JPS6220706B2 - - Google Patents
Info
- Publication number
- JPS6220706B2 JPS6220706B2 JP56107905A JP10790581A JPS6220706B2 JP S6220706 B2 JPS6220706 B2 JP S6220706B2 JP 56107905 A JP56107905 A JP 56107905A JP 10790581 A JP10790581 A JP 10790581A JP S6220706 B2 JPS6220706 B2 JP S6220706B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- strip
- notch
- common connection
- connection strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W74/111—
-
- H10W70/481—
-
- H10W72/0198—
-
- H10W74/121—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56107905A JPS589348A (ja) | 1981-07-09 | 1981-07-09 | リ−ドフレ−ム |
| CA000406545A CA1195782A (en) | 1981-07-06 | 1982-07-05 | Lead frame for plastic encapsulated semiconductor device |
| US06/395,799 US4482915A (en) | 1981-07-06 | 1982-07-06 | Lead frame for plastic encapsulated semiconductor device |
| DE8282106033T DE3277757D1 (en) | 1981-07-06 | 1982-07-06 | Lead frame for plastic encapsulated semiconductor device |
| DE198282106033T DE69390T1 (de) | 1981-07-06 | 1982-07-06 | Leiterrahmen fuer halbleiteranordnung in plastikverkapselung. |
| EP82106033A EP0069390B1 (en) | 1981-07-06 | 1982-07-06 | Lead frame for plastic encapsulated semiconductor device |
| CA000471714A CA1213678A (en) | 1981-07-06 | 1985-01-08 | Lead frame for plastic encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56107905A JPS589348A (ja) | 1981-07-09 | 1981-07-09 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS589348A JPS589348A (ja) | 1983-01-19 |
| JPS6220706B2 true JPS6220706B2 (enExample) | 1987-05-08 |
Family
ID=14471032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56107905A Granted JPS589348A (ja) | 1981-07-06 | 1981-07-09 | リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS589348A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5634033B2 (ja) | 2008-08-29 | 2014-12-03 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 樹脂封止型半導体装置とその製造方法 |
| JP6143726B2 (ja) * | 2008-08-29 | 2017-06-07 | セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー | 樹脂封止型半導体装置とその製造方法、リードフレーム |
-
1981
- 1981-07-09 JP JP56107905A patent/JPS589348A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS589348A (ja) | 1983-01-19 |
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