JPS62252181A - 光半導体素子の製造方法 - Google Patents

光半導体素子の製造方法

Info

Publication number
JPS62252181A
JPS62252181A JP61095430A JP9543086A JPS62252181A JP S62252181 A JPS62252181 A JP S62252181A JP 61095430 A JP61095430 A JP 61095430A JP 9543086 A JP9543086 A JP 9543086A JP S62252181 A JPS62252181 A JP S62252181A
Authority
JP
Japan
Prior art keywords
synthetic resin
optical semiconductor
semiconductor element
mold
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61095430A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0440869B2 (enExample
Inventor
Hiromoto Tamura
田村　弘基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP61095430A priority Critical patent/JPS62252181A/ja
Publication of JPS62252181A publication Critical patent/JPS62252181A/ja
Publication of JPH0440869B2 publication Critical patent/JPH0440869B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP61095430A 1986-04-24 1986-04-24 光半導体素子の製造方法 Granted JPS62252181A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61095430A JPS62252181A (ja) 1986-04-24 1986-04-24 光半導体素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61095430A JPS62252181A (ja) 1986-04-24 1986-04-24 光半導体素子の製造方法

Publications (2)

Publication Number Publication Date
JPS62252181A true JPS62252181A (ja) 1987-11-02
JPH0440869B2 JPH0440869B2 (enExample) 1992-07-06

Family

ID=14137476

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61095430A Granted JPS62252181A (ja) 1986-04-24 1986-04-24 光半導体素子の製造方法

Country Status (1)

Country Link
JP (1) JPS62252181A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5221641A (en) * 1991-06-21 1993-06-22 Rohm Co., Ltd. Process for making light emitting diodes
WO1997004509A3 (de) * 1995-07-19 2002-02-14 Siemens Ag Halbleiterlaserchip und infrarot-emitter-bauelement

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10190066A (ja) * 1996-12-27 1998-07-21 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたｌｅｄ表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899063U (enExample) * 1972-02-28 1973-11-22
JPS5137427U (enExample) * 1974-09-09 1976-03-19

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4899063U (enExample) * 1972-02-28 1973-11-22
JPS5137427U (enExample) * 1974-09-09 1976-03-19

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5221641A (en) * 1991-06-21 1993-06-22 Rohm Co., Ltd. Process for making light emitting diodes
WO1997004509A3 (de) * 1995-07-19 2002-02-14 Siemens Ag Halbleiterlaserchip und infrarot-emitter-bauelement

Also Published As

Publication number Publication date
JPH0440869B2 (enExample) 1992-07-06

Similar Documents

Publication Publication Date Title
DE3783338D1 (de) Polymerteilchen-zusammensetzung, verfahren zur herstellung von polymerteilchen und lichtstreuende thermoplastische polymerzusammensetzungen mit diesen polymerteilchen.
GB1411199A (en) Electroluminescent semiconductor apparatus and method of fabricating the same
DE602004018659D1 (de) Optische transmissionselemente mit durchsichtiger kunststoffschale mit darin dispergiertem phosphor und herstellungsverfahren dafür
CN101386194A (zh) Led组件中树脂透镜体的成型方法
US20020093287A1 (en) White light LED
JPS62252181A (ja) 光半導体素子の製造方法
KR20090115535A (ko) 칩 엘이디 패키지 제조방법
JP2001060724A (ja) 拡散発光素子およびその製造方法
JPH05251485A (ja) 発光装置のレンズ成形方法
CN104134743A (zh) Led封装结构及封装方法、显示装置、照明装置
WO2020261766A1 (ja) 発光装置及びその製造方法
TW201425814A (zh) 發光二極體模組及其製造方法
US9333681B2 (en) Optical lens, method for manufacturing the optical lens and light source module incorporating the optical lens
JPS6138878B2 (enExample)
JPH05206524A (ja) 光半導体用モールド樹脂
CN105322071A (zh) 一种芯片级白光led及其制作方法
CN200997405Y (zh) 具有模造玻璃透镜的发光二极管组件
JPH01152676A (ja) 発光ダイオード装置
JPH0361195B2 (enExample)
JPH0311895Y2 (enExample)
JPH0534121Y2 (enExample)
JPH0529663A (ja) 光半導体装置およびその樹脂封止方法
JP4365921B2 (ja) 発光ダイオードの製造方法
CN102054922A (zh) 发光二极管封胶罩壳及其制造方法
JPS6222557B2 (enExample)