JPS59229847A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable to integrally form a module without decreasing the using efficiency by containing an accessory circuit such as a drive circuit having a circuit element which includes a lower allowable temperature than the allowable temperature of a semiconductor element, and providing means for integrally coupling a package. CONSTITUTION:A resin case 1 for containing a power transistor and a resin case 2 for containing an accessory circuit are associated by engaging a recess 3 with a projection 4. An accessory circuit is connected to a power transistor by connecting a metal terminal 5 exposed on the surface of the case 1, i.e., terminals of emitter, base and collector to a metal terminal 6 of the cases via leads. Since the case 1 does not contain a capacitor having low allowable temperature, it can be tested at a high temperature, and when the case 2 contains a circuit element having low allowable temperature is tested at the low temperature, and then associated therewith.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a semiconductor device including a semiconductor element and a driving circuit thereof.

[Prior art and its problems]

A system consisting of multiple semiconductor elements and other circuit elements There is a growing trend toward monolithic semiconductor devices.

Naturally, it is conceivable that transistors, thyristors, etc. and their drive circuits, capture circuits, etc., which were conventionally provided on separate printed boards, could be housed in the same package to form a module, but in this case, the following problems would arise: exists. That is, taking a power transistor as an example, although the heat resistance as a semiconductor element is 150υ, a protection circuit such as a snubber circuit includes a capacitor, and its heat resistance is around 100°C. For this reason, if they are housed in the same package, the overall guaranteed temperature must be lowered, and the idea is to integrate a single module into one module without reducing the efficiency of using semiconductor devices that have a high allowable temperature. A socket cage housing a semiconductor element, a package housing an accessory circuit such as a drive circuit including a circuit element having a lower allowable temperature (G) than the allowable temperature of the semiconductor element, and both socket cages are integrally coupled together. The above objective is achieved by providing means for.

As a means for integrally joining, there is a convex part provided on one package and a concave part fitted to the convex part provided on the other package. The resin case 1 housing the power transistor shown in FIG. By fitting the protrusions 4, they are combined as shown in FIG. 2.The connection between the attached circuit and the knocker transistor is made through the metal terminals 5 exposed on the surface of the resin case 1, that is, the emitter, paste,
This is done by connecting each terminal of the collector to the metal terminal 6 of the resin case using a conducting wire.

The resin case 1 can be tested at a high temperature because it does not contain a capacitor or the like with a low allowable temperature, and the resin case 2 containing circuit elements with a low allowable temperature can be tested at a low temperature and then combined. Since the power transistor and the attached circuit are tested separately and combined in this way, it is advantageous in terms of manufacturing yield, and the reliability of the combined device is high. Further, only the resin case 1 is designed to allow a temperature rise, for example, a resin with high heat resistance may be used, and since the power transistor can be operated at high temperature, the usage efficiency of the element is also improved.

In the embodiment shown in FIGS. 1 and 2, the connection between the accessory circuit and the power transistor is made by wiring outside the resin case. In this case, a natural vibration phenomenon may occur depending on the length of the wiring and the pattern of the wiring. Figure 3 shows a model that eliminates the need for such wiring; a metal opening slit 7 is embedded in the resin case 1 on the main body side that houses the power transistor, and the resin case 2 for the attached circuit has a metal opening slit 7 embedded therein. A metal protrusion 8 that can be fitted into the slit 7 is provided.

The opening slit portion 7 and the metal protrusion portion 8 are electrically connected to the elements or circuits inside the case, so insert the protrusion portion 8 into the slit portion 7 from above and connect the hole 9 of the case 1 and the hole 10 of the case 2. If they are used and collinear, both cases 1 and 2 are integrated, and the power transistor and the attached circuit are electrically connected, creating a module that does not require external wiring.

Figure 4 shows an example in which no wiring is required (separate θ).The resin case 1 housing the element and the resin case 2 housing the attached circuit are combined vertically, and the electrical connection between the attached circuit and the element is made from case l. This is done by burying the protruding bottle 11 in the case 2 and inserting it into a suitable plug 12. The main terminal 13 of the element is fitted under the main terminal 14 exposed on the surface of the case 2, and the output can be taken out from the main terminal 14.

In the embodiment shown in FIG. 5, the mounting holes made in the resin case 2 are inserted into holes 15, and the fixing screws are screwed into female screw holes 16 (only one is shown in the figure) provided in the plastic case 1. Both cases are connected by screws 17. Connection between the element and the attached circuit is made simultaneously by the set screw 17, and connection with an external circuit is also possible by inserting a wiring busbar 18 between both cases.

〔Effect of the invention〕

As described above, the present invention accommodates the element section with a high allowable temperature and the attached circuit section with a low allowable temperature in separate packages,
It is modularized as an integrated unit using suitable coupling means, and it is advantageous in terms of manufacturing yield to combine after testing each separately in the allowable temperature range, and it also improves reliability.
In addition, since the guaranteed temperature of each part can be selected independently, it is possible to increase the efficiency of element usage.Furthermore, if the connection for integration can be made at the same time, the trouble of wiring can be eliminated. The results are extremely large, such as improving the reliability of the connection and eliminating the problem of natural vibration in the connection.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a perspective view of the combination thereof, and FIGS. 3, 4, and 5 are perspective views of different embodiments. 1.2: resin case, 3: recess, 4: protrusion, 7: opening slit, 8: protrusion, 11: pin, 12 nib lug, 1
5: Mounting hole, 16: Female threaded hole, 17: Set screw. Figure 1 Figure 2 Figure 3 Figure 4 Figure 9 Figure 5

Claims (1)

[Scope of Claims] l) A package containing an output semiconductor element, a package containing an auxiliary circuit including a circuit element having a lower allowable temperature than the allowable temperature of the semiconductor element, and means for joining both packages together. A semiconductor device characterized by comprising: 2. A semiconductor device according to claim 1, characterized in that the means for uniting both pancages together also serves as means for electrically connecting the output semiconductor element and the auxiliary circuit. . 3) In the device according to claim 1 or 2, means for joining both packages together is provided on a convex portion provided on one package and on the other package, and the convex portion ζ A semiconductor device characterized by a recess that fits into the recess. 4) In the device according to claim 1 or 2, the means for joining both packages together is a set screw screwed into a threaded hole in the other package through a through hole in one package. A semiconductor device characterized by the following.