JPH09320956A - Lithography apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make an input checking function for numerical parameters exhibit effectively in limited applications. SOLUTION: As the conditions for the judgment of reasonability of numerical parameters among various parameters which are necessary for the implementation of an exposure process program, either of a 1st mode or a 2nd mode is individually set in a predetermined area of a memory device 120 for the respective numerical parameters and, further, values by which the limited ranges for the judgment of the reasonability of the respective modes are determined are also set in a predetermined area of the memory device 120. In this state, if any one of the numerical parameters is selected and inputted by a keyboard 116C, a minicomputer 106 judges the reasonability of the inputted parameter by using the limited range which is set in accordance with the set mode as a reference.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lithographic apparatus, and more particularly to a lithographic apparatus having a function of determining the correctness of numerical parameters necessary for executing an exposure processing program.

[0002]

2. Description of the Related Art In a conventional control system for a lithographic apparatus, numerical input of various parameters required to execute an exposure processing program is based on an input limit range previously stored in a memory corresponding to the program. , The validity of input values was checked uniformly. This limit range is often set to the maximum range allowed as a device in consideration of unspecified users.

Further, the exposure processing parameters created and stored for each process must be re-input for each process when a change occurs.
Therefore, even if the value is the same regardless of the process, it is necessary to input and set it for each process.

[0004]

In the above-mentioned prior art, the input value is uniformly limited based on the input limit range stored in the memory in advance, and the input limit value is
Since it was often set to the maximum range allowed by the device, the check function could be fulfilled if the number of digits in the input value was incorrect, but in the ideal sense an input error (input value error) ) Was not exerting the check function until it was prevented. That is, the exposure time and other numerical parameters are different for each user, and for each user, an input error is effectively prevented only when a certain limited range including the numerical value used by the user (self) is set as the input restriction range. This is because it can be prevented, and the input limit range of the maximum range permitted as a device considering the unspecified user as described above cannot be a substantial limit range for a specific user. .

Further, since the degree of strictness required for setting the input limiting range and the method of setting the required limiting range itself are different depending on the nature of the numerical parameter and the process to be processed, the above-mentioned memory is previously stored. The method of uniformly limiting the input value based on the stored input limitation range also has an essential problem that an effective check function cannot be exhibited.

Under such circumstances, it is necessary to change the exposure processing parameters created and stored for each process, and it is necessary to re-input each process.
It was difficult to effectively prevent an input error when the operator changes the setting at the start of lot processing.

The present invention has been made in view of the inconveniences of the above-described prior art, and the first purpose thereof is to effectively exhibit the input check function of numerical parameters in a limited use. It is to provide a lithographic apparatus.

A second object of the present invention is to provide a lithographic apparatus capable of reducing the labor of an operator for re-inputting numerical parameters.

[0009]

According to a first aspect of the present invention, a pattern formed on any surface of a mask is projected on a photosensitive substrate through a projection optical system in a predetermined image formation state,
A lithographic apparatus comprising: a projection exposure system that exposes the pattern image on a photosensitive substrate with a predetermined exposure amount; and a control system that comprehensively controls the operation of each unit of the projection exposure system, the projection exposure system comprising: A storage unit in which a series of operation procedures of each constituent unit is stored in advance as an exposure processing program, an input unit for selecting various parameters required to execute the exposure processing program and inputting the data, and a storage unit for the various parameters. The conditions for determining the validity of the numerical parameters in the above are a first mode in which a range of a certain width centered on a set value preset in the control system is set as a limiting range, and an absolute range of the range is limited. Determination condition designating means capable of individually setting any one of the second mode as a range for each of the numerical parameters, and each of the modes in which the mode is set. And limiting range setting means predeterminable limit the scope of that mode for each value parameter,
Every time the parameter is selected by the input means and the data is input, the validity of the data input based on the limit range set in the limit range setting means according to the mode set in the determination condition designating means And a determining means for determining.

According to this, a series of operation procedures of each component of the projection exposure system is stored in advance in the storage means as an exposure processing program. In addition, the judgment condition designating means, as a judgment condition of the validity of the numerical parameters among various parameters necessary for executing the exposure processing program,
Either the first mode or the second mode is individually set for each of the numerical parameters. Further, the limit range setting means sets the limit range of the mode for each numerical parameter for which the mode is set.

In this state, when one of the numerical parameters out of various parameters necessary for executing the exposure processing program is selected by the input means and the data is input, the determination means causes the determination condition designating means to operate. According to the set mode, the validity of the input data is determined based on the limit range set by the limit range setting means as follows.

That is, when the first mode is set as the judgment condition of the numerical parameter in the judgment condition designating means, the judgment means has a certain width centered on the set value set in the control system. The validity of the input data is determined using the range (this range is set by the limit range setting means) as the limit range. Further, when the second mode is set as the judgment condition of the numerical parameter in the judgment condition designating means, the judging means sets an absolute width range (this range is set by the limit range setting means). The validity of the input data is judged with the limit range.

As described above, by setting the mode, it is possible to check the legitimacy of the numerical parameters by different criteria. Therefore, it is possible to appropriately judge the validity according to the character of the numerical parameter.

According to a second aspect of the present invention, the determination condition designating means can further set a third mode which does not require the correctness determination, and the determining means sets the third mode. In this case, the numerical parameter for which the third mode has been set is updated to the preset eigenvalue of the numerical parameter.

According to this, when the third mode is set as the validity determination condition in the determination condition designating means, the determining means updates the numerical parameter to the preset unique value of the numerical parameter. . That is, in this case, only by presetting the third mode in the determination condition designating means as the determination condition of a certain numerical parameter, the numerical parameter is automatically updated to the preset unique value of the numerical parameter. Here, the setting of this eigenvalue is
It may be performed for the limit range setting means at the time of mode setting, or may be performed in advance independently of this. The point is that the eigenvalue should be set before the parameter is changed.

The third aspect of the present invention is the first or second aspect.
The lithographic apparatus according to claim 1, wherein in the lithographic apparatus according to claim 1, a fourth mode can be further set as the validity determination condition in the determination condition designating unit, and the determination unit is When the mode 4 is set, it is determined to be valid when the data input as the parameter data for which the fourth mode is set is a numerical value.

According to this, when the fourth mode is set as the validity determination condition in the determination condition designating means, the determination means inputs the fourth mode as data of the set parameter. If the data is numerical, it is judged to be valid. Therefore, if the input parameters are other than mathematically meaningless ones and implausible ones, it is judged to be valid without particular limitation.

According to a fourth aspect of the invention, in the lithographic apparatus according to the first aspect, the parameters to be subjected to the legitimacy determination are limited to specific numerical parameters that are highly necessary for the legitimacy determination. And

According to this, since the parameter to be subjected to the legitimacy determination is limited to a specific numerical parameter having a high necessity for the legitimacy determination, it is possible to prevent unnecessary legitimacy determination. Since the validity determination is performed when the validity determination is necessary, it is possible to effectively prevent an input error.

The invention according to claim 5 is the invention according to claim 1 or 2.
In the lithographic apparatus according to, the judgment condition designating means includes a mode automatic setting means for automatically setting a mode preset for each selected numerical parameter as a mode suitable for judging the validity of each numerical parameter. It is characterized by having annex.

According to this, the judgment condition designating means is provided with the mode automatic setting means for automatically setting the mode preset for each selected numerical parameter as the mode suitable for the validity judgment of each parameter. Therefore, only by selecting the numerical parameter, the mode suitable for the correctness determination is automatically set for each selected numerical parameter. Here, the mode preset as a mode suitable for determining the correctness of each parameter is, so to speak, a recommended mode and means a mode defaulted in consideration of the characteristics of each numerical parameter.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 shows a perspective view of a projection exposure apparatus 10 which is an embodiment of the photolithography apparatus according to the present invention, and FIG. 2 schematically shows the internal structure thereof. The projection exposure apparatus 10 is a so-called step-and-repeat type wafer stepper that is currently mainstream as a lithography apparatus in semiconductor manufacturing, and as shown in FIG. 1, an exposure apparatus main body (main system) as a projection exposure system is used. ) 12 and a control rack 14 serving as a control system for controlling them in a separate form, the main body system 12 is normally housed in an environmental chamber whose interior space is highly dust-proof and temperature-controlled with high precision. However, in FIG. 1, only the internal structure with this chamber removed is schematically shown.

Next, the configurations of the main body system 12 and the control rack 14 will be described with reference to these drawings.

The main body system 12 includes a pedestal section 16, an illumination optical system 18, a projection optical system PL, a reticle transfer system, a reticle stage RST, a wafer transfer system, and a wafer stage WS.
T, alignment system, auto focus / auto leveling (AF / AL) detection system 90, LC / MAC system and the like.

In more detail, the pedestal portion 16 is supported on the floor surface by means of four vibration isolating bases 20, and the pedestal portion 16 is provided with a surface plate 22 parallel to the floor surface and the surface plate 22. A support plate portion 24 is provided on the upper side so as to face the surface plate 22. The support plate portion 24 is formed of a rectangular plate-shaped member having an opening in the center, and the projection lens system PL is arranged in the center opening portion 24A in a state orthogonal to the support plate portion 24, and is not shown in the support plate portion 24. It is held via holding means.

A projection lens system P is provided on the support plate 24.
Four legs 26 that are erected outside the four corners of the opening 24A so as to surround L, and these legs 26
A main body column 30 which is supported by the upper plate 28 and which connects the upper ends thereof to each other is arranged. A concave portion 28A is formed on the upper surface of the upper plate portion 28. The exit end of the illumination optical system 18 is arranged facing the recess 28A, and the reticle stage RST shown in FIG. 2 is arranged between the illumination optical system 18 and the upper plate 28. When the reticle R is held, the reticle stage RST moves the reticle R in the XY directions (orthogonal biaxial directions orthogonal to the optical axis AX of the projection lens system PL: in the present embodiment, substantially the same as the end surface direction of the surface plate 22). It is possible to position it at a predetermined position by slightly moving it in the θ direction (the rotation direction around the axis parallel to the optical axis AX of the projection lens system PL).

The illumination optical system 18 includes a light source unit 32.
Is housed in the back of the reticle stage RST to guide the exposure illumination light to a position above the main body column 30.
The reticle R as a mask, which is held horizontally at the top, is illuminated with uniform illumination light from above. Here, the configuration of the illumination optical system 18 will be described in detail together with the operation of each component.

As shown in FIG. 2, the illumination optical system 18 includes a light source unit 32, a shutter 34, a secondary light source forming optical system 36, a beam splitter BS, and a condenser lens system G.
1, a reticle blind 38 as an illumination field stop, an imaging lens system G2, a condenser lens system CL, a dichroic mirror DM, and the like.

The light source unit 10 has a mercury lamp as a light source, an elliptical mirror, an air-cooling fan (all are not shown), and the mercury lamp is controlled by the light source controller 40 by direct current lighting with a predetermined supply power. Has become.
The light source controller 40 sets a constant illumination control mode in which feedback control is performed so as to keep the light emission brightness of the mercury lamp constant, or supplies power only at the time of exposing the wafer W as a photosensitive substrate, or makes the light emission brightness about twice the rated value. High,
It has a flash control mode that returns to the rated value during non-exposure.

When an excimer laser light source is used as the light source, the light source controller 40 controls the light emission trigger for making the laser emit light in a pulse and the supply control of the high-voltage discharge voltage for adjusting the light emission peak value.

Illumination light from the mercury lamp reflected by the elliptical mirror is focused on the second focal point of the elliptic mirror and is transmitted to the secondary light source forming optical system 36 via the shutter 34 arranged at the second focal point position. It is supposed to be incident. As the shutter 34, for example, a rotary shutter in which three light shielding blades are arranged at 120 ° intervals is used, and a shutter drive mechanism (SDU) including a motor, a drive circuit (all not shown), and the like.
42 switches between blocking and transmitting illumination light. Therefore, the proper exposure amount to the wafer W is controlled mainly by changing the opening time of the shutter 34.

The secondary light source forming optical system 36 includes an interference filter (not shown) for extracting i-line (wavelength 360 nm) from the illumination light from the light source unit 32, and an input lens (not shown) for collimating the extracted i-line illumination light. System, an unillustrated optical integrator (fly-eye lens group) for generating a secondary light source surface IP that is a collection of a plurality of point light source images upon incidence of collimated illumination light, and a secondary light source surface I
Light blocking filter (or illumination σ diaphragm plate) that blocks part of P
It is composed of FL. The light blocking filter FL is switched by a drive mechanism (FDU) 44 so as to be selected from a plurality of filters having different opening shapes and opening sizes fixed on a rotating turret (not shown).

The light-shielding filter (σ diaphragm plate) FL controls the aperture (NA) characteristic and the light distribution characteristic of the i-line illumination light on the reticle R to control the resolution performance during projection of the reticle pattern. The partial light-shielding filter having a cross-shaped light-shielding portion that intersects at the center is a SHRINC.
It is called a filter and realizes projection imaging with ultra-high resolution and large depth of focus for periodic patterns on the reticle.

In FIG. 1, the rotary turret and drive mechanism 44 are shown.
Is shown so that the operator can open the cover of the σ diaphragm unit 46 and install the required light blocking filter FL in the blank hole of the rotary turret.

Illumination light from the secondary light source surface IP that has passed through the light shielding filter FL in the secondary light source forming optical system 36 is reflected by the beam splitter BS by about several percent and is received by the photoelectric sensor 48. The photoelectric sensor 48 outputs a photoelectric signal according to the intensity (illuminance) of a part of the received illumination light to the exposure controller 50. The exposure controller 50 uses the SDU so that an appropriate exposure amount can be obtained based on the photoelectric signal.
42 or the shutter 34 is controlled to open for a specified time, and the light source controller 40 is instructed of a target value in the constant illuminance control mode, or illuminance up / down in the flash control mode. Give instructions such as timing.

Most of the remaining illumination light transmitted through the beam splitter BS is made into a uniform illuminance distribution on the reticle blind 38 as an illumination field stop by the condenser lens system G1. This reticle blind 38 has a rectangular opening 4
By driving the sides with the ARB drive mechanism 52, the size of the illumination visual field region, the ratio of the long side to the short side of the rectangle, or the optical axis A
The position with respect to X can be changed arbitrarily.

Illumination light uniformized at the position of the rectangular opening of the reticle blind 38 illuminates the pattern area (usually rectangular) of the reticle R via the imaging lens system G2, the condenser lens system CL, and the dichroic mirror DM. To do. At this time, the composite system of the imaging lens system G2 and the condenser lens system CL is set so that the rectangular aperture surface of the reticle blind 38 and the pattern surface of the reticle R are conjugated. The dichroic mirror DM has a characteristic of reflecting 90% or more of i-ray illumination light and transmitting tens of percent of long-wavelength light (for example, 600 nm or more).

In the present embodiment, as the projection lens system PL, a telecentric on both sides and a ⅕ reduction magnification is used. Therefore, the imaging light flux passing through the pattern area of the reticle R is projected lens system PL. Through the via, the image is projected onto the resist layer on the shot area to be superposed and exposed on the surface of the semiconductor wafer W which is vacuum-adsorbed by the ceramic holder on the wafer stage WST described later.

The reticle transport system is a main body system 12
Is a general term for each part related to the flow of the reticle R from the reticle library 54 provided on the front side of the reticle to the reticle stage RST. Each part of the reticle transport system will be described together with its operation.

As shown in FIG. 1, the reticle library 54 is provided on the front side of the main body system 12, and a plurality of reticles R used for exposure are pre-loaded inside the reticle library 54. However, one reticle R is housed in one dedicated case CS in a dustproof state, and a plurality of the cases CS are detachably attached to the reticle library 54.
In FIG. 1, two reticle libraries 54 are arranged side by side, and 10 to 15 cases CS can be attached to each reticle library 54.

Behind this reticle library 54,
The reticle auto loader 56 is provided, and the reticle R used for exposure is taken out from the corresponding case CS by a transport arm (not shown) of the reticle auto loader 56, and a reticle foreign matter inspection unit (RPD) provided further behind the reticle auto loader 56. ) 58, or a pellicle foreign matter inspection unit (PPD) 60 provided directly below the reticle library 54. These foreign matter inspection units 58 and 60 inspect the presence or absence, size, presence position, etc. of foreign matter (particles) adhering to the surface of the reticle or the surface of the dust-proof pellicle to determine whether or not the use of the reticle R is appropriate. The information is provided to the operator.

The reticle R, which has been judged to be usable after the foreign matter inspection, is sent by the reticle autoloader 56 to the reticle cache (temporary storage) 62 or the reticle stage RST movably arranged on the upper plate portion 28. The reticle cashier 62 is for stocking approximately 4 to 10 reticles R naked in order to shorten the replacement time when the reticle is frequently replaced when manufacturing an ASIC device or the like.

The reticle R sent to the reticle stage RST is the optical axis A of the illumination optical system 18 or the projection lens system PL.
It is adsorbed and fixed on the reticle stage RST, which moves in parallel in the X and Y directions in the XY plane perpendicular to X, and also rotates and moves in the θ direction. This reticle stage RS
T is driven by a driving unit 66 that is biased under the control of the alignment controller 64 (see FIG. 2).

Note that the reticle transport path space inside each of the reticle library 54, the reticle autoloader 56, the reticle foreign matter inspection unit 58, and the reticle cache 62 actually causes generation of dust and adhesion of dust to the reticle. The air temperature is stabilized by a special air conditioning mechanism.

The wafer transfer system is a carrier mounting unit 6
Wafer W from 8A, 68B to wafer stage WST
This is a general term for each part of the configuration related to the flow of, and next, each part will be described together with its operation.

Wafers W as photosensitive substrates are usually stocked in a wafer carrier (not shown) with about 25 wafers as one lot.
It is detachably set to A and 68B. Then, one wafer W in the wafer carrier is taken out by a pick-up arm (not shown) of the random access type wafer autoloader 70, and wafer prealignment
It is conveyed to the unit 72.

Wafer pre-alignment unit 72
Is a turntable for mounting and rotating the transferred wafer W, and a linear notch (orientation) of the wafer W by photoelectrically and non-contactly detecting the outer shape of the wafer W while the turntable is rotating. Flat) or V-shaped notch (notch) aligns in a certain direction with a rotation direction positioning system that stops rotation of the turntable, and turntable rotation of a center point determined by the outer shape of the wafer W that has been rotationally positioned. XY that photoelectrically detects the eccentricity in the X and Y directions with respect to the center point in a non-contact manner and finely moves the turntable in the X and Y directions so as to correct the eccentricity.
And a directional positioning system.

The wafer W pre-aligned by the wafer pre-alignment unit 72 is removed from the turntable by the wafer exchange arm 74, which is a part of the wafer autoloader 70, and moved to a predetermined loading position (delivery position). The wafer is transferred onto the holder of wafer stage WST. As shown in FIG. 1, the exchange arm 74 is a loading arm 7 for transferring a wafer from the turntable to the wafer stage WST.
4A and an unloading arm 74B for transporting the wafer from the wafer stage WST to the turntable, which are provided vertically at a slight interval and are independent of each other or interlocked with each other to form a straight line. It is configured to move in the opposite direction. Further, in the above configuration, the wafer carrier and carrier mounting portions 68A, 68B, the wafer autoloader 70, the wafer pre-alignment unit 72, and the like have a wafer transfer path space in which dust is extremely attached not only to the front surface of the wafer W The air temperature is stabilized by a dedicated air conditioning mechanism if necessary.

Next, the wafer stage WST and the mounting state of the wafer W on the wafer stage WST will be described.

Wafer stage WST is configured to move two-dimensionally on surface plate 22 below main body column 30 in an XY plane orthogonal to optical axis AX of projection lens system PL.
The adjustment stage ZLS is mounted on the wafer stage WST.
Is provided, and the adjustment stage ZLS has an optical axis A
The structure is such that it can be slightly moved in the X direction (Z direction) and can be slightly tilted (leveled) with respect to the XY plane.

On the adjusting stage ZLS, a wafer holder (not shown) made of ceramic that can rotate by a small amount θ is provided, and the wafer W is adsorbed and held by the wafer holder at a predetermined vacuum pressure. The temperature of the wafer holder is controlled in order to suppress expansion and deformation of the wafer W due to heat accumulation during exposure.

Each moving coordinate position of wafer stage WST in the X and Y directions is sequentially measured by laser interferometer 76, and the coordinate position information is sent to stage controller 78.

Stage controller 78 outputs a command signal for driving wafer stage WST to drive unit 80 based on the measured coordinate position and target position information to be positioned.

Further, a part of the adjustment stage ZLS is provided with a fiducial mark plate FM fixed so as to be substantially the same height as the wafer W. Reference marks that can be detected by various alignment systems described later are formed on the surface of the reference mark plate FM. These reference marks are used to check (calibrate) the detection center points of the alignment systems and to detect the detection center points between them. Baseline length measurement,
It is used to check the position of the reticle R with respect to the wafer coordinate system, or to check the position of the best imaging plane conjugate with the pattern surface of the reticle R in the Z direction.

The alignment system is a component for precisely positioning the reticle R with respect to the optical axis of the projection lens system PL, and precisely positioning the relative positions of the reticle R and the wafer W with each other. Then, body column 30
Reticle alignment system (RA system) installed on top of the
82 and the TTL provided in the peripheral space below the reticle
(Through The Lens) type first wafer alignment system (TTLA system) 84, TTR (Through The Reticle) type reticle / wafer direct alignment system (TTRA system) 86 and projection lens provided on the RA system 82. It is a general term for an off-axis type mark imaging alignment system (FIA system) 88 (see FIG. 2) provided on the side of the system PL.

Of these, the reticle alignment system (RA
82) is a projection lens system PL for exposing the reticle R to be exposed.
For precise positioning with respect to the optical axis of the reticle R, and photoelectrically detects reticle alignment marks formed outside the pattern area of the reticle R (at two or three locations around the reticle R). Then, the detection signal indicating the amount of deviation of the mark from the predetermined reference position is output to the alignment controller 64. Alignment controller 6
4 is a drive unit 66 based on a detection signal indicating the amount of deviation.
To position the reticle R at a predetermined position.

The objective lens system of the RA system 82 is arranged between the observation position and the optical axis AX of the projection lens system PL in order to correspond to the arrangement of the reticle alignment marks that differ depending on the type of the reticle R to be mounted. It is movable to switch the distance. Such movable setting of the objective lens system of the RA system 82 is called so-called change of device environment,
This is necessary when the reticle has a configuration in which both 5 inches and 6 inches can be mounted, and the size of the pattern area (field size) is different even between reticles of the same size.

The first wafer alignment system (TTL
A system) 84 is for TTL attached to the shot area on the wafer W from the peripheral space below the reticle R through the peripheral part within the field of view of the projection lens system PL (circle having a diameter of about 20 cm on the reticle R side). The wafer mark is photoelectrically detected, and based on the photoelectric signal, the amount of positional deviation of the TTL wafer mark in the X or Y direction with respect to the reference position (detection center point) inside the TTLA system 84, or the detection center point and the TTL wafer. The wafer coordinate position is measured when the center of the mark matches. Then, the information regarding the measured deviation amount is sent to the alignment controller 64.

Since the TTLA system 84 is a system which does not detect the mark of the reticle R, the mark detection illumination light (or laser spot beam) with which the wafer W is irradiated is not applied to the resist layer on the wafer W. It has a feature that it can be set to a photosensitive long-wavelength region, light absorption by the resist layer is small, and S / N reduction of the photoelectric signal at the time of detection can be prevented. Therefore, TT is set in the global alignment in which some shot areas on the wafer W are sample-aligned to determine the shot arrangement, or the search alignment for first finding a mark at a specific position on the wafer W.
By using the LA system 84, high accuracy and high throughput can be secured.

Further, the reticle / wafer direct alignment system (TTRA system) 86 photoelectrically detects the TTR reticle mark formed around the pattern area of the reticle R (very close) from above the dichroic mirror DM, and at the same time, The TTR wafer mark formed in the scribe line around one shot area on the wafer W is photoelectrically detected through a window adjacent to the TTR reticle mark and the projection lens system PL, and based on the photoelectric signal , T
The amount of deviation in the X direction or the Y direction between the TR reticle mark and the wafer mark is measured. Then, the information regarding the measured deviation amount is obtained by the alignment controller 6
Sent to 4.

The TTRA system 86 is mainly used for direct alignment between the shot area and the reticle R (Die by Die) immediately before exposing each shot area on the wafer W by the step and repeat method. However, in some cases, after the baseline length measurement (baseline check), some shot areas on the wafer W are sample-aligned in advance (exposure position measurement of the shot area) before the exposure operation. It is also used for global alignment to determine the shot sequence.

The FIA system 88 is arranged at a position at a fixed distance from the optical axis AX of the projection lens system PL, and is non-photosensitive to the local area including the wafer mark for TTR or TTL attached to the shot area on the wafer W. While illuminating with a wide wavelength band light of, a magnified image of the wafer mark in the local area,
Take a picture with a CCD camera along with the optical index mark inside,
Based on the image signal, the amount of deviation between the wafer mark and the index mark in the X direction or the Y direction is measured. Then, the information regarding the measured deviation amount is sent to the alignment controller 64.

The index mark is formed on a transparent index plate (not shown) arranged at a position conjugate with the wafer W inside the FIA system 88, but on the image pickup surface of the CCD camera, for example, in the vertical scanning direction. It is set to be included in the lower half area, and only the enlarged image of the surface of the wafer W appears in the upper half area of the imaging surface. This is because the upper half area of the image pickup surface is the adjustment stage ZLS described above.
This is because it is used for search alignment for first finding a mark at a specific position of the wafer W that is vacuum-sucked by the upper holder, and for observing the formation state of the wafer mark.

The above-mentioned TTRA system 86, TTLA system 84, and FIA system 88 are all capable of photoelectrically detecting corresponding reference marks formed on the reference mark plate FM on the adjustment stage ZLS.

The AF / AL detection system 90 processes the photoelectric signal of the photoelectric sensor 92 which receives the reflected light of the non-photosensitive light beam obliquely projected onto the surface of the wafer W, thereby processing the projection lens system. Wafer W for best image plane of PL
A displacement amount (focus displacement amount) and a tilt amount (leveling displacement amount) of the surface in the Z direction are detected, and a detection signal indicating each displacement amount is sent to the stage controller 78. In response to this, the stage controller 78 outputs a command signal for driving the adjustment stage ZLS to the drive unit 80.

The LC / MAC system is a projection lens system PL.
Is to finely adjust various optical characteristics (imaging performance) of the projection image. In the present embodiment, the gas pressure of a specific air space in the projection lens system PL is forcibly controlled via the pipe 94 to obtain a projected image. A mechanism for finely adjusting the imaging magnification (pressure adjusting mechanism), and a mechanism for finely moving some of the lenses on the reticle R side of the projection lens system PL to adjust the distortion (symmetrical distortion or asymmetrical distortion) of the projected image ( MAC) 9
6. An NA variable mechanism 100 that adjusts a variable aperture diaphragm (NA diaphragm) 98 arranged on the pupil plane of the projection lens system PL, that is, the Fourier plane, to a specified value, for example, from the full aperture state to about half. And a lens controller 102 for controlling them.

Next, the structure of the control rack will be described.

The control rack 14 is constructed as a distributed system for individually controlling each unit of each unit of the stepper, and the processor board rack unit 10 for storing a plurality of processor boards for controlling each unit.
4. A rack section for accommodating a mini computer 106 (see FIG. 2) as a main control unit for controlling each processor board as a whole, various operation sections for man-machine interface with an operator, a display section, etc. It has a single rack configuration that stacks the racks to be stored.

The light source controller 40, the exposure controller 50, the alignment controller 64, shown in FIG.
Stage controller 78, lens controller 10
2. Each of the illumination system controllers 108 is configured as a processor board including a microcomputer,
The processor board of the control rack 14 shown in FIG.
It is stored in the rack section 104.

On the top of the control rack 14, a stabilized power supply unit 110 for supplying a predetermined power supply voltage to each unit in the rack is mounted, and in the rack unit therebelow, a mini computer 106 and a floppy disk driver (FDD). And are mounted. Further, in the rack section below it, a color display for a monitor for displaying various data, commands, status, program list, operation procedure information for the operator to control the apparatus, a mark imaging screen at the time of alignment, various detection signal waveforms, etc. 112, an emergency stop emergency button 114A, and an alarm release switch group 114B for stopping various alarm displays (alarm sound, patrol light, etc.) are housed.

At the height position where the operator can most easily operate in the middle stage of the control rack 14, coordinate position information of wafer stage WST, wafer focus state, projection lens system P
A display panel section 116A for displaying various pressure states when L is pressure-controlled and an operating state of a specific portion in the stepper, and a basic movable section (various stages) in the stepper and a switching section are manually operated. An operation panel unit 116B including a joystick for operating the keyboard, switches, and the like, and a keyboard unit 116C as an input unit for interacting with the minicomputer 106 are integrally provided in a shelf shape so as to project to the front. .

The display panel section 116A, the operation panel section 116B, and the keyboard section 116C are controlled by a single microprocessor for panel control, and the microprocessor itself is also under the general control of the minicomputer 106. And the board rack section 1
Each of the plurality of processor boards housed in 04 is
Each unit in the corresponding stepper body system 12 is connected via a cable 118.

The unit in the stepper main body system 12 is not limited to the form in which one processor board shares only one drive mechanism system, and includes the form in which a plurality of drive mechanism systems are shared. In that case, each of the plurality of drive mechanism systems shall be treated as a unit.

As shown in FIG. 2, in the minicomputer 106, in addition to the monitor color display 112, the operation panel section 116B, the keyboard section 116C, the operation procedure of the entire system is stored in advance in a data file format. A data file storage device (hereinafter referred to as “storage device”) 120 as a means is also connected.

A file in which various data relating to the reticle R handled by the system is stored in the storage device 120,
A file that stores a process program in which necessary parameters are collectively described for each wafer lot to be exposed, and operation commands and parameters for each unit in the system necessary for wafer exposure processing and device control are collectively described. A file for storing the executed program, a file for storing a utility program for self-measuring or calibrating the accuracy and various optical characteristics of each unit in the system, and the like are prepared.

Minicomputer 10 as main controller
Reference numeral 6 integrally controls the alignment controller 64, the stage controller 78, and the lens controller 102 described above according to a predetermined process program. Further, the minicomputer 106 commands the operation of the illumination system controller 108 that controls the FDU 44 and the ARB drive mechanism 52 according to the process program.

The exposure controller 50 is placed under the control of the stage controller 78, and, for example, in the step-and-repeat exposure operation, in response to completion of positioning of the wafer stage WST with respect to one shot area, an opening command for the shutter 34 is issued. Output to SDU42.

By the way, the operation of the mini computer 106 as the main control unit is performed by the input operation from the keyboard section 116C or the operation panel section 116B in response to the message displayed on the monitor color display 112 or the operation panel section 116A. .

The programs and data files required for execution are stored in the storage device 120, and are read and written from the storage device 120 as needed by operating the keyboard section 116C.

Of the various parameters necessary for executing the exposure process, the parameters for each process are stored in advance in the storage device 120.
Stored in the process program file of. Further, in the present embodiment, the mode defining the input validity determination condition is a storage device 1 as a condition file in a table format.
It is configured to be set in a predetermined area (determination condition designating means) in 20 and is preset by, for example, input from the keyboard unit 116C. The condition file for setting the mode is not limited to keyboard input, and is created in advance by another device, and is stored in a predetermined area in the storage device 120 via a data recording medium such as a floppy disk or a communication line. (Condition specifying means) may be loaded, and in short, a condition file may exist in advance in the storage device 120 when the operator changes the parameters prior to exposure.
In the present embodiment, as will be described later, the first mode to the fourth mode can be set as the condition for determining the validity of the parameter.

Of these parameters, the limit value for defining the limit range in each of the first mode and the second mode for each parameter is input from the keyboard section 116C or a data recording medium or a communication line, and the minimized It is temporarily stored in a predetermined area (corresponding to a limit range setting means) of the internal memory in the computer 106, and is stored in a predetermined area (a part of the judgment condition designating means) in the storage device 120 by the processor in the minicomputer 106. ) Will be registered. The limit value defining the limit range may be provided in the device as a condition file, or may be set in the process program.

Here, the above-mentioned keyboard input or mode setting in another device, and setting of a limit value defining the limit range, that is, creation of a condition file stored in the storage device 120 is performed in advance by staff. When using a communication line, it is possible to have a condition file outside the device and take it into the device via the communication line when determining the correctness when changing parameters.

Parameters for each determination (hereinafter, these numerical values to be input when these parameters are selected to be changed) are input to the determination condition specifying means (predetermined area in the storage device 120) by the above-mentioned keyboard input or the like. To distinguish it from the parameter, it is called "Item" as appropriate), for example, Exposure Time, Focus Offset, Rotation, Orthog
As the determination conditions of onality, Scaling, and Offset, for example, a mode setting as shown in FIG. 4 is made. In addition, as the limit value, the limit value 1 and the limit value 2 for each parameter, or only the limit value 1 is indicated in a region surrounded by a thick line in FIG. Part of the condition specifying means) is set.

The modes in FIG. 4 have the following meanings.

Mode 1: Only the value within the limit range set by the limit range setting means is permitted with the value preset by the process program as the central value.

Mode 2: Only the value within the limit range (absolute value range) preset by the limit range setting means is permitted. Note that the limit range of this mode 2 is Limi in FIG.
It is also possible to set t-1 (lower limit value) = Limit-2 (upper limit value), and in this case, this mode 2 does not allow input other than the value (unique value) preset in the limit range setting means. It becomes a mode.

Mode 3: Automatically setting a unique value stored in advance in a predetermined area of the storage device 120, for example, as a part of a condition file, without performing the validity determination. That is, with respect to the item for which this mode 3 is set, the validity is not determined, and the item is automatically set to the preset unique value, and therefore re-entry is unnecessary.

Mode 4: This mode is not illustrated in FIG. 4, but can be set in practice, and when this mode is set, input is permitted if it is a numerical value.

Next, the determination of the correctness of the parameter input in this embodiment will be described with reference to FIGS. 3 to 4 along the flowchart of FIG. 5 showing the main control routine of the processor in the minicomputer 104. . It is assumed that the setting as shown in FIG. 4 is made as a precondition.

This control routine starts
For example, this is when the operator selects a process program from input means such as the keyboard unit 116C prior to the exposure execution processing.

At step 200, the exposure time and other parameters which have been input and set in advance in the process program and stored in the storage device 120 are read out and displayed on the screen of the monitor color display 112. This allows
For example, a display as shown in FIG. 3 is displayed on the screen. When the operator sees this display and it is not necessary to change the numerical parameter (including the case where the numerical parameter has been changed as described later), the operator instructs the end and , One of the above-mentioned items, that is, the parameter to be changed, is selected with, for example, a mouse or a cursor. For the item for which mode 3 is set, the parameter is selected at the time of being the change target, and is automatically updated to the unique value before being displayed on the screen of the display 112 before the exposure processing.

Therefore, in step 202, the apparatus waits for an input. Then, if there is any input, the determination at step 202 is affirmative, and the process proceeds to step 204 to determine whether the input is an item selection command. If the determination in step 204 is negative, it is determined that the operator has instructed the end, and the process proceeds to step 230, in which the monitor color display 1 is displayed.
For example, a message "Can I finish?" And "Yes, No" are displayed in predetermined display areas on the screen 12 to confirm the end. At this point, when it is okay to end the operation, the operator uses the mouse to display "Yes
If "s" is selected and the process should not be terminated, "No" should be selected. Here, the case where the operation should not be ended means that the operator has changed his / her mind on the way and that the data input in the above step 202 is neither a selection command nor an end command, and is an invalid input data ( (Including commands).

Therefore, in the next step 232, it is determined whether or not the end is OK by determining whether or not the above "Yes" is selected by the operator. And
If "Yes" is selected, the series of processes of this routine is ended. On the other hand, if "No" is selected, the process proceeds to step 228, a message indicating an error and re-input is displayed at a predetermined position on the screen of the monitor color display 112, and then the process returns to step 202. After the end of this routine, the exposure process according to the exposure process program is started, and at this time, the value of each numerical parameter changed as described later by this routine is replaced with the numerical data in the process program. used.

On the other hand, if the determination in step 204 is affirmative, the flow proceeds to step 206 to check the selection contents, that is, which item has been selected. As a result, in the example of FIG. 3, “Exposure Time
, Focus Offset, Rotation, Orthogonality, Scaling
, Offset ”is selected.

At the next step 207, the mode for judging the validity of the item confirmed at 206 is the mode 3
Or not is set. This judgment is made by confirming the contents of the above-mentioned judgment condition designating means (see FIG. 4) (mode judgment in the following description is made in the same manner). Then, when the mode 3 is set, it is determined that the validity determination is not necessary and the process proceeds to step 210 (details will be described later) to rewrite the value of the item for which the mode 3 is set to the preset unique value. After that (if it has already been rewritten to the eigenvalue, it remains the same), the process returns to step 202. On the other hand, if the determination in step 207 is negative, the operator waits for input of numerical parameters. When the operator performs the input process from the input unit such as the keyboard unit 116C, the determination in step 208 is affirmative, and step 212
Then, it is determined whether the data input in step 208 is a numerical parameter.

In the determination in step 212, it is determined that input data other than numbers, such as Chinese characters, alphabets, etc., and an abnormal numerical value including a numeral but two decimal points are not numerical parameters. When the determination in step 212 is negative, the process proceeds to step 228, and after displaying a message instructing an error and re-input at a predetermined position on the screen of the monitor color display 112, the process proceeds to step 202. Return. On the other hand, when a normal numerical parameter is input, the determination in step 212 is affirmative and step 2
In step 14, it is determined whether or not the mode for judging the validity of the item confirmed in 206 is set to mode 4. When the determination in step 214 is affirmative, the value of the selected item in the process program is rewritten to the numerical value input in step 207, and the process returns to step 202. On the other hand, if the determination in step 214 is negative, step 2
In step 16, it is determined whether or not the mode for checking the validity of the item confirmed in step 206 is set to mode 1. If the determination is affirmative, the process proceeds to step 218 to determine the legitimacy in mode 1, and then in step 220, as a result of the legitimacy determination, it is determined whether the range is the limit range of mode 1. to decide. If it is within the limit range, the process proceeds to step 226, the item value confirmed in step 206 in the process program is rewritten to the numerical value input in step 207, and then the process returns to step 202. On the other hand, if the determination in step 220 is negative, it is determined that the input is illegal, and the process jumps to step 228 to display an error and a message instructing re-input at a predetermined position on the screen of the monitor color display 112. After displaying, return to step 202.

On the other hand, if the determination in step 216 is negative, that is, if the mode for determining the validity of the item confirmed in step 206 is set to mode 2, the process proceeds to step 222. After performing the correctness judgment in the mode 2, step 22
At 0, as a result of the validity judgment, it is judged whether or not it is within the limit range of Mode 2. If it is within the limit range, the process proceeds to step 226, the value of the numerical parameter confirmed in step 206 in the process program is rewritten to the value input in step 207, and then step 2
Return to 02. On the other hand, if the determination in step 224 is negative, it is determined that the input is illegal, and step 22
After jumping to step 8 and displaying a message instructing error and re-input at a predetermined position on the screen of the monitor color display 112, the process returns to step 202.

If the operator sees the screen of FIG. 3 and thinks that it is not necessary to change any of the numerical parameters, the above-mentioned control routine is executed by performing a certain time without performing any operation. It may be terminated, and such a thing can be easily realized by changing the software.

The case where each item is selected will be described in detail below with reference to FIGS. 3 and 4. When it is necessary to change the exposure time (Exposure Time), the operator selects the exposure time. Step 202 → 2
The process proceeds from 04 to 206, and the selection of the exposure time is confirmed in step 206. In the next step 207, it is determined whether or not the mode 3 is set. In this case, since the exposure time determination mode is the mode 1, this step 2
The determination of 07 is denied, and the routine proceeds to step 208. When the operator inputs a numerical parameter after selecting the exposure time, the determination in step 208 is affirmative, the process proceeds to steps 212 → 214 → 216, and the determination in step 216 is affirmative, and then step 218
Then, it is determined whether or not the input numerical parameter is within the limit range of mode 1. That is, the set value of the exposure time in the process program (in this case, 200 mse
c) as the center value, and the first limit value (-5 in this case)
0.0 msec) and the second limit value (+5 in this case)
The parameter within the limit range defined by (0.0 msec) is permitted as a valid input. That is, (center value + first value
Of the input numerical parameter is determined by determining whether or not (limit value of) ≦ input value ≦ (center value + second limit value) is satisfied. In the case of FIG. 4, for example, when the exposure time in the process program is 200 msec, (200-50) ≦ input value ≦ (200 + 50), and when a numerical parameter of 150 msec to 250 msec is input, a valid input is made. Then, the determination at the next step 220 is affirmed, and the routine proceeds to step 226, where the input numerical parameter is rewritten as the exposure time in the process program, and then the routine returns to step 202. On the other hand, if a numerical parameter outside the range of 150 msec to 250 msec is input, it is determined that the input is invalid, the determination in step 220 is denied, and the process jumps to step 228.

For example, rotation (Rotatio
If n) is selected, step 202 → 204 →
Proceeding to 206, after the rotation selection is confirmed in step 206, the rotation selection is confirmed in step 206. Since this rotation determination mode is set to mode 2, the determination at the next step 207 is denied. Then, when the numerical parameter is input by the operator, the determination in the next step 208 is affirmed, and then step 212 →
In the order of 214 → 216 → 222, it is determined whether or not the numerical parameter input in step 222 is within the limit range of the mode 2. That is, a parameter within the limit range determined by the first limit value (-3.0 μrad in this case) and the second limit value (+3.0 μrad in this case) is permitted as a valid input. That is, the validity of the input numerical parameter is determined by determining whether or not the first limit value ≦ the input value ≦ the second limit value is satisfied. In the case of FIG. 4, −3.0 ≦ input value ≦ +
3.0, that is, when a numerical parameter of −3.0 μrad to +3.0 μrad is input, it is determined as valid input, the determination in the next step 224 is affirmative, the flow proceeds to step 226, and the input numerical value is entered. Rewrite the parameter as rotation in the process program.
On the other hand, when a numerical parameter outside the range of −3.0 μrad to +3.0 μrad is input, it is determined that the input is invalid and the process jumps to step 228.

In this case, the first limit value =
In the case of the second limit value, a fixed value limit can be applied, whereby, for example, by using this to determine the parameter in the process program instead of the input numerical value, It is also possible to easily determine whether a specified value is set as a certain parameter in the process program.

With respect to the orthogonality (Orthogonality) and the offset (Offset), the same validity judgment is made.

Further, for example, scaling (Scaling)
In the case of, the process proceeds from step 202 → 204 → 206, and after the selection of scaling is confirmed in step 206, the process proceeds to step 207. However, since the scaling determination mode is set to mode 3, After the determination is positive, the process proceeds to step 210. As described above, for the item for which the mode 3 is set, the parameter is selected when the item is changed, and the display 1 is displayed before the exposure process as described above.
Since it is automatically updated to the eigenvalue before it is displayed on the screen of 12, the scaling value should be the eigenvalue set in advance in step 207, but the operator mistakenly rewritten the parameter. In such a case, the scaling value is rewritten to, for example, a unique value preset in the condition file, in this case 0.8 [ppm], and the process returns to step 202. Therefore, in this case, the validity is not determined. That is, when the mode 3 is set, the value of the parameter can be fixed, and as a result, re-entry becomes unnecessary and
The operator's erroneous operation can be recovered and the operability of the operator is improved.

In particular, when mode 3 is preset as the determination mode of any of the parameters in the determination condition designating means, when exposure is performed by the exposure apparatus,
When exposure is performed using any of a plurality of process programs, the value of the parameter can be fixed to an eigenvalue, and it does not need to be changed for each process, in other words, for each product. Since the operator input is significantly reduced, it is possible to prevent the operator's input from being significantly reduced and prevent the input error from occurring.

[Focus Offset]
Also for, the same rewriting to the eigenvalue is performed.

According to the present embodiment described above, the determination mode and the input limit value of the illegal input of each numerical parameter are set in advance in the predetermined area in the storage device 120, so that the user's purpose can be adjusted. By further preparing the incorrect input judgment mode and input limit value for each operator,
It is possible to prevent illegal input according to the use of each operator. Further, in the case of the present embodiment, as the determination mode, four kinds of modes from the first mode to the fourth mode can be set, so that the mode can be set according to the property of each numerical parameter.

In the above embodiment, when the mode 3 is set, the parameter (item) is erroneously selected (erroneously input) when the parameter (item) is displayed or by the operator. ), The processor in the minicomputer 104 automatically updates the value to a preset legal value (eigenvalue), so that an operator's input error can be reliably prevented and further re-execution is possible. There is also an advantage that no input is required. In this case, as a result, inputs other than the preset eigenvalue are ignored (not permitted).
Therefore, in place of this mode 3, it is possible to set a mode in which input other than the unique value is not permitted and an error is displayed and re-input is prompted.

In the above embodiment, the case where the condition file for judging the correctness of each numerical parameter is created manually by staff or the like has been described, but here, according to the property of each numerical parameter. It is considered that the optimum mode is set. If so, it is considered that the minicomputer 104 may automatically set the mode by the default setting. It also prevents unauthorized setting when the operator has to set the condition file himself.

For example, by inputting to the minicomputer 104 from the keyboard section 116C, the storage device 12
The automatic mode setting function selected when the above-mentioned condition file is created in 0 may be added to the minicomputer.

Explaining a specific example, the exposure time (Ex
posure Time), focus offset (Focus Offse
t), Rotation, Orthogona
lity), scaling (Scaling), offset (Offs
If the automatic mode setting function is added to the six numerical parameters of (et), and the automatic mode creation is selected by the input means such as the mouse during the creation of the condition file, for example, as shown in FIG. The screen is displayed on the monitor color display 112. In this case, for example, the exposure time is known to some extent due to its nature, and it is considered that the numerical parameters should be within a certain range centered on the optimum value for each operator, so the recommended mode is recommended. Mode 1 is set by default. Further, since it is considered that the rotation, the orthogonality, and the offset must be within a limited absolute value range centered on zero, the recommended mode is the mode 2 set by default. Due to the nature of Focus Offset and Scaling, it is possible to obtain appropriate values by measurement beforehand, and since it must be a constant value, the default mode, Mode 3, is set as the recommended mode. ing.

The default settings are stored in the storage device 120 in the form of a table, read into the internal memory by the processor of the minicomputer 104 and used as screen display information when the automatic mode setting is selected. To be

When the screen for automatic mode setting as shown in FIG. 6 is displayed, the staff inputs the numerical value in the shaded area (shaded area) in the figure and the value is used as the limit value for each mode. Then, the limit range of each mode is determined as described above, and as a result, the same mode and limit range setting as in FIG. 4 is set in the predetermined area (determination condition designating means and limit range setting means) in the storage device 120. Equivalent) is done.

In this case, the staff can complete the advance preparation by only looking at the display and inputting the limit value according to each mode, so that it is possible to improve the operability and to do so. It is particularly suitable when an operator who does not have accurate knowledge about the properties of each numerical parameter has to create a condition file.

It is also possible to create software for selecting the automatic mode setting and the manual mode setting for each parameter.

As is apparent from the above description, in the above embodiment, the determining means and the mode automatic setting means are realized by the function of the minicomputer 106, and the recording device 12
The predetermined area of 0 constitutes the judgment condition designating means and the limit range setting means.

In setting the limit values for mode 1 and mode 2 in the above embodiment, the absolute values of limit value 1 and limit value 2 may be the same as illustrated in the embodiment, or may be different. Good. Further, the limit value in each mode may be set independently for each mode, or may be set again by sharing the same storage location and changing the mode. Limit value 1 and limit value 2
Limit value 3 and limit value 4
It is also possible to set it in two sections to which is added and a plurality of sections to which a plurality of limit values are further added.

Further, in the above embodiment, if only parameters relating to the exposure amount and the focus position are taken as the parameters for judging the validity, these parameters often need to be changed in practice (in other words, these parameters are Due to its nature, the necessity of correctness judgment is high), so that the software configuration can be simplified and the correctness judgment can be performed efficiently.

Further, according to the basic principle adopted in the above-mentioned embodiment, the present invention can be applied to the judgment of validity of not only numerical parameters but also character parameters.

Note that the above-mentioned validity judgment is performed only when the operator uses it, and when the engineer uses it, it is considered that there is almost no probability of an input error, so the validity check should not be performed. You may

[0121]

As described above, according to the present invention,
By setting the mode, it is possible to check the legitimacy of numerical parameters with different criteria, and it is possible to make appropriate legitimacy judgments according to the characteristics of numerical parameters. It is possible to provide an erroneous input, thereby effectively preventing an input error and suppressing a loss due to an input error, and thus improving the productivity of the device, which is an unprecedented excellent effect. There is.

In particular, according to the second aspect of the invention, the numerical parameter is automatically set to the preset unique value only by presetting the third mode in the determination condition designating means as the determination condition of the certain numerical parameter. Since it is updated to, the re-entry itself for changing the numerical parameter becomes unnecessary, and the input time can be shortened and the mistake itself due to the input can be prevented.

Further, according to the invention described in claim 5, the judgment of the correctness can be made in an appropriate mode for each numerical parameter without setting the mode of the judgment condition designating means unless particularly desired. Done.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an overall configuration of a projection exposure apparatus according to an embodiment.

FIG. 2 is a block diagram showing an internal configuration of the apparatus shown in FIG.

FIG. 3 is a diagram showing an example of a parameter display screen on a color display.

FIG. 4 is a table showing an example of a predetermined area (corresponding to a judgment condition designating unit and a limit value setting unit) of a storage device in which a mode and a limit value are set for each parameter.

FIG. 5 is a flowchart showing a validity determination processing algorithm of a minicomputer according to an embodiment.

FIG. 6 is a diagram showing an example of an automatic mode setting screen.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 10 Projection exposure apparatus (lithography apparatus) 12 Main system (projection exposure system) 14 Control rack (control system) 106 Minicomputer (determination means, mode automatic setting means) 116C Keyboard unit (input means) 120 Recording device (storage means, determination) Condition specifying means, limit range setting means) R reticle (mask) W wafer (photosensitive substrate) PL projection optical system

Claims (5)

[Claims] 1. Projection exposure for projecting a pattern formed on any surface of a mask onto a photosensitive substrate through a projection optical system in a predetermined image formation state, and exposing the pattern image on the photosensitive substrate with a predetermined exposure amount. A lithographic apparatus comprising a system and a control system for comprehensively controlling the operation of each part of the projection exposure system, wherein a series of operation procedures of each part of the projection exposure system are stored in advance as an exposure processing program. A storage unit, an input unit for selecting various parameters necessary for executing the exposure processing program and inputting data thereof, and a condition for judging the validity of a numerical parameter among the various parameters, as the control system in advance. The first mode in which a certain width range centered on the set value set within is a limit range, and the second mode in which an absolute width range is a limit range Judgment condition designating means capable of individually setting one of the numerical parameters for each of the numerical parameters, and a limiting range capable of presetting the limiting range of the mode for each of the numerical parameters for which the mode is set. A parameter is selected by the setting means and the input means, and each time the data is input, it is input with the limit range set in the limit range setting means as a reference according to the mode set in the determination condition specifying means. A lithographic apparatus having a determination unit for determining the validity of data. 2. A third mode which does not require the validity determination can be further set in the determination condition designating means, and
When the third mode is set, the determination means is
The lithographic apparatus according to claim 1, wherein the numerical parameter for which the third mode is set is updated to a preset eigenvalue of the numerical parameter. 3. The determination condition designating means can further set a fourth mode as a validity determination condition, and the determination means can set the fourth mode when the fourth mode is set. 3. The lithographic apparatus according to claim 1, wherein when the data input as the parameter data for which the mode 4 is set is a numerical value, it is determined to be valid. 4. The lithographic apparatus according to claim 1, wherein the parameters to be subjected to the validity determination are limited to specific numerical parameters with high necessity of the validity determination. 5. A mode automatic setting means for automatically setting a mode preset for each selected numerical parameter as a mode suitable for judging the correctness of each numerical parameter is attached to the judging condition designating means. A lithographic apparatus according to claim 1 or 2, characterized in that