JPS62244631A - 複合積層セラミツク部品の製造方法 - Google Patents

複合積層セラミツク部品の製造方法

Info

Publication number
JPS62244631A
JPS62244631A JP61089319A JP8931986A JPS62244631A JP S62244631 A JPS62244631 A JP S62244631A JP 61089319 A JP61089319 A JP 61089319A JP 8931986 A JP8931986 A JP 8931986A JP S62244631 A JPS62244631 A JP S62244631A
Authority
JP
Japan
Prior art keywords
sheet
raw
dielectric
insulator
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61089319A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0542159B2 (enrdf_load_stackoverflow
Inventor
孝忠 冨岡
嶋田 勇三
和明 内海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61089319A priority Critical patent/JPS62244631A/ja
Publication of JPS62244631A publication Critical patent/JPS62244631A/ja
Publication of JPH0542159B2 publication Critical patent/JPH0542159B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP61089319A 1986-04-17 1986-04-17 複合積層セラミツク部品の製造方法 Granted JPS62244631A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61089319A JPS62244631A (ja) 1986-04-17 1986-04-17 複合積層セラミツク部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61089319A JPS62244631A (ja) 1986-04-17 1986-04-17 複合積層セラミツク部品の製造方法

Publications (2)

Publication Number Publication Date
JPS62244631A true JPS62244631A (ja) 1987-10-26
JPH0542159B2 JPH0542159B2 (enrdf_load_stackoverflow) 1993-06-25

Family

ID=13967344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61089319A Granted JPS62244631A (ja) 1986-04-17 1986-04-17 複合積層セラミツク部品の製造方法

Country Status (1)

Country Link
JP (1) JPS62244631A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62265795A (ja) * 1986-05-14 1987-11-18 株式会社住友金属セラミックス コンデンサ内蔵セラミツクス基板
JPH01166599A (ja) * 1987-12-22 1989-06-30 Narumi China Corp 積層セラミック基板の製造方法
US4858077A (en) * 1987-11-25 1989-08-15 Hitachi, Ltd. Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board
JPH01312896A (ja) * 1988-06-09 1989-12-18 Murata Mfg Co Ltd セラミック多層基板
US5110654A (en) * 1989-07-17 1992-05-05 Nec Corporation Ceramic multilayer wiring substrate
JPH05191048A (ja) * 1992-01-13 1993-07-30 Murata Mfg Co Ltd セラミック多層電子部品の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62265795A (ja) * 1986-05-14 1987-11-18 株式会社住友金属セラミックス コンデンサ内蔵セラミツクス基板
US4858077A (en) * 1987-11-25 1989-08-15 Hitachi, Ltd. Condenser-containing, ceramic multi-layer circuit board and semiconductor module and computer having the circuit board
JPH01166599A (ja) * 1987-12-22 1989-06-30 Narumi China Corp 積層セラミック基板の製造方法
JPH01312896A (ja) * 1988-06-09 1989-12-18 Murata Mfg Co Ltd セラミック多層基板
US5110654A (en) * 1989-07-17 1992-05-05 Nec Corporation Ceramic multilayer wiring substrate
JPH05191048A (ja) * 1992-01-13 1993-07-30 Murata Mfg Co Ltd セラミック多層電子部品の製造方法

Also Published As

Publication number Publication date
JPH0542159B2 (enrdf_load_stackoverflow) 1993-06-25

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Legal Events

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EXPY Cancellation because of completion of term