JPS6223331B2 - - Google Patents

Info

Publication number
JPS6223331B2
JPS6223331B2 JP57201406A JP20140682A JPS6223331B2 JP S6223331 B2 JPS6223331 B2 JP S6223331B2 JP 57201406 A JP57201406 A JP 57201406A JP 20140682 A JP20140682 A JP 20140682A JP S6223331 B2 JPS6223331 B2 JP S6223331B2
Authority
JP
Japan
Prior art keywords
block
blocks
face
conductive
stacked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57201406A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5991535A (ja
Inventor
Fujio Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57201406A priority Critical patent/JPS5991535A/ja
Publication of JPS5991535A publication Critical patent/JPS5991535A/ja
Publication of JPS6223331B2 publication Critical patent/JPS6223331B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/08—Short-circuiting members for bridging contacts in a counterpart
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits

Landscapes

  • Input From Keyboards Or The Like (AREA)
JP57201406A 1982-11-16 1982-11-16 デイジタルコ−ド設定スイツチ Granted JPS5991535A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57201406A JPS5991535A (ja) 1982-11-16 1982-11-16 デイジタルコ−ド設定スイツチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57201406A JPS5991535A (ja) 1982-11-16 1982-11-16 デイジタルコ−ド設定スイツチ

Publications (2)

Publication Number Publication Date
JPS5991535A JPS5991535A (ja) 1984-05-26
JPS6223331B2 true JPS6223331B2 (enrdf_load_stackoverflow) 1987-05-22

Family

ID=16440557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57201406A Granted JPS5991535A (ja) 1982-11-16 1982-11-16 デイジタルコ−ド設定スイツチ

Country Status (1)

Country Link
JP (1) JPS5991535A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6564574B2 (ja) * 2015-02-06 2019-08-21 コマツ産機株式会社 プレス機械およびプレス機械の使用方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3529475B2 (ja) * 1995-02-23 2004-05-24 独立行政法人 科学技術振興機構 半導体微小ドットの製造方法
JPH10261785A (ja) * 1997-03-18 1998-09-29 Fujitsu Ltd 量子箱半導体装置及びその製造方法
JP2993470B2 (ja) * 1997-07-14 1999-12-20 日本電気株式会社 半導体立体量子構造の作製方法
JP3246444B2 (ja) * 1998-06-30 2002-01-15 日本電気株式会社 半導体量子ドット素子及びその製造方法
JP3304903B2 (ja) * 1998-12-21 2002-07-22 日本電気株式会社 半導体量子ドット素子とその製造方法
AU2001241186A1 (en) * 2000-03-16 2001-09-24 Matsushita Electric Industrial Co., Ltd. Method for precisely machining microstructure
JP2004342851A (ja) * 2003-05-15 2004-12-02 Sharp Corp 半導体膜の成長方法およびこの半導体膜を備えた半導体素子
JP4707475B2 (ja) * 2005-06-17 2011-06-22 国立大学法人 東京大学 化合物半導体結晶の成長方法、その成長方法を用いて成長した化合物半導体結晶の層を備えた半導体装置及び半導体基板
JP2007123731A (ja) * 2005-10-31 2007-05-17 Toshiba Corp 半導体発光素子および半導体発光装置
JP5521678B2 (ja) * 2010-03-23 2014-06-18 富士通株式会社 半導体光波形整形装置
KR20140041605A (ko) * 2011-06-13 2014-04-04 고쿠리츠다이가쿠호진 도호쿠다이가쿠 양자 나노 도트, 2차원 양자 나노 도트 어레이 및 이것을 사용한 반도체 장치 및 제조 방법

Also Published As

Publication number Publication date
JPS5991535A (ja) 1984-05-26

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