JPS62262420A - Method of sealing heat resisting tube for heating semiconductor - Google Patents

Abstract

PURPOSE:To prevent gas from leaking from a quartz tube and penetrating into a clean room, by providing a groove on the fitting portions between the quartz tube and its cover, CONSTITUTION:A cover 4 of quartz 4 is fitted on a tapered and flat-spotted portion 3 of a quartz tube 1. An exhaust port 5 is provided at the center of the cover 4 so that gas introduced into the quartz tube 1 is discharged through the exhaust port 5. A groove 6 is formed around the outer periphery of the flat-spotted portion 3 such that a part of the groove 6 is extended to the outside of the cover. The portion of the groove 6 extending to the outside of the cover enables the introduced gas to flow out of the tube. In this manner, the tube is allowed to have improved hermetic properties and the gas can be effectively prevented from leaking from the tube and entering into a clean.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for sealing a heat-resistant cylindrical body that is used in combination with a heating furnace that is essential in the manufacturing process of semiconductor devices.

(Conventional technology) Recently, the scale of production of semiconductor products has been increasing, and for this reason, there is a need to establish highly productive manufacturing lines.As part of this, semiconductor wafers are also becoming larger in diameter. in the direction.

Due to this tendency, manual handling becomes difficult, and automation of semiconductor wafer transportation, setting in equipment, etc. is inevitably required.

On the other hand, recent semiconductor devices, as exemplified by VLSI, are trending toward higher integration and higher performance, and as a result, the manufacturing process has become more diverse, and the cleanliness of the manufacturing line has become less clean. Automation is also of great significance in that it can have a large impact on the environment, and it can also keep away from the human body, which is the source of dust.

Nowadays, however, the cleanliness of the manufacturing line is increasingly affecting the amount of dripping from semiconductor devices.

A so-called soft lander has been developed and is now in practical use, and improvements have also been made to the cleaning of heat-resistant tubes and lids. In other words, the lid fitted to the heat-resistant tube is placed inside the clean room, and when cleaning it, the heat-resistant tube integrated with the lid is taken out from the opening of the heating furnace located outside the clean room to prevent contamination within the clean room. I'm here.

In heating equipment such as diffusion furnaces that are essential to the semiconductor wafer manufacturing process, an insulating tube with a heating source such as a heater buried inside is prepared, into which a heat-resistant tube can be inserted, but the semiconductor wafer, which is the object to be heated, In order to prevent contamination by impurities, quartz and SiC, which are materials similar in chemical composition and properties to those of the stabilizing substance on the semiconductor surface, are selected.゛As shown in Fig. 3, the heat-resistant tube 10 disposed in the heat-insulating tube body is provided with a lid 10 made of the same material at its end, and a tapered portion 12 formed at the end of both 10 and 11 connects both. In addition, the fitting portion is rubbed to make it smooth and easy to attach and detach.

Further, the gas required for heat treatment is discharged from an opening 13 provided at the center of the lid 10, and a handle 14 is also provided.

(Problems to be Solved by the Invention) As mentioned above, in order to maintain the cleanliness inside the clean room, it is necessary to ensure the sealing in the heat treatment process using heat-resistant tubes. Therefore, a structure could be considered in which an O-ring is applied to the fitting part of the heat-resistant tube and the lid body, and a water-cooling mechanism is attached to the outer periphery of the O-ring to prevent deterioration due to high temperatures. At present, there is no O-ring material that can withstand this.

Furthermore, as mentioned above, the fitting part between the heat-resistant tube and the lid body is subjected to a sliding process and a tapered part is provided to facilitate attachment and detachment, but when quartz is used as a material, this sliding process Since it cannot be made precisely, its airtightness is not sufficient.

On the other hand, in the heat treatment process using heat-resistant tubes, materials such as hydrochloric acid that do not want to leak into the clean room are often used, but there is an undeniable drawback that leakage is inevitable because the airtightness of the rubbed part is not sufficient.

Furthermore, even if the fit between the heat-resistant tube and the lid is in good condition with a one-to-one correspondence, it is difficult to reproduce a common situation for all, and there is a drawback that gas leaks into the clean room. be.

[Structure of the invention]

(Means for Solving the Problems) In the method for sealing a heat-resistant tube for semiconductor heating according to the present invention, a lid body is fitted into a tapered portion provided at the end portion of the heat-resistant tube for sealing. A groove was installed in the sliding part to lead out of the lid body, and a method was adopted in which a mechanism for suctioning harmful gases used in the heat-resistant tube could be attached to this groove.

(Function) The method of sealing the heat-resistant tube for semiconductor heating with one end sealed according to the present invention involves forming a tapered part at the fitting part with the outer lid, applying a sliding process, and further installing an O-ring. A groove is provided in this fitting part, and the end thereof is guided out of the lid body. A gas suction mechanism is attached to the end of this groove and connected to a duct provided in the clean room. As a result, it was introduced into heat-resistant tubes,
Moreover, if leaked into the clean room, harmful hydrogen chloride, etc., will be discharged through this groove at high temperatures, which will maintain the cleanliness of the clean room at a constant level and contribute to reducing the amount of dripping of semiconductor devices.

(Example) As shown in FIG.
It has an inner diameter of 00 nm to 300 mm, one end of which is sealed, a gas introduction tube with an outer diameter of 5 nm to 20 nm is welded to it, and a tapered part 2 is provided at the other end (not shown), and the outer periphery has a tapered part 2. A processed portion 3 is formed.

A lid 4 made of quartz is fitted into the tapered sliding part 3 of this quartz tube, and an outlet 5 for gas introduced into the quartz tube 1 is provided in the center. tube 1
A similar sliding portion is formed at a position corresponding to the sliding portion 3 of.

A groove 6 is formed over the outer periphery of the part 3 subjected to this matching process, and a part 7 of the groove 6 is led out to the outside of the lid body 4.

An O-ring 8 is installed in the groove 6 surrounding the outer periphery of the quartz tube 1.
The introduced gas is designed to flow out from the groove 6 led out of the lid body 4 while maintaining airtightness with the lid body 4. For this purpose, a gas suction mechanism 9 is attached to the second part and connected to a duct that is always installed in the clean room. The provision of this groove 6 makes it possible to compensate for insufficient airtightness due to the sliding process applied to the fitting portion of the quartz tube 1 and the lid body 4.

Of course, a water cooler groove can be added to the lid 4 in order to prevent functional deterioration of the ○ ring due to temperature rise. Further, as shown in FIG. 2, it is also possible to provide a flange portion 10 at the end of the quartz tube 1.

〔Effect of the invention〕

As described above, in the method of the present invention, by forming a groove in the fitting portion of the quartz tube and the lid, the airtightness thereof is improved and undesired gas leakage into the clean room is prevented.

[Brief explanation of drawings]

1 and 2 are cross-sectional views showing a part of the apparatus applied to carry out the method of the present invention, and FIG. 3 is a cross-sectional view of the apparatus used in the conventional method.

Claims (1)

[Claims] A heat-resistant lid body is fitted near the terminal of a heat-resistant cylinder for heating semiconductors with one end sealed, which is inserted into an insulating tube body in which a heating source is arranged, and a sliding part is formed at this fitted part. A method for sealing a heat-resistant tube for semiconductor heating, characterized in that a groove leading out of the lid is installed in the lid.