JPS622769Y2 - - Google Patents

Description

[Detailed description of the invention] This invention relates to a semiconductor device in which a semiconductor element is enclosed in a package, and is intended to increase the functionality of the semiconductor package by providing a conductive terminal that also serves as a fixing part of the package. .

A conventional in-line semiconductor device is shown in FIG.

Conventionally, in single-in-line or dual-in-line semiconductor device packages,
This fixation of the package was carried out using the force of the IC socket sandwiching the metal pin 2 of the inline package 1 shown in Figure 1, but when the semiconductor IC becomes larger than 8 mm square, even 24 pins have a width of 30 mm. It will be a fairly large package. For this reason, especially when the package is used in a portable system, the package often comes off from the semiconductor socket due to a shock or the like. This is extremely inconvenient as it degrades the reliability of the entire system. In order to solve this problem, the present invention provides a part for fixing screws, for example, to the semiconductor package, and at the same time makes this part a metal part to make it a conductive terminal.
The purpose is to increase the number of terminals on a semiconductor package. Embodiments of the present invention will be described below with reference to the drawings.

FIG. 2 shows a semiconductor device which is an embodiment of the present invention, and holes 4 are provided at both ends through which screws 7 are inserted to fix a package 3. The hole wall 5 is made of metal, and the package 3
electrically coupled to the semiconductor element 6 built into the
In addition, since a portion of the hole wall 5 is exposed on the side surface, top surface, or bottom surface of the package 3, it also functions as an external extraction terminal. Note that 2 in the same figure is a metal pin as in FIG. 1.

By the way, recently there have been an increase in the number of ICs, not only as elements for electrical circuits, but also as optical elements. The IC package in this case is, for example,
It is necessary to be correctly fixed in the optical path and focal point position, and at the same time to ensure that this fixed position does not change over time. This is because when an optical element shifts from its fixed position, it loses its original function. In this regard, as mentioned above, the fixing hole 4 is provided in the package 3, and the hole wall 5 is made of metal to electrically connect to the semiconductor element 6 built in the package 3, and a part of the hole wall 5 is made of metal. By exposing the hole on the outer surface of the package, the hole in the package can be used as a fixing part and at the same time as a screw terminal. In this way, a part of the metal of the hole wall 5 is exposed to the outside of the package, which increases the number of terminals and makes it possible to easily use the hole as a grounding element, reducing terminal resistance. It becomes possible to make noise.

Furthermore, by screwing on the outer surface of the package cage, it is possible to accurately adjust the fixing position of the IC package cage, and it is also possible to securely align and fix the IC package, making it ideal for fixing IC package cages that require accurate alignment and fixation.

As described above, according to the present invention, it is possible to perform accurate fixation with excellent stability, especially for optical
It is extremely useful when used in semiconductor devices as a package for ICs, etc., and has excellent functions such as the fixed part can be easily used as a terminal for screwing.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a conventional semiconductor device, and FIG. 2 is a perspective view of a semiconductor device that is an embodiment of the present invention. 1, 3...package, 2...metal pin, 4...
... hole, 5 ... hole wall, 6 ... semiconductor element.

Claims (1)

[Scope of utility model registration request] A semiconductor element, a package enclosing the element, a fixing hole formed on the outside of the package, and a hole wall of the hole with a part exposed on the outside of the package. A semiconductor device comprising: a connecting metal body; and a screw is inserted into the hole to fix the package.