EP1237180A3 - Vacuum apparatus and transfer apparatus - Google Patents

Vacuum apparatus and transfer apparatus Download PDF

Info

Publication number
EP1237180A3
EP1237180A3 EP02251435A EP02251435A EP1237180A3 EP 1237180 A3 EP1237180 A3 EP 1237180A3 EP 02251435 A EP02251435 A EP 02251435A EP 02251435 A EP02251435 A EP 02251435A EP 1237180 A3 EP1237180 A3 EP 1237180A3
Authority
EP
European Patent Office
Prior art keywords
work
chamber
transfer chamber
piece
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02251435A
Other languages
German (de)
French (fr)
Other versions
EP1237180A2 (en
Inventor
Yoshihiro c/o Seiko Instruments Inc. Yamashita
Yoshihiro c/o Seiko Instruments Inc. Enomoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Publication of EP1237180A2 publication Critical patent/EP1237180A2/en
Publication of EP1237180A3 publication Critical patent/EP1237180A3/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

A vacuum apparatus used for a semiconductor manufacturing process or the like is provided, which is space-saving and provided at low cost. A work-piece is transferred to a transfer chamber from the outside under an atmospheric pressure and disposed on a work-piece holder hand inside the transfer chamber, and the transfer chamber is blocked from the outside and the inside of the chamber is made to be in a vacuum. Thereafter, a gate valve provided between the transfer chamber and the process chamber is opened and a pair of tapes made of an elastic material of the transfer apparatus set inside the transfer chamber is extended to the inside of the process chamber. The work-piece disposed on the work-piece holder hand, which is provided in the tip end portion of the tape, is set in the process chamber, or the work-piece having finished processing is disposed on the work-piece holder hand, thereby returning the object to the transfer chamber by returning the tape.
EP02251435A 2001-03-02 2002-02-28 Vacuum apparatus and transfer apparatus Withdrawn EP1237180A3 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001058981A JP2002261147A (en) 2001-03-02 2001-03-02 Vacuum device and carrying device
JP2001058981 2001-03-02

Publications (2)

Publication Number Publication Date
EP1237180A2 EP1237180A2 (en) 2002-09-04
EP1237180A3 true EP1237180A3 (en) 2004-12-08

Family

ID=18918616

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02251435A Withdrawn EP1237180A3 (en) 2001-03-02 2002-02-28 Vacuum apparatus and transfer apparatus

Country Status (4)

Country Link
US (1) US6869262B2 (en)
EP (1) EP1237180A3 (en)
JP (1) JP2002261147A (en)
KR (1) KR20020070886A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4354675B2 (en) * 2002-06-04 2009-10-28 ローツェ株式会社 Thin plate electronic component clean transfer device and thin plate electronic product manufacturing system
JP2004282002A (en) * 2003-02-27 2004-10-07 Tokyo Electron Ltd Substrate treating apparatus and substrate treating method
GB0413117D0 (en) * 2004-06-11 2004-07-14 Boc Group Plc Freeze dryer
US7258521B2 (en) * 2005-05-31 2007-08-21 Scriptpro Llc Chain-driven robotic arm
DE102006003746A1 (en) * 2006-01-26 2007-08-09 Knorr-Bremse Systeme für Nutzfahrzeuge GmbH Disc brake, in particular for a commercial vehicle
US8413788B2 (en) * 2011-03-27 2013-04-09 Zhao-Lin Wan Turning mechanism for polarized electronic components

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604020A (en) * 1984-03-26 1986-08-05 Nanometrics Incorporated Integrated circuit wafer handling system
EP0525633A1 (en) * 1991-07-23 1993-02-03 Tokyo Electron Limited Plasma processing apparatus
US5236295A (en) * 1990-06-15 1993-08-17 Tokyo Electron Sagami Limited Arm apparatus for conveying semiconductor wafer and processing system using same

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968885A (en) * 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
US4055259A (en) * 1976-03-03 1977-10-25 The Perkin-Elmer Corporation Sample transport with rotary air interlock charging and discharging means
JPS5739430U (en) * 1980-08-14 1982-03-03
US4609320A (en) * 1984-06-20 1986-09-02 Rubin Richard H Flexible workpiece transporter and roller assembly therefor
US4699555A (en) * 1986-05-08 1987-10-13 Micrion Limited Partnership Module positioning apparatus
US4735548A (en) * 1987-04-20 1988-04-05 Mecs Corporation Carrier system for clean room
JP2969034B2 (en) * 1993-06-18 1999-11-02 東京エレクトロン株式会社 Transfer method and transfer device
US5551821A (en) * 1995-05-08 1996-09-03 Excellon Automation Co. Worktable loading and unloading apparatus and method
US5611248A (en) * 1995-06-02 1997-03-18 Ats Automation Tooling Systems Inc. Two-axis robot

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4604020A (en) * 1984-03-26 1986-08-05 Nanometrics Incorporated Integrated circuit wafer handling system
US5236295A (en) * 1990-06-15 1993-08-17 Tokyo Electron Sagami Limited Arm apparatus for conveying semiconductor wafer and processing system using same
EP0525633A1 (en) * 1991-07-23 1993-02-03 Tokyo Electron Limited Plasma processing apparatus

Also Published As

Publication number Publication date
KR20020070886A (en) 2002-09-11
EP1237180A2 (en) 2002-09-04
JP2002261147A (en) 2002-09-13
US20020146304A1 (en) 2002-10-10
US6869262B2 (en) 2005-03-22

Similar Documents

Publication Publication Date Title
EP1387399A3 (en) Gate dielectric and method
EP0778611A3 (en) End effector for semiconductor wafer transfer device and method of moving a wafer with an end effector
JPH0425335A (en) Object hold method
EP1263062A3 (en) Organic semiconductor device and process of manufacturing the same
EP0464864A3 (en) Apparatus for transporting a wafer
EP1278230A3 (en) Dual wafer load lock
EP0950471A3 (en) Gripping device
MXPA04002491A (en) Vacuum cleaner apparatus and hose thereof.
EP1143529A3 (en) Microlens, solid state imaging device, and production process thereof
SG125152A1 (en) Substrate holding apparatus and substrate polishing apparatus
EP1367217A3 (en) Downhole apparatus
EP2787099A3 (en) In-situ dry clean chamber for front end of line fabrication
AU2001290171A1 (en) High pressure processing chamber for semiconductor substrate
WO2002029862A3 (en) Integrated semiconductor substrate bevel cleaning apparatus and method
EP0834906A3 (en) Device for transferring a semiconductor wafer
EP1056126A3 (en) Electronic device, method of manufacturing the same, and apparatus for manufacturing the same
EP1326266A3 (en) Protective tape applying and separating method
EP1439575A3 (en) Semiconductor device with a lead frame and method of manufacturing the same
EP1237180A3 (en) Vacuum apparatus and transfer apparatus
WO2001063999A3 (en) Suction nozzle for holding component by suction
EP1248493A3 (en) Speaker diaphragm and method of manufacturing same
EP1260754A3 (en) Device for loading and unloading tools into/from the tool magazine of a machine-tool or the like
AU2002317146A1 (en) Method and device for producing veneer and veneered parts and veneer and veneered parts
WO2005015335A3 (en) High accuracy low leakage valve for high pressure applications
JPH1126482A (en) Diebonding device

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Free format text: AL;LT;LV;MK;RO;SI

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

AX Request for extension of the european patent

Extension state: AL LT LV MK RO SI

17P Request for examination filed

Effective date: 20050429

AKX Designation fees paid

Designated state(s): DE FR GB

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20060829