JPS62224999A - Manufacture of ceramic circuit board - Google Patents
Manufacture of ceramic circuit boardInfo
- Publication number
- JPS62224999A JPS62224999A JP61067091A JP6709186A JPS62224999A JP S62224999 A JPS62224999 A JP S62224999A JP 61067091 A JP61067091 A JP 61067091A JP 6709186 A JP6709186 A JP 6709186A JP S62224999 A JPS62224999 A JP S62224999A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- circuit board
- ceramic circuit
- prevention treatment
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims description 18
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000010949 copper Substances 0.000 claims description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 34
- 238000004649 discoloration prevention Methods 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 238000002845 discoloration Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 5
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 3
- 239000012964 benzotriazole Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003354 benzotriazolyl group Chemical class N1N=NC2=C1C=CC=C2* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明はセラミックス回路基板の製造方法に関する。[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to a method of manufacturing a ceramic circuit board.
（従来の技術）
近年セラミックス回路基板の製造方法として酸素に適母
含右する銅板を貼りつけ、不活性雰囲気中で加熱して両
者を接合する方法が検問されている。(Prior Art) In recent years, as a method of manufacturing ceramic circuit boards, a method of bonding the two by bonding a copper plate containing oxygen in an inert atmosphere and heating it in an inert atmosphere has been examined.
（発明が解決しＪ：うとする問題点）
このセラミックス基板に直接銅板を接合する方法は簡便
であるが、銅板中の酸素の一部が接合面にたまって銅板
にふくれを生じさせることがあった。このため加熱処理
後にラバープレスを行って銅板のふくれをおさえること
が行われているが、このラバープレス工程中にあるいは
保管中に銅表面が酸化されて変色し、半田付は性が低下
してＩＣチップの実装が困難になるという問題があった
。(Problems to be Solved by the Invention) This method of directly bonding a copper plate to a ceramic substrate is simple, but some of the oxygen in the copper plate may accumulate on the bonding surface and cause blisters on the copper plate. Ta. For this reason, rubber pressing is performed after heat treatment to suppress the swelling of the copper plate, but during this rubber pressing process or during storage, the copper surface becomes oxidized and discolored, resulting in poor solderability. There was a problem that it became difficult to mount the IC chip.
本発明はこのような問題を解決するためなされたもので
、セラミックス基板に接合した銅板の酸化変色を防止し
て、半田イ」り性の低下のないセラミックス回路基板の
製造方法を提供することを目的としている。The present invention has been made to solve these problems, and an object of the present invention is to provide a method for manufacturing a ceramic circuit board that prevents oxidation discoloration of a copper plate bonded to a ceramic substrate and that does not reduce solderability. The purpose is
［発明の構成］
（問題点を解決するための手段）
本発明はセラミックス基板に銅板を接合したあと、例え
ばベンゾトリアゾールまたはその誘導体等の銅変色防止
剤の水溶液に基板を浸漬する等の方法により銅変色防止
処理を施こしてセラミックス回路基板を製造するもので
ある。[Structure of the Invention] (Means for Solving the Problems) The present invention involves bonding a copper plate to a ceramic substrate and then immersing the substrate in an aqueous solution of a copper discoloration inhibitor such as benzotriazole or its derivative. Ceramic circuit boards are manufactured by applying copper discoloration prevention treatment.
ベンゾトリアゾールまたはその誘導体は次式に示すよう
に銅と反応して銅表面に安定な薄い第二銅の膜を作るの
で銅の酸化が進行しない。Benzotriazole or its derivatives react with copper as shown in the following formula to form a stable thin cupric film on the copper surface, so oxidation of copper does not proceed.
Ｃｕ＋１／ ２０２ ＋２０６１−１４ Ｎ −ＮＨ→
（ＣＩ ８４ Ｎ２ ・Ｎ） ２ ＣＬＩ＋１−１２０
このように銅変色防止処理の施こされた銅回路板はベン
ゾトリアゾールまたはその誘導体等の銅変色防止剤が銅
と共有結合して安定な被膜を作るので表面が酸化変色す
ることがなく、半田付は性の低下がなくなる。Cu+1/ 202 +2061-14 N -NH→
(CI 84 N2 ・N) 2 CLI+1-120
Copper circuit boards that have undergone copper discoloration prevention treatment in this way have copper discoloration inhibitors such as benzotriazole or its derivatives covalently bonded to the copper to form a stable film, so the surface does not oxidize and discolor, making it easy to solder. After that, there will be no decrease in sex.
なお銅変色防止処理後にラバープレスを行えば銅板に生
じやすいふくれが防止されるので好ましい。Note that it is preferable to perform rubber pressing after the copper discoloration prevention treatment because this prevents blisters that tend to occur in copper plates.
（実施例） 次に本発明の実施例について説明する。(Example) Next, examples of the present invention will be described.
アルミナ製セラミックス基板の両面に所定のパターンの
タフピッチ銅からなる銅板を貼り付け、１０６５℃（Ｃ
ｕ−０共品温度）〜１０８３℃（Ｃｕの融点）の温度範
囲に加熱した窒素雰囲気連続炉に通して両者を接合した
。次にベンゾトリアゾール誘導体の０．３％水溶液に浸
漬して銅変色防止処理を施こした。Copper plates made of tough pitch copper in a predetermined pattern were pasted on both sides of an alumina ceramic substrate, and
The two were bonded together by passing them through a continuous furnace in a nitrogen atmosphere heated to a temperature range of 1083° C. (the melting point of Cu). Next, it was immersed in a 0.3% aqueous solution of a benzotriazole derivative to perform copper discoloration prevention treatment.
その後ラバープレスを行ってセラミックス基板に接合し
た銅板の７５）りれをおさえ、乾燥してセラミックス回
路基板を製造した。Thereafter, a rubber press was performed to suppress warping of the copper plate bonded to the ceramic substrate, and the copper plate was dried to produce a ceramic circuit board.
このようにして得られたセラミックス回路基板５００個
について温度４０°Ｃ１湿度９０％、時間９６時間の条
件で耐湿試験を行ったところ全く変色はみられず、また
３０日間自然放置しても変色はみられなかった。このセ
ラミックス回路基板に半田によりＩＣチップを実装して
も半田（＝Ｊりが不良のものはなく、熱抵抗の不良率は
わずか２％であった。A humidity test was conducted on 500 ceramic circuit boards obtained in this way at a temperature of 40°C, humidity of 90%, and a time of 96 hours. No discoloration was observed at all, and no discoloration was observed even if left for 30 days. I couldn't see it. Even when IC chips were mounted on this ceramic circuit board by soldering, there was no defective solder (J), and the defective rate of thermal resistance was only 2%.
一方銅変色防止処理を施こさない従来のセラミックス回
路基板について同様の試験を行ったところ、耐湿試験や
自然放置で酸化変色が発生し、また半田付けの不良率は
３％、熱抵抗は５％であった。On the other hand, when similar tests were conducted on conventional ceramic circuit boards that were not treated with copper discoloration prevention treatment, oxidation discoloration occurred during moisture resistance tests and natural storage, and the soldering defect rate was 3% and the thermal resistance was 5%. Met.
［発明の効果］
以上説明したように本発明方法においてはセラミックス
基板に銅板を接合したあと銅変色防止処理を施こすので
その後に行う銅板ふくれ防止のラバープレス工程や保管
中に銅板に酸化変色がみられず、従って半田付は性を長
期にわたって損なうことがなくＩＣチップを容易に実装
することができる。[Effects of the Invention] As explained above, in the method of the present invention, copper discoloration prevention treatment is applied after bonding a copper plate to a ceramic substrate, so that oxidation discoloration of the copper plate is avoided during the subsequent rubber pressing process to prevent copper plate blistering or during storage. Therefore, soldering can easily mount IC chips without damaging the properties over a long period of time.
代理人 弁理士 則 近 憲 化 量 湯山幸夫Agent patent attorney rules modernization Quantity Yukio Yuyama
Claims (3)
し、加熱して両者を接合したあと銅変色防止処理を施こ
すことを特徴とするセラミックス回路基板の製造方法。(1) A method for manufacturing a ceramic circuit board, which comprises arranging a copper plate on one or both sides of a ceramic substrate, bonding the two by heating, and then applying copper discoloration prevention treatment.
浸漬して行う特許請求の範囲第１項記載のセラミックス
回路基板の製造方法。(2) The method for manufacturing a ceramic circuit board according to claim 1, wherein the copper discoloration prevention treatment is performed by immersing the substrate in an aqueous solution of a copper discoloration inhibitor.
の範囲第１項または第２項記載のセラミックス回路基板
の製造方法。(3) A method for manufacturing a ceramic circuit board according to claim 1 or 2, in which rubber pressing is performed after copper discoloration prevention treatment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61067091A JPS62224999A (en) | 1986-03-27 | 1986-03-27 | Manufacture of ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61067091A JPS62224999A (en) | 1986-03-27 | 1986-03-27 | Manufacture of ceramic circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62224999A true JPS62224999A (en) | 1987-10-02 |
Family
ID=13334866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61067091A Pending JPS62224999A (en) | 1986-03-27 | 1986-03-27 | Manufacture of ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62224999A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016132810A (en) * | 2015-01-20 | 2016-07-25 | 住友金属鉱山株式会社 | Copper-clad laminate and method for manufacturing copper-clad laminate |
-
1986
- 1986-03-27 JP JP61067091A patent/JPS62224999A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016132810A (en) * | 2015-01-20 | 2016-07-25 | 住友金属鉱山株式会社 | Copper-clad laminate and method for manufacturing copper-clad laminate |
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