JPS62204359U - - Google Patents
Info
- Publication number
- JPS62204359U JPS62204359U JP9266586U JP9266586U JPS62204359U JP S62204359 U JPS62204359 U JP S62204359U JP 9266586 U JP9266586 U JP 9266586U JP 9266586 U JP9266586 U JP 9266586U JP S62204359 U JPS62204359 U JP S62204359U
- Authority
- JP
- Japan
- Prior art keywords
- light
- package
- optical coupling
- coupling device
- emitting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図ａは本発明のＳＩＰ型光結合素子の一実
施例を示す斜視図、第１ｂ図は第１ａ図のＡ―Ａ
′方向断面図、第１ｃ図は第１ｂ図のＢ―Ｂ′方
向断面図、第２ａ図は従来のＤＩＰパツケージ構
造の光結合素子の斜視図、第２ｂ図は従来の自立
形パツケージ構造の光結合素子の斜視図である。 １，２……リード端子、３……発光素子、４…
…受光素子、５……内部樹脂（透明）、６……内
部樹脂（白色）、７……外部樹脂、８……ボンデ
イングワイヤー。
施例を示す斜視図、第１ｂ図は第１ａ図のＡ―Ａ
′方向断面図、第１ｃ図は第１ｂ図のＢ―Ｂ′方
向断面図、第２ａ図は従来のＤＩＰパツケージ構
造の光結合素子の斜視図、第２ｂ図は従来の自立
形パツケージ構造の光結合素子の斜視図である。 １，２……リード端子、３……発光素子、４…
…受光素子、５……内部樹脂（透明）、６……内
部樹脂（白色）、７……外部樹脂、８……ボンデ
イングワイヤー。
Claims (1)
- 発光素子とこの発光素子と光学的に結合された
受光素子とを同一のパツケージ内に樹脂封止した
光結合素子において、光伝達部を平面構造としか
つパツケージをＳＩＰ（Ｓｉｎｇｌｅ Ｉｎ―ｌ
ｉｎｅ Ｐａｃｋａｇｅ）構造とすることを特徴
とするＳＩＰ型光結合素子。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266586U JPS62204359U (ja) | 1986-06-17 | 1986-06-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9266586U JPS62204359U (ja) | 1986-06-17 | 1986-06-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62204359U true JPS62204359U (ja) | 1987-12-26 |
Family
ID=30954571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9266586U Pending JPS62204359U (ja) | 1986-06-17 | 1986-06-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62204359U (ja) |
-
1986
- 1986-06-17 JP JP9266586U patent/JPS62204359U/ja active Pending