JPS6225440A - 電気部品用熱伝導性シ−ト - Google Patents
電気部品用熱伝導性シ−トInfo
- Publication number
- JPS6225440A JPS6225440A JP16491585A JP16491585A JPS6225440A JP S6225440 A JPS6225440 A JP S6225440A JP 16491585 A JP16491585 A JP 16491585A JP 16491585 A JP16491585 A JP 16491585A JP S6225440 A JPS6225440 A JP S6225440A
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- sheet
- silicone rubber
- conductive sheet
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16491585A JPS6225440A (ja) | 1985-07-25 | 1985-07-25 | 電気部品用熱伝導性シ−ト |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16491585A JPS6225440A (ja) | 1985-07-25 | 1985-07-25 | 電気部品用熱伝導性シ−ト |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6225440A true JPS6225440A (ja) | 1987-02-03 |
| JPH0351302B2 JPH0351302B2 (en, 2012) | 1991-08-06 |
Family
ID=15802273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16491585A Granted JPS6225440A (ja) | 1985-07-25 | 1985-07-25 | 電気部品用熱伝導性シ−ト |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6225440A (en, 2012) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4085342B2 (ja) * | 1997-10-14 | 2008-05-14 | 松下電器産業株式会社 | 熱伝導部品およびそれを用いた熱接続構造体 |
| US8081468B2 (en) | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014196347A1 (ja) * | 2013-06-07 | 2014-12-11 | 信越化学工業株式会社 | 熱伝導性複合シート及び放熱構造体 |
-
1985
- 1985-07-25 JP JP16491585A patent/JPS6225440A/ja active Granted
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4085342B2 (ja) * | 1997-10-14 | 2008-05-14 | 松下電器産業株式会社 | 熱伝導部品およびそれを用いた熱接続構造体 |
| US8081468B2 (en) | 2009-06-17 | 2011-12-20 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
| US8837151B2 (en) | 2009-06-17 | 2014-09-16 | Laird Technologies, Inc. | Memory modules including compliant multilayered thermally-conductive interface assemblies |
| US9222735B2 (en) | 2009-06-17 | 2015-12-29 | Laird Technologies, Inc. | Compliant multilayered thermally-conductive interface assemblies |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0351302B2 (en, 2012) | 1991-08-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |