JPS6225117A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物Info
- Publication number
- JPS6225117A JPS6225117A JP16374885A JP16374885A JPS6225117A JP S6225117 A JPS6225117 A JP S6225117A JP 16374885 A JP16374885 A JP 16374885A JP 16374885 A JP16374885 A JP 16374885A JP S6225117 A JPS6225117 A JP S6225117A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- curing agent
- agent
- acrylonitrile
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 29
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 29
- 239000000203 mixture Substances 0.000 title claims abstract description 15
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 claims abstract description 7
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 5
- 229920001577 copolymer Polymers 0.000 claims abstract description 5
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims abstract 3
- 150000001875 compounds Chemical class 0.000 claims abstract 3
- 239000004593 Epoxy Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 claims description 2
- 239000004480 active ingredient Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 abstract description 12
- 238000004898 kneading Methods 0.000 abstract description 5
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract description 2
- 230000002040 relaxant effect Effects 0.000 abstract 2
- MTYCXPNDBZCTFX-UHFFFAOYSA-N 4,6-dihydrazinyl-n-methyl-1,3,5-triazin-2-amine Chemical compound CNC1=NC(NN)=NC(NN)=N1 MTYCXPNDBZCTFX-UHFFFAOYSA-N 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 12
- 239000000565 sealant Substances 0.000 description 10
- 230000035882 stress Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 239000005350 fused silica glass Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- -1 triazine compound Chemical class 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006355 external stress Effects 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16374885A JPS6225117A (ja) | 1985-07-24 | 1985-07-24 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16374885A JPS6225117A (ja) | 1985-07-24 | 1985-07-24 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6225117A true JPS6225117A (ja) | 1987-02-03 |
| JPH029616B2 JPH029616B2 (enExample) | 1990-03-02 |
Family
ID=15779940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16374885A Granted JPS6225117A (ja) | 1985-07-24 | 1985-07-24 | エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6225117A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6572739B2 (en) | 2000-01-19 | 2003-06-03 | Fuji Photo Film Co., Ltd. | Electrolytic apparatus for forming a support for lithographic printing plate |
| JP2007190640A (ja) * | 2006-01-19 | 2007-08-02 | Nsk Ltd | シャフト圧入装置 |
-
1985
- 1985-07-24 JP JP16374885A patent/JPS6225117A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6572739B2 (en) | 2000-01-19 | 2003-06-03 | Fuji Photo Film Co., Ltd. | Electrolytic apparatus for forming a support for lithographic printing plate |
| JP2007190640A (ja) * | 2006-01-19 | 2007-08-02 | Nsk Ltd | シャフト圧入装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH029616B2 (enExample) | 1990-03-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |