JPS62263689A - Flexible printed circuit and manufacture of the same - Google Patents
Flexible printed circuit and manufacture of the sameInfo
- Publication number
- JPS62263689A JPS62263689A JP10695586A JP10695586A JPS62263689A JP S62263689 A JPS62263689 A JP S62263689A JP 10695586 A JP10695586 A JP 10695586A JP 10695586 A JP10695586 A JP 10695586A JP S62263689 A JPS62263689 A JP S62263689A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- flexible printed
- copper foil
- circuit
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000004020 conductor Substances 0.000 claims description 44
- 238000005530 etching Methods 0.000 claims description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 17
- 239000011889 copper foil Substances 0.000 claims description 16
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 12
- 239000000243 solution Substances 0.000 claims description 10
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- 238000000059 patterning Methods 0.000 claims description 4
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 2
- 239000010408 film Substances 0.000 description 22
- 239000012787 coverlay film Substances 0.000 description 14
- 239000012790 adhesive layer Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011259 mixed solution Substances 0.000 description 4
- 229920001721 polyimide Polymers 0.000 description 4
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004366 reverse phase liquid chromatography Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
「産業上の利用分野」
この発明は、プリント配線基板に係り、特に、屈曲特性
、の向上、およびカバーレイフィルムの接着性の向−に
を図ったフレキンプルプリント配線基板およびその製法
に関する乙のである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to printed wiring boards, and in particular, to flexible printed wiring boards that are intended to improve bending properties and adhesive properties of coverlay films. This is about the substrate and its manufacturing method.
「従来り）技術」
近時、電子機器の小形軽量化、薄型化、および高密度実
装化に伴いフレキシブルプリント配線基板（以下、Ｆ
Ｐ Ｃと略称する。）が多用される傾向に６５り、この
種のＦｐｃとして、第・１図に示す如く、進縁フィルム
１と絶縁フィルム２との間に接着剤層３を介して導体４
１．１、・・からなるプリント回路５を配設した乙のが
一般に知られている。"Conventional) technology" Recently, with the miniaturization, weight, thinness, and high-density packaging of electronic devices, flexible printed wiring boards (hereinafter referred to as F
It is abbreviated as PC. ) is becoming more and more frequently used, and as shown in FIG.
1.2 is generally known, in which a printed circuit 5 consisting of 1, . . . is arranged.
そして、前記絶縁フィルム２と接着剤層３とによって、
カバーレイフィルム６が構成されている。And, by the insulating film 2 and adhesive layer 3,
A coverlay film 6 is configured.
「発明が解決しようとする問題点」
ところで、上記のＰ Ｐ Ｃにおいては、新規な用途開
発か進むにつれ、回路のファイン化が行なわれて該回路
を構成ずろ導体の配線密度か高くなる傾向にあるため、
前記ファイン化に伴なって起こる不良品の発生を如何に
して少なくするかが重要な問題となっている。"Problems to be Solved by the Invention" By the way, in the above-mentioned PPC, as the development of new applications progresses, the circuits become finer and the wiring density of the conductors that make up the circuits tends to increase. Because there is
An important issue is how to reduce the number of defective products that occur as a result of the refinement.
具体例を以て説明すれば、上記のＲＰＣの製造工程にお
いて、絶縁フィルノ・ｌの表面に張り合Ｕた圧延銅箔に
回路のエツチングを行なった場合に、プリント回路５を
形、成する導体４．４、 か、エツチング液によって、
図に示すように側部中央が弧状に溶解する。そして、更
に、前記プリント回路５にカバーレイフィルム６を張合
せた場合に、導体４．４、・・の弧状に溶解した部分に
ついて、接着剤層３が行き渡らずに不良箇所（第、；図
に符号ＦＳＦ、・・で示す）が発生する。To explain with a specific example, in the RPC manufacturing process described above, when a circuit is etched on the rolled copper foil laminated on the surface of the insulating film 5, the conductor 4. which forms the printed circuit 5. 4. Or, by etching liquid,
As shown in the figure, the center of the side melts in an arc shape. Further, when the coverlay film 6 is laminated to the printed circuit 5, the adhesive layer 3 does not spread over the arc-shaped portions of the conductors 4, 4, etc., resulting in defective areas (Fig. ) is generated.
これによって、上記のＦＰＣにおいては、折り曲げ動作
を行った場合に、接着剤層３が行き渡っていない部分Ｆ
、Ｆ、・・の導体４．４、・・に不均一な力か加わり、
応力の集中によって該導体・１．４、・・の破断が起き
、該ＦＰＣの回路としての信頼性か低下するという問題
があった。As a result, in the above FPC, when the bending operation is performed, the portion F where the adhesive layer 3 is not spread
, F,... conductor 4. Ununiform force is applied to 4,...
There was a problem in that the conductors 1.4, . . . were broken due to concentration of stress, reducing the reliability of the FPC as a circuit.
この発明は、上記の事情に鑑みてなされたしのであって
、屈曲特性の向上とカバーレイフィルムの導体に対する
接着性の向上を図って回路の信頼性を高めることを目的
する。The present invention was made in view of the above circumstances, and aims to improve the reliability of the circuit by improving the bending properties and the adhesion of the coverlay film to the conductor.
「問題点を解決するための手段」
この第１の発明のフレキシブルプリント配線基板は、絶
縁フィルムの表面に配線パターンを形成する導体を設け
て、該導体を幅方向中央部が肉厚となるように連続的に
湾曲した形状とすることを特徴としている。"Means for Solving the Problems" The flexible printed wiring board of the first invention is provided with a conductor forming a wiring pattern on the surface of an insulating film, and the conductor is arranged so that the center part in the width direction is thicker. It is characterized by a continuously curved shape.
この第２の発明のフレキシブルプリント配線基板の製造
方法は、絶縁フィルムの表面に導体による配線パターン
を形成するようにしたフレキシブルプリント配線基板の
製造方法において、前記絶縁フィルムの表面に銅箔を層
状に張り合せてレジスト膜により回路のパターニングを
行なう工程と、前記銅箔の不要部分を溶解除去して回路
パターンを形成するエツチング工程と、前記レジスト膜
を除去する工程と、前記回路パターンを構成する導体の
一部を溶解除去するソフトエツチング工程とからなるこ
とを特徴としている。The method for manufacturing a flexible printed wiring board according to the second invention is a method for manufacturing a flexible printed wiring board in which a wiring pattern of a conductor is formed on the surface of an insulating film, in which a copper foil is layered on the surface of the insulating film. A step of laminating the copper foil and patterning a circuit using a resist film, an etching step of dissolving and removing unnecessary portions of the copper foil to form a circuit pattern, a step of removing the resist film, and a conductor constituting the circuit pattern. It is characterized by comprising a soft etching process that dissolves and removes a portion of the material.
以下、この発明のＦＰＣについて第１図〜第３図を参照
して詳細に説明する。Hereinafter, the FPC of the present invention will be explained in detail with reference to FIGS. 1 to 3.
これらの図において、符号１０はポリエステル、ポリイ
ミド等の樹脂からなるベースフィルム（絶縁フィルム）
である。このベースフィルム１０の上面には、接着層１
１を介在させて導体１２．１２、・・が配設されている
。In these figures, the reference numeral 10 indicates a base film (insulating film) made of resin such as polyester or polyimide.
It is. An adhesive layer 1 is formed on the upper surface of this base film 10.
Conductors 12, 12, . . . are arranged with conductors 1 interposed therebetween.
前記接着層１１を形成する材料には、アクリル系樹脂、
Ｎｌ３Ｒ含有エボキノ樹脂、アルコール可溶性ナイロン
自存のエボキン樹脂などの熱硬化性樹脂が選択される。The material forming the adhesive layer 11 includes acrylic resin,
Thermosetting resins such as Nl3R-containing Evoquin resin and alcohol-soluble nylon-containing Evoquin resin are selected.
前記導体１２、！２、・は、前記絶縁フィルムＩＯの上
面に張り合わせた圧延銅箔にパターニングを行い、更に
エツチングを行うことにより回路パターン（配線パター
ン）１３が形成された乙のであって、谷導体の横断面は
、第１図および第３図に示すように中央部が肉厚となる
ように連続的に湾曲した形状となっている。Said conductor 12,! 2. In B, a circuit pattern (wiring pattern) 13 is formed by patterning the rolled copper foil pasted on the top surface of the insulating film IO and further etching, and the cross section of the valley conductor is As shown in FIGS. 1 and 3, it has a continuously curved shape with a thick center portion.
前記導体１２．１２、・・の上面には、カバーレイフィ
ルム１９が配設されている。該カバーレイフィルム１９
は、カバーレイフィルム接着層２０と絶縁フィルム２１
とからなり、ポリイミドとエボキン系の樹脂とをプレス
キュアすることによって形成されｆこしのである。A coverlay film 19 is disposed on the upper surface of the conductors 12, 12, . The coverlay film 19
is a coverlay film adhesive layer 20 and an insulating film 21
It is formed by pre-curing polyimide and Evoquin resin.
次に、上記ＦＰＣの製造方法を工程順に説明する。Next, the method for manufacturing the above-mentioned FPC will be explained step by step.
（１）ベースフィルム１０の上面にｔｉ Ｍ Ｎ Ｉ
ｌ ヲ介して圧延銅箔（電解銅箔てあって乙良い）を張
り合ける。(1) Ti M N I on the top surface of the base film 10
l Rolled copper foil (electrolytic copper foil is better) can be pasted through it.
（２）イ、ガフィルムによるフォトレジスト、去等を用
いて、前記圧延銅箔の表面にレジスト膜による回路パタ
ーンの作成を行う。(2) A. A circuit pattern is created using a resist film on the surface of the rolled copper foil using a photoresist film or the like.
（３）＋ｉｉｉ記回路Ｉくターン以外の不要導体をエッ
チンダ液によって溶解する（この方法をサブトラクティ
ブ法という ）。このサブトラクティブ法によって、前
記不要導体とともに、回路パターン１３を形成する導体
１２．１２、・の両測部中央が第２図に示すようにエツ
チング液に溶解し、その結果、前記導体の両側部上部が
それぞれ横方向に向けて突出しｆこ形状（突出部をＭ、
Ｍで示す）となる。(3) Unnecessary conductors other than the circuit I turn described in +iii are dissolved using an etching agent (this method is called a subtractive method). By this subtractive method, the centers of both measuring parts of the conductors 12, 12, . . . forming the circuit pattern 13 are dissolved in the etching solution as shown in FIG. The upper part protrudes in the horizontal direction and has a shape (the protruding part is M,
(denoted by M).
なお、前記エツチング液には、過硫酸アンモニウム溶液
、塩化第二鉄水溶液、塩化第二銅水溶液、などが使用さ
れろ。（エツチング工程）（・１）回路パターンを作成
する際に設けたレジスト膜を水酸化ナトリウム水溶液、
塩化メチレンなどの除去剤によって除去する。As the etching solution, ammonium persulfate solution, ferric chloride aqueous solution, cupric chloride aqueous solution, etc. may be used. (Etching process) (1) The resist film provided when creating the circuit pattern is etched with a sodium hydroxide aqueous solution.
Remove with a removal agent such as methylene chloride.
（５）前記導体の一部（突出ＨＭ 、 Ｍ ）をソフト
エツチング液で溶解する。ずなイつち、ソフトエツチン
グ液により表面積の大きい突出部Ｍ ＳＭ ％ ・・を
溶解して、導体１２．１２、・・の横断面が、第３図に
示す如く中央部が肉厚となるように湾曲した形状、すな
わち略半円球状にする。なお、前記ソフトエツチング液
には、過硫酸アンモニウム水溶液、硫酸と過酸化水素と
の混合液、塩酸と過酸化水素との混合液などが使用され
ろ。（ソフトエツチング液程）
上記のＦＰＣにおいては、導体Ｉ２．１２、・・の横断
面か中央部か肉厚となるように連続的に湾曲した形状と
なっているので、該導体Ｉ２、Ｉ２、・・の表面に沿っ
てカバーレイフィルム１９が順次移動して、該導体１２
．１２、・・によって形成されろ回路パターン１３の全
てにカバーレイフィルム１９が行き渡り、カバーレイフ
ィルム１９の導体１２．１２、・・に対する接着性の向
上を図ることができる。これにより、上記ＦＰＣの折り
曲げ動作を１テった場合に、前記導体１２．１２、・・
の全てに均一な力が加わって、従来のように該導体１２
．１２、・の部分的ζ破断が起こらず、Ｉ” ＰＣの屈
曲特性の向上を図って回路の信頼性を高めることができ
る。(5) Part of the conductor (projections HM, M) is dissolved with a soft etching solution. First, the protrusions M SM %... with large surface areas are dissolved using a soft etching solution, and the cross sections of the conductors 12, 12,... become thick in the center as shown in Figure 3. It has a curved shape, that is, a roughly semispherical shape. As the soft etching solution, an aqueous ammonium persulfate solution, a mixed solution of sulfuric acid and hydrogen peroxide, a mixed solution of hydrochloric acid and hydrogen peroxide, etc. may be used. (Soft etching liquid process) In the above FPC, since the conductor I2. The coverlay film 19 sequentially moves along the surface of the conductor 12.
．． The coverlay film 19 spreads over all of the circuit patterns 13 formed by the conductors 12, 12, . . . , and the adhesion of the coverlay film 19 to the conductors 12, 12, . As a result, when the above-mentioned FPC is bent once, the conductors 12, 12, . . .
A uniform force is applied to all of the conductors 12 as in the conventional case.
．． 12, • does not occur, the bending characteristics of the I'' PC can be improved, and the reliability of the circuit can be increased.
以下、実験例を示してこの発明のＦＰＣの作用効果を更
に明確にする。Hereinafter, experimental examples will be shown to further clarify the effects of the FPC of the present invention.
「実験例コ
下記に示す２種類のＲＰＣを作成し、これらについて種
々の特性試験を行い、それらの結果を表にまとめた。``Experimental Example: Two types of RPCs shown below were created, various characteristic tests were conducted on them, and the results were summarized in a table.
（実施例）
犀さ２５μｍのポリイミドベースフィルムに１５μｍの
接着層を介在さけて３５μｍの圧延銅箔を張り合イっせ
た。このようにして作成した銅張積層板の表面に露光法
によって、導体中６０μｍ、回路間隔４０μｍからなる
１０本の平行回路のレジスト膜によるパターニングを行
なった上で、塩化第二鉄水溶液に浸漬して圧延銅箔の不
要導体部分を溶解除去した（エツチング工程）。次いで
、ｎｑ記レジスト膜を除去する工程を経た後、前記銅張
積層板を硫酸と過酸化水素との混合液に浸漬して回路パ
ターンを形成する導体の一部を溶解除去した（ソフトエ
ツチング液程）６
そして、上記処理によって、導体中５０μｍ、回路間隔
５０μｍ、銅箔厚さく導体厚さ）３０μｍの回路パター
ンか作成された。(Example) A rolled copper foil of 35 μm was attached to a polyimide base film of 25 μm in thickness with an adhesive layer of 15 μm interposed therebetween. The surface of the copper-clad laminate thus produced was patterned with a resist film of 10 parallel circuits with a conductor of 60 μm and a circuit interval of 40 μm using an exposure method, and then immersed in a ferric chloride aqueous solution. The unnecessary conductor portions of the rolled copper foil were dissolved and removed (etching process). Next, after passing through the step of removing the resist film (nq), the copper-clad laminate was immersed in a mixed solution of sulfuric acid and hydrogen peroxide to dissolve and remove a portion of the conductor forming the circuit pattern (soft etching solution). By the above process, a circuit pattern with a conductor thickness of 50 μm, a circuit interval of 50 μm, and a copper foil thickness of 30 μm was created.
（比較例）
上記実施例と同様に形成した銅張積層板を硫酸と過酸化
水素との混合液に浸漬して（ソフトエツチング液作）、
銅張積層板を構成する銅箔の表面を５μｍ溶解した。次
いで、露光法により、前記実施例と同じパターニングを
行った後、塩化第二鉄水溶液に浸漬して（エツチング工
程）、更に、レジスト膜を除去する工程を行った。(Comparative example) A copper-clad laminate formed in the same manner as in the above example was immersed in a mixed solution of sulfuric acid and hydrogen peroxide (soft etching solution production).
5 μm of the surface of the copper foil constituting the copper-clad laminate was melted. Next, the same patterning as in the above example was performed by an exposure method, followed by immersion in a ferric chloride aqueous solution (etching step), and a further step of removing the resist film.
これらの処理によって、導体＋１１５０μｍ１回路間隔
５０μｍ、銅箔厚さく導体厚さ）３０μｍの回路パター
ンが作成され几。Through these treatments, a circuit pattern with a conductor + 1150 μm, a circuit interval of 50 μm, and a copper foil thickness (conductor thickness) of 30 μm was created.
（実施例・比較例）
上記実施例および比較例により回路パターンの作成され
た銅張積層板に、厚さ２５μｍのポリイミドフィルムと
、厚さ３５μｍのエポキノ系接着層とからなるカバーレ
イフィルムとをプレスキュアにより張り合せた。なお、
このときのプレスキュアは、温度１６Ｑ’ｃ、圧力−１
０Ｋｇ／ｃｍ２、プレス時間６０分で行った。(Example/Comparative Example) A coverlay film consisting of a 25 μm thick polyimide film and a 35 μm thick epochino adhesive layer was applied to the copper clad laminate on which the circuit pattern was created according to the above Examples and Comparative Examples. Pasted together using pre-cure. In addition,
The precure at this time was at a temperature of 16Q'c and a pressure of -1
The pressing was carried out at 0 kg/cm2 and for 60 minutes.
※ ・・・・・・屈曲性はＦ Ｐ Ｃが破断するまでの
ストロークの回数を示す。*...Flexibility indicates the number of strokes until the FPC breaks.
＊Ｉ・・・・・・導体のカバーレイフィルムに対する接
着度。倍率１０の拡大鏡で目
視により判断。*I: Degree of adhesion of the conductor to the coverlay film. Judging visually using a magnifying glass with a magnification of 10.
＊２・・・・・第６図に示すＩＰＣ試験機により測定。*2...Measured using the IPC testing machine shown in Figure 6.
「発明の効果」
以上詳細に説明したように、この発明によれば、前記導
体が幅方向に対して中央部が肉厚となるように連続的に
湾曲した形状となっているので、導体の表面に配設され
るカバーレイフィルムの該導体に対する接着性が向上す
る。これによって、折り曲げ動作を頻繁に行った場合で
あっても、導体に不均一な力が掛らず、かつ、従来のよ
うに該導体の部分的な破断が起こらず、耐屈曲特性の向
上が図られて回路の信頼性を高めることができろという
効果を奏する。"Effects of the Invention" As explained in detail above, according to the present invention, the conductor has a shape that is continuously curved in the width direction so that the center part is thicker. The adhesion of the coverlay film disposed on the surface to the conductor is improved. As a result, even when bending operations are performed frequently, uneven force is not applied to the conductor, and partial breakage of the conductor does not occur as in the past, improving the bending resistance. This has the effect of increasing the reliability of the circuit.
第１図〜第３図は本発明の実施例を示す図であって、第
１図はその正断面図、第２図はエツチング機の導体を形
状を示す正断面図、第３図はソフトエツチング後の導体
の形状を示す正断面図、第・１図および第５図は従来の
Ｆ’ＰＣを示す図であって、第４図はその正断面図、第
５図はその導体部分を示す正断面図、第６図はＩｆ”Ｃ
屈曲強さ試験機の概略図である。
ＩＯ・・・・・・絶縁フィルム（ベースフィルム）１２
・・・・・導体
１３・・・・・・回路パターン（配線パターン）１９・
・・・・・カバーレイフィルム
Ｍ・・・・・・導体の一部1 to 3 are diagrams showing an embodiment of the present invention, in which FIG. 1 is a front sectional view thereof, FIG. 2 is a front sectional view showing the shape of the conductor of the etching machine, and FIG. 3 is a soft sectional view. Figures 1 and 5 are front sectional views showing the shape of the conductor after etching, and Figures 1 and 5 are views showing conventional F'PCs. The front sectional view shown in FIG. 6 is If”C
It is a schematic diagram of a bending strength tester. IO・・・Insulating film (base film) 12
...Conductor 13...Circuit pattern (wiring pattern) 19.
...Coverlay film M...Part of the conductor
Claims (1)
・）によって配線パターン（１３）が形成されてなるフ
レキシブルプリント配線基板において、前記導体を幅方
向中央部が肉厚となるように連続的に湾曲した形状にし
たことを特徴とするフレキシブルプリント配線基板。 ２）絶縁フィルムの表面に導体による配線パターンを形
成するようにしたフレキシブルプリント配線基板の製造
方法において、前記絶縁フィルムの表面に銅箔を層状に
張り合せるとともに、該銅箔の表面にレジスト膜による
回路のパターニングを行なう工程と、前記銅箔の不要部
分を溶解除去して回路パターンを形成するエッチング工
程と、前記レジスト膜を除去する工程と、前記回路パタ
ーンを構成する導体の一部を溶解除去するソフトエッチ
ング工程とからなることを特徴とするフレキシブルプリ
ント配線基板の製法。 ３）前記ソフトエッチング工程に、硫酸と過酸化水素と
の混合液、塩酸と過酸化水素との混合液、あるいは過流
酸アンモニウム水溶液等の溶解液を用いたことを特徴と
する特許請求の範囲第２項記載のフレキシブルプリント
配線基板の製法。[Claims] 1) Conductors (12, 12,
・) A flexible printed wiring board on which a wiring pattern (13) is formed, characterized in that the conductor has a continuous curved shape so that the center part in the width direction is thicker. . 2) In a method for manufacturing a flexible printed wiring board in which a wiring pattern is formed using a conductor on the surface of an insulating film, a layer of copper foil is pasted on the surface of the insulating film, and a resist film is applied to the surface of the copper foil. a step of patterning a circuit; an etching step of dissolving and removing unnecessary portions of the copper foil to form a circuit pattern; a step of removing the resist film; and a step of dissolving and removing a portion of the conductor constituting the circuit pattern. A method for manufacturing a flexible printed wiring board, characterized by comprising a soft etching process. 3) Claims characterized in that a solution such as a mixture of sulfuric acid and hydrogen peroxide, a mixture of hydrochloric acid and hydrogen peroxide, or an ammonium persulfate aqueous solution is used in the soft etching step. A method for manufacturing a flexible printed wiring board according to item 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10695586A JPS62263689A (en) | 1986-05-10 | 1986-05-10 | Flexible printed circuit and manufacture of the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10695586A JPS62263689A (en) | 1986-05-10 | 1986-05-10 | Flexible printed circuit and manufacture of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62263689A true JPS62263689A (en) | 1987-11-16 |
Family
ID=14446771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10695586A Pending JPS62263689A (en) | 1986-05-10 | 1986-05-10 | Flexible printed circuit and manufacture of the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62263689A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258482A (en) * | 2007-04-06 | 2008-10-23 | Hitachi Cable Ltd | Method for producing printed wiring board |
-
1986
- 1986-05-10 JP JP10695586A patent/JPS62263689A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008258482A (en) * | 2007-04-06 | 2008-10-23 | Hitachi Cable Ltd | Method for producing printed wiring board |
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