JPS62219598A - Heat radiation of device - Google Patents
Heat radiation of deviceInfo
- Publication number
- JPS62219598A JPS62219598A JP6130786A JP6130786A JPS62219598A JP S62219598 A JPS62219598 A JP S62219598A JP 6130786 A JP6130786 A JP 6130786A JP 6130786 A JP6130786 A JP 6130786A JP S62219598 A JPS62219598 A JP S62219598A
- Authority
- JP
- Japan
- Prior art keywords
- frame
- cover
- spring member
- printed board
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title 1
- 238000000034 method Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000001816 cooling Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 235000011962 puddings Nutrition 0.000 description 4
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔概要〕
プリンｉ・板に搭載された素子の放熱方法であって、カ
バーに板バネを取付け、さらに素子表面に熱伝導性のよ
い弾性部材を接着し、該カバーをフレームに取（−ｊけ
ることにより、素Ｙと阪バネを接触させ、素子の発熱を
フレーｌ、側にｉルがし、素子の冷却を可能とした。[Detailed Description of the Invention] [Summary] A method for dissipating heat from an element mounted on a pudding i board, in which a leaf spring is attached to a cover, an elastic member with good thermal conductivity is bonded to the surface of the element, and the cover is By attaching (-j) to the frame, the element Y and the spring were brought into contact with each other, and the heat generated by the element was transferred to the frame side, making it possible to cool the element.
〔産業上の利用分野）
本発明は電子機器等において、プリント板に搭載された
素子の発熱を、フレームに逃かずようにした素子の放熱
方法に関する。[Industrial Field of Application] The present invention relates to a method for dissipating heat from an element mounted on a printed circuit board in an electronic device or the like, in which the heat generated by the element is prevented from escaping into the frame.
一般に電子機器等の装置は、−・ｊ股にカバーとフレー
ムにより覆われ、その内部に半導体等の素子を搭載した
プリント板等を有する。2. Description of the Related Art Devices such as electronic devices are generally covered with a cover and a frame, and have a printed board or the like on which elements such as semiconductors are mounted inside.
」−記プリント板上に搭載された素子のうら、使用温度
条件の厳しい例えば、マイクロプロセツサ等がある。該
マイクロプロセツサは、安定動作を得る為にチップのジ
ャンクション温度を乏（５℃以内にする必要がある。''--The back side of the elements mounted on the printed circuit board has severe operating temperature conditions, such as microprocessors. In order to obtain stable operation of the microprocessor, the junction temperature of the chip must be kept low (within 5° C.).
その為、素子の冷却が必要で、その冷却方法として、自
然空冷の場合はプリント板とフレームとの隙間を多く取
る為、装置寸法が大きくなる。強制的に冷却する場合は
ファンを取（＝Ｊける為、騒音）の問題かある。Therefore, it is necessary to cool the element, and if natural air cooling is used as the cooling method, a large gap is required between the printed board and the frame, which increases the size of the device. If you use forced cooling, there is a problem with removing the fan (= noise).
そごで、小型で騒音がなく素子の発熱か冷却できる方法
か要望されていた。Therefore, there was a request for a method that was small, noiseless, and could cool the heat generated by the element.
（従来の技術〕
従来、電子機器等において、プリン１板に搭載さ４′１
．た素子の冷ノ」１は、自然空冷の場合におい゛（風の
流れをよ＜−ツる為、プリント板とフレームとのスキマ
を多くとる。その為装置の外形寸法が大きくなるデメリ
ノＩがあるとともに、素子の使用温度の＋ｙｂ シい素
子（例えはマイクＤゾ［１セツサ等）は、冷却が不１−
・分で素子の使用温度条件を満足出来なかった。(Prior art) Conventionally, in electronic equipment, etc., a 4'1
．． 1. In the case of natural air cooling, there is a large gap between the printed board and the frame to control the wind flow. At the same time, the operating temperature of the element is +yb (for example, the microphone D sensor [1 setter, etc.)].
・The operating temperature conditions of the element could not be satisfied within minutes.
そごで、強制的に冷却する必要かあり、その方法として
、第３図に示すようにファンを取付けている。Therefore, it is necessary to forcibly cool it down, and as a method of doing so, a fan is installed as shown in Figure 3.
第３図において、電子機器等の装置１はフレーム２とカ
バー３で覆われ、その内部にシリンド板４かレール７に
保持されている。該プリン１板４にｔ、ｊ素子（使用温
度条件Ｑ月肢しくない）５及び使用温度θ月ｎ々しい素
子（マイク「ＪプＩＩムソリ）ｂが搭載されている。そ
の他電源８４：ｔ；のＩ−゛−ソ１かあり、さらに装置
内上部にンアン０を設ＤＪ、ル装置１・部よりり■気を
吸入し、−１１部よりルｂ置外にＩＩ＋気し−（冷却す
るよ・う構成する。In FIG. 3, a device 1 such as an electronic device is covered with a frame 2 and a cover 3, and is held inside by a cylinder plate 4 or a rail 7. The pudding 1 board 4 is equipped with t, j elements (use temperature condition Q month is not good) 5 and use temperature θ month naughty element (microphone "J Pu II Musori) b.Other power source 84:t There is also an I-゛-so 1, and in addition, an ann 0 is installed in the upper part of the device. I will configure it.
［発明か解決しようとする問題点］
第；３［〆１の従来の素子冷却は、強制的に空気をプリ
ンＩ板間を通ず為にファ／９を設ｉＪでいる。その為、
オフィス設置の装置では、ファン９による騒音等か発生
ずると云う問題点かあった。[Problems to be Solved by the Invention] 3rd; In the conventional element cooling of 1, F/9 is installed in order to forcefully pass air between the printed circuit boards. For that reason,
In a device installed in an office, there is a problem in that the fan 9 generates noise.
第１図は本発明の詳細な説明する図−（ある。 FIG. 1 is a diagram for explaining the invention in detail.
第１図において、フレーム１０にプリン１板４が取付部
４イ１６ζ、二よりに１定されζいる。該プリン１板４
には、素−Ｊ′−（使用温度条件の厳しくない素子）５
及び使用温度条件の厳しい素子（例えはマイクロプロセ
ッサ等）６が搭載されている。該素子６Ｌこ熱伝導性の
よい弾性部材（ゴム板） ４を接着する。In FIG. 1, the frame 10 has a pudding 1 plate 4 fixedly attached to the mounting portion 4 16ζ and 2 ζ. 1 plate of pudding 4
For element -J'- (element whose operating temperature conditions are not severe) 5
and an element 6 (such as a microprocessor) that is subject to severe operating temperature conditions. An elastic member (rubber plate) 4 having good thermal conductivity is adhered to the element 6L.
叉、カバーＩＩに熱伝導性のよいバネ部材１２を、プリ
ント板４十、の素Ｔ−６に対応した位置に取付けろ。Then, attach the spring member 12 with good thermal conductivity to the cover II at a position corresponding to element T-6 of the printed board 40.
該カバー１１を前記フＬ・−ム１０に取付りた際、バネ
部＋）１１２が素子６と接触する構造とする。When the cover 11 is attached to the frame 10, the spring portion 112 comes into contact with the element 6.
１！ＩＩ ｔ＞ 、カバーｌｌをフレームＩＯに取４１
けた際、フレーム１０側に固定されたプリント板４」二
の素子６が、カバー１１に固定されたバネ部材１２と接
触する。1! II t>, remove the cover ll to the frame IO 41
When lifted, the second element 6 of the printed board 4 fixed to the frame 10 comes into contact with the spring member 12 fixed to the cover 11.
−・般に素子６の厚みには製造バラツキ、フレーム１０
には製作−］−のハラツギがある。それらのバラツキが
、バネ部材１２により吸収されることにより、バネ部＋
ＡＩ２と素子６が確実に接触する。- Generally, there are manufacturing variations in the thickness of the element 6, and the frame 10
There is a production process. By absorbing these variations by the spring member 12, the spring part +
AI2 and element 6 are in reliable contact.
さらに、素７−６側の熱伝導性の良い弾性のあるゴム板
１３により、素子６の発熱は熱伝導性の良いバネ板】２
を介し、フレーム１０側に効率良く逃がすことが出来、
冷却される。Furthermore, the heat generated by the element 6 is absorbed by the elastic rubber plate 13 with good thermal conductivity on the element 7-6 side, which is a spring plate with good thermal conductivity.
can be efficiently released to the frame 10 side through
cooled down.
第２図（イ）〜（ニ）は本発明の１実施例を説明する図
である。なお、全図を通じて同一・？ｊ１号は同一対称
物を示す。FIGS. 2(a) to 2(d) are diagrams illustrating one embodiment of the present invention. In addition, it is the same throughout all the figures. No. j1 indicates the same object.
第２図（イ）は、フレーム１０側のシリンド板４を示し
、該プリント板４は図示しない支持部材（レール等）で
支持され、さらにプリンＬ 板４−１−に素子（例えば
マイクロプロセッサ等）（ｊが搭載され、該素子６」二
に熱伝導性の良い弾性のあるゴム板１３を接着する。FIG. 2(A) shows the cylinder plate 4 on the side of the frame 10. The printed board 4 is supported by a supporting member (rail, etc.) not shown, and furthermore, an element (for example, a microprocessor, etc.) is mounted on the printed board 4-1-. ) (j is mounted, and an elastic rubber plate 13 with good thermal conductivity is bonded to the element 6''.
第２図（ロ）は、フレーム１０に取付けられるカバー１
１に、前記素子６と対応した位置に燐青銅等のバネ部材
１２を、ネジ１４で固定する。Figure 2 (b) shows the cover 1 attached to the frame 10.
1, a spring member 12 made of phosphor bronze or the like is fixed with a screw 14 at a position corresponding to the element 6.
第２図（ハ）はバネ部材１２を示し、熱伝榎の良い燐青
銅等の材料を用い、Ｚ形とし」二部に取代は穴１５を設
ける。FIG. 2(c) shows a spring member 12, which is made of a material such as phosphor bronze with good heat conductivity and is Z-shaped, with a hole 15 provided in the second part.
第２図（ニ）は、カバー１１をフレーム１０に取付けた
状態を示す。この状態では、素子（ｊの厚みの製造バラ
ツキ及びフレーム１０の製作」二のバラツキが、バネ部
材１２で吸収されてバネ部材１２と素子６ｌｏ） ＝Ｉ
ノ、板１３とが確実に接触する。素子６の発熱はクノノ
＜司ｐくフレーＪ、１０側に逃がすことが出来る。FIG. 2(D) shows a state in which the cover 11 is attached to the frame 10. In this state, the element (manufacturing variations in the thickness of j and manufacturing variations in the frame 10) are absorbed by the spring member 12, and the spring member 12 and the element 6lo) = I
No, the plate 13 is securely in contact with the plate 13. The heat generated by the element 6 can be released to the frame 10 side.
実施例では、自然空冷時の素子６の使用時の表面を品度
か１２０°Ｃであったものが、本発明の方法では８（１
’ｃ以ドとなり、素子６の誤動作を防ぐことか出未だ。In the example, the surface of the element 6 during natural air cooling was 120°C in use, but in the method of the present invention, the surface temperature was 8 (120°C).
'c' or 'c' has occurred, and there is no way to prevent element 6 from malfunctioning.
、Ｊ ’ｆ ６の冷）、１１はファンによる強制空冷て
なく、フト−Ｊ、、 ｌ （ｌへ放熱する自然空冷であ
り、ファンを用い４１′いので、ファンによる１騒ｒ′
ｒ等かなく、Ｈつ小型化出来る。, J 'f 6 cooling), 11 is not forced air cooling by a fan, but is a natural air cooling that radiates heat to the foot J,, l (l), and since it uses a fan, 1 noise r'
It can be downsized by H without r etc.
以上説明したように、本発明によれば素子の発クツ（を
、フレームに逃がし冷却する方法により、ファンを使用
せずに素子の使用温度条件が満足され、装置の小型化と
騒音等の防雨を図ることが出来る。As explained above, according to the present invention, by cooling the elements by letting them escape into the frame, the operating temperature conditions of the elements can be satisfied without using a fan, and the device can be downsized and noise can be prevented. You can plan for rain.
４、し１曲の簡華な説明 第１図は本発明の詳細な説明する図、 第２図（イ）〜（ニ）は本発明の詳細な説明する図、 第３図は従来の素子冷却を説明する図である。4. Brief explanation of the first song FIG. 1 is a diagram illustrating detailed explanation of the present invention; FIGS. 2(a) to 2(d) are diagrams illustrating detailed explanations of the present invention; FIG. 3 is a diagram illustrating conventional element cooling.
図において、 ４しｌプリント板、 ５．６は素子、 １０はフレーム、 １１ばカバー、 １２はバネ部材、 薗 寸In the figure, 4shil printed board, 5.6 is the element, 10 is a frame, 11ba cover, 12 is a spring member; Sono size
Claims (1)
プリント板（４）を有し、該プリント板（４）に搭載さ
れた素子（６）の放熱方法であって、前記カバー（１１
）に熱伝導性のよいバネ部材（１２）を取付け、 該カバー（１１）を前記フレーム（１０）に取付けた際
、該バネ部材（１２）が前記素子（６）と接触し、素子
（６）の発熱を前記フレーム（１０）に逃がすことを特
徴とする素子の放熱方法。[Claims] A heat dissipation method for an element (6) covered with a frame (10) and a cover (11), having a printed board (4) inside, and mounted on the printed board (4), , the cover (11
) is attached with a spring member (12) having good thermal conductivity, and when the cover (11) is attached to the frame (10), the spring member (12) comes into contact with the element (6), and the element (6) ) is dissipated to the frame (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6130786A JPS62219598A (en) | 1986-03-19 | 1986-03-19 | Heat radiation of device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6130786A JPS62219598A (en) | 1986-03-19 | 1986-03-19 | Heat radiation of device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62219598A true JPS62219598A (en) | 1987-09-26 |
Family
ID=13167388
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6130786A Pending JPS62219598A (en) | 1986-03-19 | 1986-03-19 | Heat radiation of device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62219598A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03222587A (en) * | 1990-01-29 | 1991-10-01 | Shimadzu Corp | Angiographic device |
| JPH03110885U (en) * | 1990-02-27 | 1991-11-13 | ||
| JPH0837386A (en) * | 1994-07-21 | 1996-02-06 | Keyence Corp | Heat radiating structure for electronic equipment |
| JP2001332670A (en) * | 2000-05-19 | 2001-11-30 | Denso Corp | Mounting structure of semiconductor device |
| JP2018092987A (en) * | 2016-11-30 | 2018-06-14 | ブラザー工業株式会社 | Heat dissipation device and image forming apparatus |
-
1986
- 1986-03-19 JP JP6130786A patent/JPS62219598A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03222587A (en) * | 1990-01-29 | 1991-10-01 | Shimadzu Corp | Angiographic device |
| JPH03110885U (en) * | 1990-02-27 | 1991-11-13 | ||
| JPH0837386A (en) * | 1994-07-21 | 1996-02-06 | Keyence Corp | Heat radiating structure for electronic equipment |
| JP2001332670A (en) * | 2000-05-19 | 2001-11-30 | Denso Corp | Mounting structure of semiconductor device |
| JP2018092987A (en) * | 2016-11-30 | 2018-06-14 | ブラザー工業株式会社 | Heat dissipation device and image forming apparatus |
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