JPS6225686B2 - - Google Patents
Info
- Publication number
- JPS6225686B2 JPS6225686B2 JP58011718A JP1171883A JPS6225686B2 JP S6225686 B2 JPS6225686 B2 JP S6225686B2 JP 58011718 A JP58011718 A JP 58011718A JP 1171883 A JP1171883 A JP 1171883A JP S6225686 B2 JPS6225686 B2 JP S6225686B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing
- weight
- parts
- amount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003822 epoxy resin Substances 0.000 claims description 27
- 229920000647 polyepoxide Polymers 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 18
- 230000003287 optical effect Effects 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 150000008065 acid anhydrides Chemical class 0.000 claims description 9
- BDAGIHXWWSANSR-UHFFFAOYSA-M Formate Chemical compound [O-]C=O BDAGIHXWWSANSR-UHFFFAOYSA-M 0.000 claims description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 5
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 claims 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-M toluene-4-sulfonate Chemical compound CC1=CC=C(S([O-])(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-M 0.000 claims 1
- 238000002845 discoloration Methods 0.000 description 8
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- -1 metal complex salt Chemical class 0.000 description 3
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 2
- 238000004040 coloring Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- WWQVWTZPJYJFDS-UHFFFAOYSA-N 1,3,5-tris(dimethylamino)cyclohexa-2,4-dien-1-ol Chemical compound CN(C)C1=CC(N(C)C)=CC(O)(N(C)C)C1 WWQVWTZPJYJFDS-UHFFFAOYSA-N 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N 2-Ethylhexanoic acid Chemical class CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- FPVGTPBMTFTMRT-NSKUCRDLSA-L fast yellow Chemical compound [Na+].[Na+].C1=C(S([O-])(=O)=O)C(N)=CC=C1\N=N\C1=CC=C(S([O-])(=O)=O)C=C1 FPVGTPBMTFTMRT-NSKUCRDLSA-L 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Landscapes
- Light Receiving Elements (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58011718A JPS59136321A (ja) | 1983-01-26 | 1983-01-26 | 光半導体封止用エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58011718A JPS59136321A (ja) | 1983-01-26 | 1983-01-26 | 光半導体封止用エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59136321A JPS59136321A (ja) | 1984-08-04 |
| JPS6225686B2 true JPS6225686B2 (enExample) | 1987-06-04 |
Family
ID=11785817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58011718A Granted JPS59136321A (ja) | 1983-01-26 | 1983-01-26 | 光半導体封止用エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59136321A (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6086175A (ja) * | 1983-10-19 | 1985-05-15 | Sumitomo Deyurezu Kk | エポキシ樹脂粉体塗料組成物 |
| JPS61200118A (ja) * | 1985-03-01 | 1986-09-04 | Sumitomo Bakelite Co Ltd | 光半導体封止用エポキシ樹脂組成物 |
| KR100516409B1 (ko) | 1998-02-19 | 2005-09-23 | 히다치 가세고교 가부시끼가이샤 | 신규 화합물, 경화촉진제, 수지조성물 및 전자부품장치 |
| US20030059618A1 (en) * | 2001-03-23 | 2003-03-27 | Hideyuke Takai | Method of producing epoxy compound, epoxy resin composition and its applications, ultraviolet rays-curable can-coating composition and method of producing coated metal can |
| US20060009547A1 (en) | 2002-09-05 | 2006-01-12 | Hisashi Maeshima | Process for preparation of alicyclic diepoxy compound, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation |
| JPWO2005092980A1 (ja) * | 2004-03-25 | 2008-02-14 | 松下電工株式会社 | 光半導体素子封止用エポキシ樹脂組成物、及び光半導体装置 |
-
1983
- 1983-01-26 JP JP58011718A patent/JPS59136321A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59136321A (ja) | 1984-08-04 |
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