JPS62235765A - Monolithic mirowave amplifier - Google Patents

Monolithic mirowave amplifier

Info

Publication number
JPS62235765A
JPS62235765A JP7876786A JP7876786A JPS62235765A JP S62235765 A JPS62235765 A JP S62235765A JP 7876786 A JP7876786 A JP 7876786A JP 7876786 A JP7876786 A JP 7876786A JP S62235765 A JPS62235765 A JP S62235765A
Authority
JP
Japan
Prior art keywords
metal layer
capacitor
electrical characteristics
micro
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7876786A
Other languages
Japanese (ja)
Inventor
Taeko Nakamura
中村 多恵子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7876786A priority Critical patent/JPS62235765A/en
Publication of JPS62235765A publication Critical patent/JPS62235765A/en
Pending legal-status Critical Current

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Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE:To facilitate the process of adjusting electrical characteristics by a method wherein a plurality of contacts are provided in a capacitor base metal layer for connection with a micro-strip line and electrical connection is established by using a contact most suitable for electrical characteristics adjustment. CONSTITUTION:A capacitor 4b in a monolithic microwave amplifier constituted of an FET, micro.-line 6, and said capacitor ab, all installed on a semiconductor substrate, is built of a lower metal layer 8 formed on the semiconductor substrate and an upper metal layer formed opposite to said lower metal layer 8 through the intermediary of a dielectric layer. The lower metal layer 8 is provided with a plurality of contacts 9 capable of connection to a MICRO- STRIP line 6. One of the contacts 9 is used to establish connection with the micro-strip line 6. For example, when a measurement is accomplished of electrical characteristics after the production of a amplifier chip using a contact 9a and the conclusion is that the micro-strip line 6 needs to be augmented in length, a change is made for the use of contact 9c instead of the contact 9a.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は半導体基板上に構成されたモノリシックマイ
クロ波増幅器(monolithic microwa
veamplifier )に関し、特にその電気的特
性の調整に関するものである。
[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a monolithic microwave amplifier constructed on a semiconductor substrate.
veamplifier), and in particular to the adjustment of its electrical characteristics.

〔従来の技術〕[Conventional technology]

第2図は従来の装置を示す略平面図で、図において(1
)は入力端、(2)は出力端、(3)はFET、  (
4&)。
FIG. 2 is a schematic plan view showing a conventional device, and in the figure (1
) is the input end, (2) is the output end, (3) is the FET, (
4&).

(4b)、(4c)、(4d)  はそれぞれキャパシ
タ、(5)はパッド(pad)であり、パッド(5)は
接地電位への接続を行う。(6)はマイクロストリップ
線路でマイクロ波を伝送する分布定数回路を構成する。
(4b), (4c), and (4d) are capacitors, and (5) is a pad, and the pad (5) is connected to the ground potential. (6) constitutes a distributed constant circuit that transmits microwaves through a microstrip line.

第3図は第2図のキャパシタの構成を示す略平面図(第
3図(a))と略立面図(第3図(b))で、第3図に
おいて第2図と同一符号は同一部分を示し、(7)はキ
ャパシタを構成する上地金属層、(8)は同じく下地金
属層、(9a)  はコンタクト部分、(1のは誘電体
である。上地金属層(7)と下地金属層18)との同に
静電容量が形成され、マイクロストリップ線路(6)は
コンタクト部分(9a)によって下地金属層(8)に接
続され、上地金属層(7)はキャパシタ(4a)では入
力端(1)に、キャパシタ(4b)では出力端(2)に
、キャパシタ(4c)、(4d)ではパッド(5)ヲ介
して接地電位に接続される。
FIG. 3 is a schematic plan view (FIG. 3(a)) and a schematic elevational view (FIG. 3(b)) showing the structure of the capacitor in FIG. 2. In FIG. 3, the same reference numerals as in FIG. Showing the same parts, (7) is the upper metal layer constituting the capacitor, (8) is also the base metal layer, (9a) is the contact part, (1 is the dielectric material. Upper metal layer (7) and the base metal layer 18), the microstrip line (6) is connected to the base metal layer (8) by the contact portion (9a), and the base metal layer (7) is connected to the capacitor ( 4a) is connected to the input end (1), the capacitor (4b) is connected to the output end (2), and the capacitors (4c) and (4d) are connected to the ground potential via the pad (5).

ところで、一般にモノリシックマイクロ波増幅器におい
ては、集積回路チップ製造後、その電気的特性を測定し
、製造したチップの電気的特性を修正する必要がある場
合は、マイクロストリップ線路のマスク変更を行い、集
積回路チップを製造し直した。
By the way, in general, in monolithic microwave amplifiers, after the integrated circuit chip is manufactured, its electrical characteristics are measured, and if it is necessary to modify the electrical characteristics of the manufactured chip, the mask of the microstrip line is changed, and the integrated circuit chip is The circuit chip was remanufactured.

第4図は従来のモノリシックマイクロ波増幅器における
電気的特性の修正を示す略平面図で、第4図において第
2図と同一符号は同−又は相当部分を示し、第4図fa
)に示す増幅器を製造してその電気的特性を測定し、測
定結果に従って第4図1alに示すようにマイクロスト
リップ線路(6)を修正したことを示している。
FIG. 4 is a schematic plan view showing modification of electrical characteristics in a conventional monolithic microwave amplifier. In FIG. 4, the same reference numerals as in FIG.
) was manufactured, its electrical characteristics were measured, and the microstrip line (6) was modified as shown in FIG. 4 1al according to the measurement results.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

従来のモノリシックマイクロ波増幅器では1個のキャパ
シタの下地金属層をマイクロストリップ線路(6)に接
続するためのコンタクト部分は1箇所しか設けられてい
ないため、第4図1alに示す回路から第4回出)に示
す回路に修正する場合に、修正後のマイクロストリップ
線路(6)全形成できる範囲が制約され、その結果、所
望の電気的特性を得るための修正が困難になるという問
題点があった。
In the conventional monolithic microwave amplifier, there is only one contact part for connecting the base metal layer of one capacitor to the microstrip line (6), so the fourth circuit from the circuit shown in FIG. When modifying the circuit shown in Figure 1), there is a problem in that the range in which the entire modified microstrip line (6) can be formed is restricted, and as a result, it becomes difficult to modify the circuit to obtain the desired electrical characteristics. Ta.

この発明は上記のような問題点を解決するためになされ
たもので、電気的特性の修正が容易なモノリシックマイ
クロ波増幅器を得ることを目的とする。
The present invention was made to solve the above-mentioned problems, and an object of the present invention is to obtain a monolithic microwave amplifier whose electrical characteristics can be easily modified.

〔問題点を解決するための手段〕[Means for solving problems]

この発明ではキャパシタの下地金属層にマイクロストリ
ップ線路と接続するためのコンタクト部分を複数個もう
け、電気的特性全調整するのに最も適したコンタクト部
分でマイクロストリップ線路と接続するようにした。
In this invention, a plurality of contact portions for connecting to the microstrip line are provided in the base metal layer of the capacitor, and the connection to the microstrip line is made at the contact portion most suitable for fully adjusting the electrical characteristics.

〔作用〕[Effect]

キャパシタと接続するためのコンタクト部分について、
別の位置に設けられたコンタクト部分を選択することK
よって、マイクロストリップ線路の形状を大幅に変更す
ることができ、電気的特性の修正が容易になる。
Regarding the contact part for connecting to the capacitor,
Selecting a contact part provided in a different position K
Therefore, the shape of the microstrip line can be changed significantly, and the electrical characteristics can be easily modified.

〔実施例〕〔Example〕

以下この発明の実施例を図面について説明する。 Embodiments of the present invention will be described below with reference to the drawings.

第1図はこの発明の一実施例を示す略平面図であって、
電気的特性を修正するため第1図[alに示す構成から
第1図[blに示す構成に修正した場合を示す。第1図
において第2図、第3図と同一符号は同一部分を示し、
(9a)、(9b)、(9c)  はそれぞれ下地金属
層(8)のそれぞれ異なる部分に設けられたそれぞれの
コンタクト部分である。
FIG. 1 is a schematic plan view showing one embodiment of the present invention,
A case is shown in which the configuration shown in FIG. 1 [al] is modified to the configuration shown in FIG. 1 [bl] in order to modify the electrical characteristics. In FIG. 1, the same symbols as in FIGS. 2 and 3 indicate the same parts,
(9a), (9b), and (9c) are respective contact portions provided in different portions of the base metal layer (8), respectively.

第4図1alではコンタクト部分(9a)  e使用し
ていたが、この増幅器のチップ製造後、その電気的特性
を測定した結果、このキャパシタ(4b)に到るマイク
ロストリップ線路(6)の長さを増加する必要があると
決定された為、第1図[blに示すようにコンタクト部
分(9c)i使用することに変更してマイクロストリッ
プ線路(6)の長さの増加を容易にした。
In Fig. 4 1al, the contact part (9a) e was used, but as a result of measuring the electrical characteristics after manufacturing the chip of this amplifier, it was found that the length of the microstrip line (6) leading to this capacitor (4b) was It was determined that it was necessary to increase the length of the microstrip line (6), so the length of the microstrip line (6) was easily increased by using a contact portion (9c)i as shown in FIG.

第1図に示す実施例では1個のキャパシタに3箇所のコ
ンタクト部分を設ける場合を示したが、コンタクト部分
を設ける箇所の数及びその位置については何等の限定は
ない。
Although the embodiment shown in FIG. 1 shows a case in which one capacitor is provided with three contact portions, there are no limitations on the number of contact portions and their positions.

また、上記実施例では増幅器として説明したが、この発
明は発振器や周波数逓倍器等、回路の電気的特性を調整
する必要のある総ての回路に適用できるものであシ、こ
の場合発振器や周波数逓倍器にも増幅作用が存在するの
で、この明細書でいう増幅器にはこのような発振器や周
波数逓倍器をも含むものとする。
Furthermore, although the above embodiment has been described as an amplifier, the present invention can be applied to all circuits that require adjustment of the electrical characteristics of the circuit, such as oscillators and frequency multipliers. Since a multiplier also has an amplification effect, the amplifier referred to in this specification includes such an oscillator and frequency multiplier.

〔発明の効果〕〔Effect of the invention〕

以上のようにこの発明によれば、キャパシタの下地金属
層にマイクロストリップ線路と接続するコンタクト部分
を複数個設けたので、マイクロストリップ線路の寸法や
配置の自由度が大きくなり、電気的特性の修正が容易に
なった。
As described above, according to the present invention, a plurality of contact portions for connecting to the microstrip line are provided on the base metal layer of the capacitor, so the degree of freedom in the size and arrangement of the microstrip line is increased, and electrical characteristics can be modified. has become easier.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はこの発明の一実施例を示す略平面図、 。 第2図は従来の装置を示す略平面図、第3図は第2図の
キャパシタの従来の構成を示す図、第4図は従来の装置
における電気的特性の修正を示す略平面図。 (1)は入力端、(2)は出力端、(3)はFE′r、
  (4a)、(4b)。 (4c)、(4d)はそれぞれキャパシタ、(5)はパ
ッド、(6)はマイクロス) IJツブ線路、(7)は
上地金属層、(8)は下地金属層、(9a)、(9b)
、(9c)はそれぞれコンタクト部、(1のは誘電体。 尚、各図中同一符号は同−又は和尚部分を示す。
FIG. 1 is a schematic plan view showing one embodiment of the present invention. FIG. 2 is a schematic plan view showing a conventional device, FIG. 3 is a schematic plan view showing a conventional configuration of the capacitor shown in FIG. 2, and FIG. 4 is a schematic plan view showing modification of electrical characteristics in the conventional device. (1) is the input end, (2) is the output end, (3) is FE'r,
(4a), (4b). (4c) and (4d) are capacitors, (5) is a pad, (6) is a micros) IJ tube line, (7) is an upper metal layer, (8) is an underlying metal layer, (9a), ( 9b)
, (9c) are contact parts, and (1 is a dielectric body. In each figure, the same reference numerals indicate the same or lower part.

Claims (1)

【特許請求の範囲】 半導体基板上にFET(電界効果トランジスタ)と、マ
イクロストリップ線路と、キャパシタとを形成して構成
したモノリシックマイクロ波増幅器において、 上記キャパシタは上記半導体基板上に形成される下地金
属層と、この下地金属層に対し上記半導体基板の平面に
対し直角な方向に誘電体層を介して対向する位置に設け
られる上地金属層とから構成され、 上記下地金属層には上記マイクロストリップ線路を接続
することのできるコンタクト部分が複数個設けられ、 上記複数個のコンタクト部分のうちから選んだ任意のコ
ンタクト部分において上記ストリップ線路と接続するこ
とを特徴とするモノリシックマイクロ波増幅器。
[Claims] A monolithic microwave amplifier configured by forming an FET (field effect transistor), a microstrip line, and a capacitor on a semiconductor substrate, wherein the capacitor is a base metal formed on the semiconductor substrate. and a base metal layer provided at a position opposite to the base metal layer via a dielectric layer in a direction perpendicular to the plane of the semiconductor substrate, and the base metal layer includes the microstrips. A monolithic microwave amplifier characterized in that a plurality of contact portions to which a line can be connected are provided, and the strip line is connected to an arbitrary contact portion selected from the plurality of contact portions.
JP7876786A 1986-04-04 1986-04-04 Monolithic mirowave amplifier Pending JPS62235765A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7876786A JPS62235765A (en) 1986-04-04 1986-04-04 Monolithic mirowave amplifier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7876786A JPS62235765A (en) 1986-04-04 1986-04-04 Monolithic mirowave amplifier

Publications (1)

Publication Number Publication Date
JPS62235765A true JPS62235765A (en) 1987-10-15

Family

ID=13671051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7876786A Pending JPS62235765A (en) 1986-04-04 1986-04-04 Monolithic mirowave amplifier

Country Status (1)

Country Link
JP (1) JPS62235765A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008508724A (en) * 2004-07-27 2008-03-21 トッパン、フォウタマスクス、インク System and method for forming integrated circuit components having precise characteristics

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008508724A (en) * 2004-07-27 2008-03-21 トッパン、フォウタマスクス、インク System and method for forming integrated circuit components having precise characteristics

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