JPS62203333A - Semiconductor printing and exposure apparatus - Google Patents

Abstract

PURPOSE:To select and confirm the display mode during the exposure and execute the printing and exposure accurately and quickly by setting the mode which indicates the predetermined exposure time, focal distance and exposure condition and the mode which indicates a measured value during the exposure. CONSTITUTION:When alteration of output parameter is instructed from a keyboard 12, a parameter selection format is displayed on the CRT 11 under the control of CPU 31. when 'SETTING' is selected on the keyboard 12, various setting parameters and the presence of display are displayed. When the setting values of exposing item are changed by the keying, display of such item is changed to Y, the end code E is input. When 'MEASUREMENT' is selected, the display is also changed and a file and a printer may be designated with an output device. Next, when the mask operation is started by changing output parameters, parameters are output as designated to the screen, file and printer, the entire part of wafer is displayed on the screen and the corresponding region is covered in each exposure. As explained above, the parameters of setting and measurement and exposure information can be checked on the display screen during the mask operation and operations can be realized accurately and quickly.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of the Invention] The present invention relates to an apparatus for manufacturing semiconductor devices such as LSI and VLSI, and particularly relates to an apparatus for manufacturing semiconductor devices such as LSI and VLSI, and in particular, a method for controlling parameter setting values and measured values representing various operating conditions in semiconductor device manufacturing operations. The present invention also relates to a semiconductor printing exposure apparatus that allows exposure information to be confirmed on a screen during exposure.

[Background of the Invention] As the degree of integration of semiconductor integrated circuits increases, efforts are being made to improve the functionality and performance of semiconductor manufacturing equipment.

As these devices become more sophisticated and performant, the parameters for operating these types of devices have also increased.

For example, in a step-and-repeat projection exposure apparatus, such parameters may range from several dozen to even several hundred. It is necessary to check the setting status of these numerous parameters in the mask process or when switching between the two.

In the conventional apparatus, it is possible to check the setting state of the operating parameters before starting the operation of the mask process. However, it is not possible to check the set values of the operating parameters and the operating state of the apparatus after the mask process starts. In addition, since actual measurements such as the exposure time and focal position of each shot in the mask process are not memorized, even if a certain shot turns out to be a defective shot due to overexposure, for example, that information cannot be used for process control. There were drawbacks.

[Object of the Invention] In view of the above-mentioned problems of the conventional type, the present invention provides a semiconductor printing exposure apparatus that allows an operator to check operating parameters after starting a mask process operation, prevent erroneous operations, and operate quickly and reliably. The purpose is to provide.

[Explanation of Examples] Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 shows the appearance of a semiconductor printing exposure apparatus according to an embodiment of the present invention. In the figure, reference numeral 1 denotes a mask having an integrated circuit pattern, and also includes mask alignment marks and mask-wafer alignment marks. 2 is a mask stage that holds the mask 1 and moves the mask 1 in the plane (XY direction) and in the rotational direction (θ direction). 3
Reference numeral 4 indicates a reduction projection lens, and 4 indicates a wafer provided with a photosensitive layer, which includes a mask/wafer alignment mark and a television/wafer alignment mark. 5 is a wafer stage. The wafer stage 5 holds the wafer 4 and moves it in the plane and in the rotational direction, and also moves between the wafer printing position (within the projection field of view) and the television/wafer alignment position.

6 is an objective lens of a television/wafer alignment detection device; 7 is an image pickup tube or a solid-state imaging device; and 9 is a binocular unit, which serves to observe the surface of the wafer 4 through the projection lens 3. 10 is an illumination optical system and a mask, wafer,
This is an upper unit that houses a detection device for alignment. 11 is a console monitor receiver (console CRT) for giving commands to the main body of the projection exposure apparatus, and 12 is a keyboard for giving commands to the apparatus and inputting parameters.

FIG. 2 is a block diagram showing the electrical circuit configuration of the projection exposure apparatus of FIG. 1. In the figure, numeral 21 is a main body CPU which controls the entire system, and is comprised of a central processing unit such as a microcomputer or minicomputer. 22 is a wafer stage drive device, 23 is an alignment detection system,
24 is a reticle stage drive #J device, 25 is an illumination system, 2
6 is a V ivy drive device, 27 is a focus detection system, 28
is a Z drive device, which is controlled by the main body CPU 21. 29 is a conveyance system.

Reference numeral 30 is for the console unit 1, which is used to give various commands and parameters related to the operation of this exposure apparatus to the main CPU 21. 31 is the console CPU, 3
2 is an external memory for storing parameters and the like, and 33 is a printer for outputting the parameters and the like. Note that the CRT II and keyboard 12 are the same as those shown in FIG.

Next, flowchart 1- in Fig. 3 and Fig. 4 (1) -
1 and 2 while referring to the display screen example in <9).
The operation of the device shown in the figure will be explained.

In this device, when the initialization after the power is turned on and when the execution of a predetermined operation command (command) is completed, the device enters a command waiting state.

In other words, the console c p U 31 is the keyboard 12
The main body CPU 21 waits for a key operation in the console CPU 31, and enters a waiting state for communication from the console CPU 31. and,
In this state, when a command is input from the keyboard 12 to change the output parameters, the console c p
Under the control of U 31, the following output parameter change process is started.

First, in step S1, a screen prompting parameter selection is displayed on the CRT II. This display screen is shown in FIG. 4 (1). Next, based on the input data from the keyboard 12,
In step S2, it is determined whether the setting parameter or the measurement parameter has been selected.

If a setting parameter is selected here, step S
Step 3 displays the display parameter screen on the CRTll. At this time, the display screen becomes as shown in FIG. 4(2), and various setting parameters and whether or not to display them are displayed. In the same figure, 1'Reticle ID
/NO, j and f (Exposure Time)
is a parameter item, and the corresponding F D isρ1
When the value of ayJ is "Yj", it indicates that the setting value of the parameter is displayed during the exposure process, and when it is fNJ, it indicates that it is not displayed.
UT No. (EMEND): J is a prompt message for inputting the parameter item number. Here, f2 is used to change the setting value for the second parameter.
I typed J and hit the return key. Next, when the parameter number is input in step S4, a screen is displayed prompting the user to input whether to display the set value of the parameter ("Y" or "N"). At this time, the display screen becomes as shown in FIG. 4 (3). Here, the second item ij E xpos is used as a parameter.
After specifying ure Time j, fYj is input to specify that the setting value of that parameter is to be displayed. When the parameter display designation is input in step S5, the setting for displaying or not displaying the designated parameter is changed according to the designation, and the display of the designation on the screen is changed according to the input, and then step S4 is performed again. Nifuru. For example, if the above specification is made, the displayed double-sided display will be as shown in FIG. 4 (4). In the same figure, the second parameter “ExposureT
For imeJ, r D 1playj has been changed to "Y". To end the output parameter change process, an end code is sent to fEJ in step S4.
Enter.

On the other hand, if it is determined in step $2 that it is a measured parameter, the same processing as in steps 83 to S5 for setting parameters is performed in steps 86 to S8.

The difference from the setting parameters is that in the measurement parameters it is also possible to specify the file and printer on the output device, and the display screen in Figures 4 (2) to (4) is the same as in Figure 4 (5) in the measurement parameters. ) to (7). 4 (5) to (7) show that among the measurement parameters, the specification that the output of "Exposure Time j" is not output to any of the CRT display 11, files such as the external memory 32, and the printer 33 is changed to the CRT display 11. A screen display when outputting to the printer 33 is changed is shown.

Next, when the output parameter change process is performed as described above and the masking process starts, the parameters specified to be output to each device are output to the screen, file, printer, etc. as specified. Ru. Furthermore, the entire surface of the wafer is output as exposure information on the screen in a graphic display, and each time exposure is performed, the corresponding shot area is filled in.

At this time, the setting parameter display and the above-mentioned graphic display are on the same screen, and the display screen becomes as shown in FIG. 4 (8). The measurement parameter display screen is as shown in FIG. 4 (9), and the two screens can be switched using the function key ([F8] key).

As described above, setting parameters, measurement parameters, exposure information, etc. can be confirmed on the screen during the operation of the mask process.

[Effects of the Invention] As explained above, according to the present invention, settings and measurement parameters can be displayed on the screen during the operation of the mask process in the semiconductor printing exposure apparatus, so that the operator etc. can check the operating status of the apparatus, Setting values and measured values can be confirmed quickly and reliably. Additionally, by outputting the measured values to a file or printer, they can be used as materials for process management.

[Brief explanation of drawings]

FIG. 1 is an external view of a projection exposure apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing a control circuit of the projection exposure apparatus of the above embodiment, and FIG. 3 is an operation of the above embodiment. and a flowchart for explaining the operation. FIGS. 4 (1) to (9) are examples of display screens. 11... CRT for monitor, 12... Keyboard, 2
1...Main CPU, 30...Console, 31...
・Console CPU, 32...External memory, 33...
・Printer.

Claims (1)

[Claims] 1. In a semiconductor printing exposure apparatus that operates according to a large number of operating parameters, a mode for displaying preselected specific operating parameter setting values and exposure conditions, and measurement values during exposure of each shot. What is claimed is: 1. A semiconductor printing exposure apparatus, characterized in that a display mode is set, and means is provided for selecting one of these display modes during an exposure process and performing display according to each mode. 2. The semiconductor printing and exposure apparatus according to claim 1, wherein the operation is an exposure operation, and the specific operation parameters are an exposure time and a focus position. 3. Claim 1, wherein the measured value at the time of exposure is an actual measured value including exposure time and focus alignment time, and further includes means for storing these measured values as a file and means for outputting them to a printer. Or the semiconductor printing exposure apparatus according to item 2.