JPS6221007Y2 - - Google Patents
Info
- Publication number
- JPS6221007Y2 JPS6221007Y2 JP1673982U JP1673982U JPS6221007Y2 JP S6221007 Y2 JPS6221007 Y2 JP S6221007Y2 JP 1673982 U JP1673982 U JP 1673982U JP 1673982 U JP1673982 U JP 1673982U JP S6221007 Y2 JPS6221007 Y2 JP S6221007Y2
- Authority
- JP
- Japan
- Prior art keywords
- probe card
- intermediate insulator
- printed circuit
- circuit board
- insertion hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000523 sample Substances 0.000 claims description 41
- 239000012212 insulator Substances 0.000 claims description 20
- 238000003780 insertion Methods 0.000 claims description 17
- 230000037431 insertion Effects 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 16
- 239000010410 layer Substances 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1673982U JPS58120651U (ja) | 1982-02-08 | 1982-02-08 | プロ−ブカ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1673982U JPS58120651U (ja) | 1982-02-08 | 1982-02-08 | プロ−ブカ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58120651U JPS58120651U (ja) | 1983-08-17 |
| JPS6221007Y2 true JPS6221007Y2 (US20030204162A1-20031030-M00001.png) | 1987-05-28 |
Family
ID=30029098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1673982U Granted JPS58120651U (ja) | 1982-02-08 | 1982-02-08 | プロ−ブカ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58120651U (US20030204162A1-20031030-M00001.png) |
-
1982
- 1982-02-08 JP JP1673982U patent/JPS58120651U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58120651U (ja) | 1983-08-17 |
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