JPS62241390A - プリント配線基板 - Google Patents
プリント配線基板Info
- Publication number
- JPS62241390A JPS62241390A JP8448386A JP8448386A JPS62241390A JP S62241390 A JPS62241390 A JP S62241390A JP 8448386 A JP8448386 A JP 8448386A JP 8448386 A JP8448386 A JP 8448386A JP S62241390 A JPS62241390 A JP S62241390A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- inorganic
- wiring board
- plating
- aromatic polysulfone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8448386A JPS62241390A (ja) | 1986-04-11 | 1986-04-11 | プリント配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8448386A JPS62241390A (ja) | 1986-04-11 | 1986-04-11 | プリント配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62241390A true JPS62241390A (ja) | 1987-10-22 |
JPH0260234B2 JPH0260234B2 (enrdf_load_stackoverflow) | 1990-12-14 |
Family
ID=13831892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8448386A Granted JPS62241390A (ja) | 1986-04-11 | 1986-04-11 | プリント配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62241390A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03215560A (ja) * | 1990-01-22 | 1991-09-20 | Mitsui Toatsu Chem Inc | 樹脂組成物 |
CN1052990C (zh) * | 1996-11-01 | 2000-05-31 | 中国科学院长春应用化学研究所 | 聚芳醚砜/无机粒子复合材料的制备 |
-
1986
- 1986-04-11 JP JP8448386A patent/JPS62241390A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03215560A (ja) * | 1990-01-22 | 1991-09-20 | Mitsui Toatsu Chem Inc | 樹脂組成物 |
CN1052990C (zh) * | 1996-11-01 | 2000-05-31 | 中国科学院长春应用化学研究所 | 聚芳醚砜/无机粒子复合材料的制备 |
Also Published As
Publication number | Publication date |
---|---|
JPH0260234B2 (enrdf_load_stackoverflow) | 1990-12-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6127492A (en) | Thermoplastic resin composition and heat-resistant tray for IC | |
EP0211979B2 (en) | Laminate board containing uniformly distributed filler particles and method for producing the same | |
US4798762A (en) | Laminate board containing uniformly distributed filler particles and method for producing the same | |
JP5554500B2 (ja) | プリプレグ、プリント配線板、多層回路基板、プリント配線板の製造方法 | |
US5149581A (en) | Polyether copolymers, resin compositions containing them, and molded articles formed from them | |
JPH01301756A (ja) | メツキ特性に優れた芳香族ポリスルフオン樹脂組成物 | |
JPH0255721A (ja) | プリント配線基板の製造に有用な硬化性組成物 | |
US4550140A (en) | Circuit board substrates prepared from poly(aryl ethers)s | |
US4985293A (en) | Polymer blend for molded circuit boards and other selectively conductive molded devices | |
JPS62241390A (ja) | プリント配線基板 | |
JPH03197687A (ja) | 樹脂成形品の金属メッキ前処理方法 | |
EP0097370B2 (en) | Use of a composition for making circuit board substrates and electrical connectors | |
JP2667625B2 (ja) | 絶縁積層板用のポリフェニレンエーテル/ポリエポキシド樹脂組成物 | |
JPS63139942A (ja) | ナイロン樹脂組成物 | |
US4816505A (en) | New polyarylethersulfone circuit board substrates | |
DE69000836T2 (de) | Verfahren zur metallisierung von geformten kunststoff-gegenstaenden und metallisierte geformte kunststoff-gegenstaende. | |
JP2001233945A (ja) | 無電解メッキ可能な高耐熱性エポキシ樹脂組成物、それを用いたビルドアップ用絶縁材料並びにビルドアップ基板 | |
US4939199A (en) | Novel poly(aryl ethers) useful for molding into a circuit board substrate | |
DE10324407A1 (de) | Epoxyharzzusammensetzung | |
JPH06200057A (ja) | 液晶ポリエステル樹脂組成物の成形品の表面処理方法 | |
JPS62187764A (ja) | 耐熱樹脂フイルム | |
JPH11323131A (ja) | 熱可塑性樹脂組成物およびic用耐熱トレー | |
JPS63178166A (ja) | 芳香族ポリスルフォン樹脂組成物 | |
JP2000034408A (ja) | 熱可塑性樹脂組成物およびその成形品 | |
JPS6119318A (ja) | プリント回路用基板の製造方法、該方法に用いられる組成物およびそれより製せられる基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R370 | Written measure of declining of transfer procedure |
Free format text: JAPANESE INTERMEDIATE CODE: R370 |
|
R370 | Written measure of declining of transfer procedure |
Free format text: JAPANESE INTERMEDIATE CODE: R370 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |