plate thickness of 0.2
This is an explanatory diagram of the process of forming the tip of the lead of 11II11 into an approximately 3]8 arc shape, and as can be seen, this is a method that can be easily implemented using conventional technology.
第２図の第２工程のローラ６ばその軸がプレス工具６゛
に取り付けられ、同工具６゛は挟持工具５”に面接触な
がら上下動をする。リードの引き出し近傍部２を挟持工
具５，５゛が挟んだ後、工具６゛が上昇してリードの先
端が挟持工具５に接触する付近までローラ６がリードを
折り曲げる。挟持工具５が折り曲げ位置を決定する角部
は鋭い直角でな（、面取りが行われ、リードのひび割れ
を防止している。なお同図はローラ６の最上端位置を示
している。The shaft of the roller 6 in the second step in FIG. , 5' pinch, the tool 6' rises and the roller 6 bends the lead until the tip of the lead comes into contact with the clamping tool 5.The corner where the clamping tool 5 determines the bending position should not be a sharp right angle. (The chamfering is performed to prevent the leads from cracking. The figure shows the uppermost position of the roller 6.
第３図の第３工程において、挟持工具７，７゛はＩＣパ
ッケージ１の胴体を上下から挟んで保持し、プレス工具
８”にその軸が取りつけられたローラ８は、同工具８゛
が挟持工具７゛に接触しながら上昇するのに伴い、前の
工程で直角の途中まで折り曲げられていたリードの部分
４を下から押し上げて直角に成形する。その際、ローラ
８はリード４の外側を転動するのでリードに擦傷を与え
ない、リード折り曲げ部の変形はパッケージ引き出し部
分近くまで及ぶが、その変形は僅かであるのでプラスチ
ックパッケージに損傷を与える事はない。しかし、この
付近にはプラスチック封止加工の際に浸出した僅かなプ
ラスチックが固着しているが、それらがリードの変形に
よりリードから剥離して脱落し、図示のように、工具７
゛と８′の間に設けられた三角形の空間に収容される。In the third step in FIG. 3, the clamping tools 7, 7'' hold the body of the IC package 1 between the top and bottom, and the roller 8, whose shaft is attached to the press tool 8'', is clamped by the same tool 8''. As it rises while contacting the tool 7, the part 4 of the lead that was bent halfway at a right angle in the previous process is pushed up from below and formed into a right angle.At this time, the roller 8 bends the outside of the lead 4. The deformation of the lead bending part extends to the vicinity of the package pull-out part, but the deformation is slight and will not damage the plastic package.However, there is no plastic sealing in this area. A small amount of plastic that oozed out during the fixing process is stuck, but due to the deformation of the lead, it peels off from the lead and falls off, and as shown in the figure, the tool 7
It is accommodated in the triangular space provided between `` and 8 ''.
なお同図はローラ８の転勤行程の途中の状態を示す。Note that this figure shows the state of the roller 8 in the middle of the transfer process.
第４図の第４工程において、挟持工具９，９°はＩＣ六
ッケージ１の胴体を上下から挟んで保持し、挟持工具１
０，１０°は当初はスプリング１６により外側に開いて
いるが、カム１３が上から下降するに伴い、挟持工具１
０の斜面１５がカム１３の斜面Ｉ４により押されてその
開きを閉じ、ＩＣパッケージのリードの直角折り曲げ部
分４をその外部から挟むが、当挟持工具１０．１０’は
挟持工具９゛に突き当たり所定の位置以上には内側に押
す力は働かない。この状態で、カーリング工具１１は挟
持工具９に接触しながら、即ちリードの直角折り曲げ部
分４に平行に下降し、その先端に設けられである半円弧
状の凹部１２の内面がリード先端のほぼ３／８円弧部分
３のカーリング加工をおこない、目的であるほぼ半円弧
の成形を達成する。この際、リード４は外側に拡がろう
とするが、挟持工具１０．１０’に妨げられてその形を
維持する。In the fourth step in FIG.
0 and 10° are initially opened outward by the spring 16, but as the cam 13 descends from above, the gripping tool 1
The slope 15 of the cam 13 is pushed by the slope I4 of the cam 13 to close the opening and pinch the right-angled bent portion 4 of the IC package lead from the outside, but the clamping tool 10.10' hits the clamping tool 9' and holds it in a predetermined position. The force that pushes inward does not work beyond the position of . In this state, the curling tool 11 descends while contacting the clamping tool 9, that is, parallel to the right-angled bent portion 4 of the lead, so that the inner surface of the semicircular arc-shaped recess 12 provided at the tip of the curling tool 11 touches the clamping tool 9. /8 The curling process is performed on the circular arc portion 3 to achieve the objective of forming an almost semicircular arc. At this time, the lead 4 tries to expand outward, but is prevented by the clamping tool 10, 10' and maintains its shape.
第５図（ａｌ 〜（ｂｌに示すように、ＰＬＣＣのＩＣ
パッケージには、上述の説明のリードとは直角方向に対
向するリードもあり、同様に成形されるが、その方法は
上述のものと全く同じである。As shown in Figure 5 (al to (bl), PLCC IC
The package also has leads that are perpendicularly opposed to those described above and are shaped similarly, but in exactly the same manner as described above.
第１の工程を第１図により説明したが、これ以外の方法
により行われても、本発明の趣旨を妨げるものではない
。Although the first step has been explained with reference to FIG. 1, the gist of the present invention will not be hindered even if it is carried out by a method other than this.
以上述べたように、本発明によれば、極めて簡易な構成
によりリードとその鍍金の損傷のないリード折り曲げと
カーリング加工がおこなえ、その工業的効果は頗る大で
ある。As described above, according to the present invention, lead bending and curling can be performed with an extremely simple structure without damaging the lead and its plating, and the industrial effect thereof is extremely large.
第１図（ａｌ、 （ｂ）は本発明の一実施例の第１工程
図、第２図は同第２工程図、
第３図は同第３工程図、
第４図は同第４工程図、
第５図（ａ）〜山）は本発明により加工するＩＣパッケ
ージの外形図、
第６図は従来の加工法を示す図である。
図において、
ｌはＩＣパッケージ、
３はほぼ３７８円弧状に加工されたリード先端部、６と
８はローラ、
１１はカーリング工具、
１２はカーリング工具１１に設けられた断面がほぼ半円
弧状の凹部である。Figures 1 (al) and (b) are the first process diagram of an embodiment of the present invention, Figure 2 is the second process diagram, Figure 3 is the third process diagram, and Figure 4 is the fourth process diagram. Figures 5(a) to 5) are external views of an IC package processed according to the present invention, and Fig. 6 is a diagram showing a conventional processing method. In the figure, l is an IC package, 3 is a lead tip machined into an approximately 378-arc shape, 6 and 8 are rollers, 11 is a curling tool, and 12 is a recess provided in the curling tool 11 and whose cross section is approximately a semicircular arc shape. It is.
Claims (1)
引き出し部分の近くにおいてほぼ直角に折り曲げ、なお
かつ該リードの先端部分を該パッケージ側にほぼ半円弧
状に成形する方法において、該リードの先端をほぼ３／
８円弧状（３）に成形する第１の工程と、 該リードの該パッケージ（１）からの引き出し部の近傍
（２）をその板厚の両面から挟持工具（５、５′）によ
り挾持しながら、該折り曲げの外側からローラ（６）に
より、該リードの上記ほぼ３／８円弧状部分（３）の先
端が該挟持工具（５）にほぼ接触する程度に押し曲げる
第２の工程と、 該ＩＣパッケージ（１）を第２の挟持工具（７、７′）
により挟持しながら、第２のローラ（８）が上記リード
の外側を直角折り曲げの方向に転動する第３の工程と、 該ＩＣパッケージ（１）を第３の挟持工具（９、９′）
により挟持し、かつ上記直角に折り曲がったリード部分
（４）を第４の挟持工具（１０、１０′）により外部か
ら挟持しながら、ほぼ半円状断面の凹部（１２）を有す
るプレス工具（１１）が上記直角に曲げられたリード部
分（４）に平行に、上記ほぼ３／８円弧状部分（３）を
プレスしてほぼ半円弧状にカーリングする第４の工程と
からなるＩＣパッケージのリード折り曲げ法。[Claims] A method in which the leads of an IC package (1) are bent at a substantially right angle near the part where they are pulled out from the package, and the tip portions of the leads are formed into a substantially semicircular arc shape toward the package. Approximately 3/3 the tip of the lead
The first step is to form the lead into an 8-arc shape (3), and the part (2) in the vicinity of the lead-out part of the lead from the package (1) is clamped by clamping tools (5, 5') from both sides of the plate thickness. a second step of pressing and bending the lead from the outside of the bending using a roller (6) to such an extent that the tip of the approximately 3/8 arcuate portion (3) of the lead almost contacts the holding tool (5); The IC package (1) is held by the second clamping tool (7, 7').
a third step in which a second roller (8) rolls the outside of the lead in the direction of right-angled bending while holding the IC package (1) with a third holding tool (9, 9');
While the lead portion (4) bent at right angles is held by the fourth holding tool (10, 10') from the outside, a press tool ( 11) is a fourth step of pressing the approximately 3/8 circular arc portion (3) parallel to the perpendicularly bent lead portion (4) and curling it into approximately a semicircular arc shape. Lead bending method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61120737A JPH0685418B2 (en) | 1986-05-26 | 1986-05-26 | IC package lead bending method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61120737A JPH0685418B2 (en) | 1986-05-26 | 1986-05-26 | IC package lead bending method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62277756A true JPS62277756A (en) | 1987-12-02 |
| JPH0685418B2 JPH0685418B2 (en) | 1994-10-26 |
Family
ID=14793735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61120737A Expired - Lifetime JPH0685418B2 (en) | 1986-05-26 | 1986-05-26 | IC package lead bending method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0685418B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105945175A (en) * | 2016-05-13 | 2016-09-21 | 珠海市赛科自动化有限公司 | Capacitance bent foot forming machine |
| CN107598024A (en) * | 2017-10-18 | 2018-01-19 | 常州市武进亚太机电配件有限公司 | Winding wiring bending mechanism |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62122159A (en) * | 1985-11-21 | 1987-06-03 | Yamada Seisakusho:Kk | Formation of outer lead |
-
1986
- 1986-05-26 JP JP61120737A patent/JPH0685418B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62122159A (en) * | 1985-11-21 | 1987-06-03 | Yamada Seisakusho:Kk | Formation of outer lead |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105945175A (en) * | 2016-05-13 | 2016-09-21 | 珠海市赛科自动化有限公司 | Capacitance bent foot forming machine |
| CN105945175B (en) * | 2016-05-13 | 2018-04-20 | 珠海市赛科自动化有限公司 | A kind of capacitance clubfoot forming machine |
| CN107598024A (en) * | 2017-10-18 | 2018-01-19 | 常州市武进亚太机电配件有限公司 | Winding wiring bending mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0685418B2 (en) | 1994-10-26 |
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