JPS6221555U - - Google Patents

Info

Publication number
JPS6221555U
JPS6221555U JP11389085U JP11389085U JPS6221555U JP S6221555 U JPS6221555 U JP S6221555U JP 11389085 U JP11389085 U JP 11389085U JP 11389085 U JP11389085 U JP 11389085U JP S6221555 U JPS6221555 U JP S6221555U
Authority
JP
Japan
Prior art keywords
field effect
effect transistors
coil
source
series
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11389085U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP11389085U priority Critical patent/JPS6221555U/ja
Publication of JPS6221555U publication Critical patent/JPS6221555U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48092—Helix
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP11389085U 1985-07-25 1985-07-25 Pending JPS6221555U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11389085U JPS6221555U (enExample) 1985-07-25 1985-07-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11389085U JPS6221555U (enExample) 1985-07-25 1985-07-25

Publications (1)

Publication Number Publication Date
JPS6221555U true JPS6221555U (enExample) 1987-02-09

Family

ID=30996113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11389085U Pending JPS6221555U (enExample) 1985-07-25 1985-07-25

Country Status (1)

Country Link
JP (1) JPS6221555U (enExample)

Similar Documents

Publication Publication Date Title
JPS591199U (ja) 半導体メモリ素子
JPS6221555U (enExample)
JPS6150314U (enExample)
JPS6454333U (enExample)
JPS6083247U (ja) マイクロ波集積回路化トランジスタ回路
JPH01159414U (enExample)
JPS62158917U (enExample)
JPS6230349U (enExample)
JPS60144325U (ja) 半導体装置
JPS6117756U (ja) 半導体装置
JPS62181027U (enExample)
JPS6440904U (enExample)
JPS5999457U (ja) Ｉｃの保護回路
JPH0284416U (enExample)
JPS602832U (ja) 半導体装置
JPH0229533U (enExample)
JPS60146354U (ja) 高周波特性の調整された半導体装置
JPS6049650U (ja) 半導体装置
JPS62107469U (enExample)
JPS62188823U (enExample)
JPS60151149U (ja) ＧａＡｓ半導体装置
JPS60144238U (ja) 半導体装置
JPS58158520U (ja) 帰還型増幅回路
JPS6448907U (enExample)
JPS6242338U (enExample)