JPS6224893A - ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材 - Google Patents

ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Info

Publication number
JPS6224893A
JPS6224893A JP7707786A JP7707786A JPS6224893A JP S6224893 A JPS6224893 A JP S6224893A JP 7707786 A JP7707786 A JP 7707786A JP 7707786 A JP7707786 A JP 7707786A JP S6224893 A JPS6224893 A JP S6224893A
Authority
JP
Japan
Prior art keywords
filler metal
brazing
brazing filler
melting point
alloy brazing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7707786A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6254600B2 (enrdf_load_stackoverflow
Inventor
Hideaki Yoshida
秀昭 吉田
Masaki Morikawa
正樹 森川
Kunio Kishida
岸田　邦雄
Tadaharu Tanaka
田中　忠治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Metal Corp
Original Assignee
Mitsubishi Metal Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Metal Corp filed Critical Mitsubishi Metal Corp
Priority to JP7707786A priority Critical patent/JPS6224893A/ja
Publication of JPS6224893A publication Critical patent/JPS6224893A/ja
Publication of JPS6254600B2 publication Critical patent/JPS6254600B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
JP7707786A 1986-04-03 1986-04-03 ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材 Granted JPS6224893A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7707786A JPS6224893A (ja) 1986-04-03 1986-04-03 ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7707786A JPS6224893A (ja) 1986-04-03 1986-04-03 ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP5426681A Division JPS57171599A (en) 1981-04-13 1981-04-13 Low melting point cu-ag system alloy solder with excellent wetting property

Publications (2)

Publication Number Publication Date
JPS6224893A true JPS6224893A (ja) 1987-02-02
JPS6254600B2 JPS6254600B2 (enrdf_load_stackoverflow) 1987-11-16

Family

ID=13623720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7707786A Granted JPS6224893A (ja) 1986-04-03 1986-04-03 ぬれ性の良好な低融点Ｃｕ−Ａｇ系合金ろう材

Country Status (1)

Country Link
JP (1) JPS6224893A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03228565A (ja) * 1990-02-02 1991-10-09 Ietatsu Ono 研磨槽とその研磨槽を用いる研磨加工方法
US20100203341A1 (en) * 2007-07-17 2010-08-12 David Patrick Egan Method for joining sic-diamond
CN101569967B (zh) 2009-06-16 2011-05-11 贵研铂业股份有限公司 一种含有Si和Ga的铜-银合金低蒸汽压钎料及其应用
JP2012121055A (ja) * 2010-12-09 2012-06-28 Nhk Spring Co Ltd 大気接合用ろう材、接合体、および、集電材料

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03228565A (ja) * 1990-02-02 1991-10-09 Ietatsu Ono 研磨槽とその研磨槽を用いる研磨加工方法
US20100203341A1 (en) * 2007-07-17 2010-08-12 David Patrick Egan Method for joining sic-diamond
JP2011527979A (ja) * 2007-07-17 2011-11-10 エレメント シックス リミテッド ＳｉＣ−ダイヤモンドを接合する方法
US8757472B2 (en) 2007-07-17 2014-06-24 David Patrick Egan Method for joining SiC-diamond
CN101569967B (zh) 2009-06-16 2011-05-11 贵研铂业股份有限公司 一种含有Si和Ga的铜-银合金低蒸汽压钎料及其应用
JP2012121055A (ja) * 2010-12-09 2012-06-28 Nhk Spring Co Ltd 大気接合用ろう材、接合体、および、集電材料

Also Published As

Publication number Publication date
JPS6254600B2 (enrdf_load_stackoverflow) 1987-11-16

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