JP2006128447A - Substrate processing apparatus, substrate processing method, and information managing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus, a substrate processing method, and an information managing method which facilitate management of log information recorded in the substrate processing apparatus. <P>SOLUTION: Pieces of log information on substrate processing recorded by each unit of the substrate processing apparatus are interlinked by recording the name of a file in which each piece of log information is recorded, or an identification information (link ID) defined exclusively in the file. When a piece of log information recorded in a file is displayed on a display device, link IDs (LN 1, LN 2, LN 11, LN 12) are displayed together with pieces of log information. Selection of any one of the displayed link IDs by an operator calls for a piece of log information linked to the selected link ID, which is then displayed in a form corresponding to the type of the log information. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus and method for processing a substrate, and an information management method for managing log information recorded in the substrate processing apparatus.

  A semiconductor element, a liquid crystal display element, an imaging element, a thin film magnetic head, and other devices are manufactured by performing various processes on a substrate using a substrate processing apparatus. The processing performed on the substrate by the substrate processing apparatus includes, for example, a coating process in which a photosensitive agent such as a photoresist is applied, an exposure process in which an image of a mask pattern is projected and exposed on the substrate coated with the photosensitive agent, and an exposure process. Development processing for developing the applied substrate. The exposure process is performed by an exposure apparatus provided in the substrate processing apparatus, and the coating process and the developing process are performed by a coating and developing apparatus called a coater / developer that is in-line with the exposure apparatus.

  The above substrate processing apparatus records information indicating the transition of the substrate processing, information regarding the contents of the executed substrate processing, and measurement information indicating measurement results of various measurements performed during the substrate processing as log information. This log information is used to investigate the cause of the trouble when a trouble occurs in the substrate processing apparatus. Once the cause of the trouble has been investigated, preventive measures can be taken so that the trouble does not recur in the substrate processing equipment, and further improvements have been made to improve the performance so that the trouble does not occur. Since the device can be developed, log information is extremely useful information.

For example, the following Patent Documents 1 to 3 are used for data management methods used in an exposure apparatus that is a type of conventional substrate processing apparatus. See Patent Documents 4 and 5, respectively.
JP-A-7-130607 JP-A-9-45599 Japanese Patent No. 3514414 JP 2000-215701 A JP-A-10-149380

  In recent years, in order to increase device manufacturing efficiency, it has been required to improve the throughput, that is, the number of substrates that can be processed per unit time. In recent years, since the pattern that is exposed and transferred to the substrate by the exposure apparatus has been miniaturized, it is necessary to improve the exposure accuracy (resolution, transfer fidelity, overlay accuracy, etc.). In order to achieve such high throughput and high accuracy, it is necessary to improve the performance of the substrate processing apparatus, but the amount of log information is increasing as the apparatus performance improves.

  In the conventional substrate processing apparatus, since each log information is individually recorded in a plurality of files for each program for controlling the operation of the substrate processing apparatus and for each apparatus part (unit) of the substrate processing apparatus, there is a problem. When it occurs or when the accuracy of the substrate processing apparatus is evaluated, analysis of the log information and management of the log information require a lot of labor and time, and there is a problem that the efficiency is extremely low. Here, a method of collecting log information recorded in each unit of the substrate processing apparatus and collectively storing it in a file has been adopted, but it takes communication time to collect log information from each unit. There is a risk that the throughput may be reduced. Further, when the collected log information is configured to be recorded in a concentrated manner, the operation of the substrate processing apparatus may stop if the recording capacity is insufficient.

  The present invention has been made in view of the above circumstances, and an object thereof is to provide a substrate processing apparatus and method and an information management method capable of easily managing log information recorded by the substrate processing apparatus.

The present invention adopts the following configuration corresponding to each diagram shown in the embodiment. However, the reference numerals with parentheses attached to each element are merely examples of the element and do not limit each element.
In order to solve the above-mentioned problems, the substrate processing apparatus of the present invention is a substrate processing apparatus comprising recording units (70, 74) for recording log information related to substrate processing in log files (LF1 to LF5). The identification information uniquely determined is recorded in the file name of the log file to associate the contents between the log files.
According to the present invention, the identification information uniquely determined in the file name of the file in which the log information is recorded is recorded, and the contents of the log files are correlated.
In the substrate processing apparatus of the present invention, in the substrate processing apparatus provided with recording units (70, 74) for recording log information related to substrate processing in the log files (LF1 to LF5), the recording unit is uniquely determined identification information. Is recorded in the log file, and the contents of the log file are correlated.
According to this invention, identification information uniquely determined in a file in which log information is recorded is recorded, and the contents of the log file are associated.
Furthermore, the substrate processing apparatus of the present invention includes a higher order processing unit (70, UC) positioned at a higher level and a lower level processing unit (31, 37, 44, 46, 66, 69) positioned at a lower level, In the substrate processing apparatus that performs substrate processing in cooperation with the processing unit and the lower processing unit, the upper recording unit (70) that records log information about processing performed in the upper processing unit in the first log file (LF1, LF2) ) And a lower recording unit (74) for recording log information related to processing performed in the lower processing unit in the second log file (LF3 to LF5), and between the upper recording unit and the lower recording unit It is characterized by associating the contents between the first log file and the second log file while determining uniquely determined identification information.
According to the present invention, when log information related to processing performed in the upper processing unit is recorded in the first log file and log information related to processing performed in the lower processing unit is recorded in the second log file, Identification information uniquely determined with the lower-level recording unit is determined, and the contents of the first log file and the second log file are associated with each other.
In order to solve the above problems, an information management method of the present invention is a unique information management method for managing log information related to substrate processing recorded in log files (LF1 to LF5) in a substrate processing apparatus for processing a substrate. The identification information to be determined is recorded in the file name of the log file to associate the contents between the log files.
The information management method of the present invention is an information management method for managing log information related to substrate processing recorded in log files (LF1 to LF5) in a substrate processing apparatus for processing a substrate. It is characterized by recording in a file and associating the contents of the log file.
In order to solve the above problems, the substrate processing method of the present invention is a substrate processing method for processing a substrate in cooperation with two or more apparatuses (31, 37, 44, 46, 66, 69, 70, UC). The two devices have information for associating each other's data so that the other is called by selecting one of the two data that are related to each other among the data generated by each of the two devices. It is characterized by including a step of automatically adding and recording data when generating data.
According to the present invention, information for associating data with each other is generated so that data generated on the other side is called by selecting data generated on one side of two or more devices. Is automatically added and recorded.

  According to the present invention, there is an effect that log information recorded by the substrate processing apparatus can be easily related.

  Hereinafter, a substrate processing apparatus and method and an information management method according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a top view showing a schematic configuration of a substrate processing apparatus according to an embodiment of the present invention. As shown in FIG. 1, the substrate processing apparatus of the present embodiment includes an exposure apparatus 50, a coater / developer unit 51 arranged so as to be in-line contact with a chamber surrounding the exposure apparatus 50, an exposure apparatus 50, and a coater- And a host computer 47 that controls the overall operation of the developer unit 51.

  In the coater / developer unit 51, a transfer line 52 for transferring a wafer as a substrate is disposed so as to cross the central portion, and a wafer carrier 53 for storing a large number of unexposed wafers at one end of the transfer line 52; A wafer carrier 60 for storing a number of wafers that have been subjected to exposure processing and development processing is disposed, and the other end of the transfer line 52 is installed immediately before a transfer port (not shown) with a shutter on the side surface of the chamber of the exposure apparatus 50. Has been.

  In addition, a coater unit 61 is provided along one side surface of the transport line 52 in the coater / developer unit 51, and a developer unit 62 is provided along the other side surface. The coater unit 61 includes a resist coater 54 for applying a photoresist to the wafer from the wafer carrier 53 to the exposure apparatus 50, a pre-baking device 55 including a hot plate for pre-baking the photoresist on the wafer, and a pre-baking process. A cooling device 56 for cooling the wafer is installed. The developer unit 62 is provided with post-paque devices 57 and PEB for baking the photoresist on the wafer after the exposure processing from the exposure device 50 toward the wafer carrier 60, that is, for performing so-called PEB (Post-Exposure Bake). A cooling device 58 for cooling the broken wafer and a developing device 59 for developing the photoresist on the wafer are installed.

  In the exposure apparatus 50 of the present embodiment, the wafer W that is the exposure image is held on the wafer stage 37 via the wafer holder 36, and the wafer stage 37 moves two-dimensionally on the wafer base 38 (see FIG. 2). . A first guide member 64 is disposed so as to extend substantially along an extension line of the central axis of the transport line 52, and a slider 65 is disposed along the first guide member 64 so as to be driven by a linear motor (not shown). A first arm 66 is provided on the slider 65 to hold the wafer in a rotatable and vertically movable manner.

  Further, a second guide member 68 is disposed so as to be orthogonal to the upper part of the end portion of the first guide member 64, and the wafer is held so as to be driven by a linear motor (not shown) along the second guide member 68. A second arm 69 is disposed. The second guide member 68 extends to the wafer loading position of the wafer stage 37, and the second arm 69 is also provided with a mechanism that slides in a direction orthogonal to the second guide member 68. In addition, transfer pins 67 that can be rotated and moved up and down to perform pre-alignment of the wafer are installed in the vicinity of the position where the first guide member 64 and the second guide member 68 intersect, and the wafer is placed around the transfer pins 67. A position detection device (not shown) for detecting the positions of the cutout portion (notch portion) on the outer peripheral portion and the two edge portions is provided. A wafer loader system is constituted by the first guide member 64, the slider 65, the first arm 66, the transfer pin 67, the second guide member 68, the second arm 69, and the like.

  Next, the exposure apparatus 50 will be described in detail. FIG. 2 is a view showing an outline of the overall configuration of the exposure apparatus 50. The exposure apparatus 50 shown in FIG. 2 moves the pattern formed on the reticle R to the wafer W while moving the reticle R as a mask and the wafer W as a substrate relative to the projection optical system PL in FIG. Is a step-and-scan exposure apparatus that manufactures a semiconductor element by sequentially transferring to a semiconductor device. In the following description, an XYZ orthogonal coordinate system is set in the drawing, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The XYZ orthogonal coordinate system shown in FIG. 2 is set so that the X axis and the Y axis are parallel to the wafer W, and the Z axis is set in a direction orthogonal to the wafer W. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z-axis is set vertically upward. In this embodiment, the direction in which the reticle R and the wafer W are moved synchronously (scanning direction SD) is set in the Y direction.

  In FIG. 2, reference numeral 1 denotes an exposure light source that emits exposure light IL that is a parallel light beam having a substantially rectangular cross section, for example, an ArF excimer laser light source (wavelength 193 nm). Exposure light IL comprising an ultraviolet pulse with a wavelength of 193 nm from the exposure light source 1 passes through a beam matching unit (BMU) 2 and enters a variable dimmer 3 as an optical attenuator. The main control system 24 controls the start and stop of light emission of the exposure light source 1 and the output (oscillation frequency, pulse energy, number of pulses). Further, the main control system 24 adjusts the dimming rate in the variable dimmer 3 stepwise or continuously.

  The exposure light IL passing through the variable dimmer 3 enters a first fly-eye lens 6 as a first-stage optical integrator (a homogenizer or a homogenizer) through a beam shaping system 5 including lens systems 4a and 4b. To do. The exposure light IL emitted from the first fly-eye lens 6 passes through the first lens system 7a, the optical path bending mirror 8, and the second lens system 7b, and the second fly as a second stage optical integrator. The light enters the eye lens 9. The exit surface of the second fly-eye lens 9, that is, the optical Fourier transform surface (the pupil plane of the illumination system and the optical plane conjugate with the pupil plane of the projection optical system PL) with respect to the pattern surface of the reticle R has a plurality of apertures. An aperture stop plate 10 having a stop is rotatably arranged by a drive motor 10e. The aperture stop plate 10 is connected to the rotation shaft of the drive motor 10e, and the aperture stop disposed on the exit surface of the second fly-eye lens 9 is switched by driving the drive motor 10e to rotate the aperture stop plate 10. be able to. The drive of the drive motor 10e is controlled by a main control system 24 that controls the overall operation of the exposure apparatus 50.

  In FIG. 2, the exposure light IL that has been emitted from the second fly-eye lens 9 and passed through one of the aperture stops formed on the aperture stop plate 10 is incident on the beam splitter 11 having a high transmittance and a low reflectivity. The exposure light reflected by the beam splitter 11 enters an integrator sensor 22 composed of a photoelectric detector via a condensing lens 21. The detection signal of the integrator sensor 22 is supplied to the main control system 24. The relationship between the detection signal of the integrator sensor 22 and the illuminance of the exposure light IL on the wafer W is measured in advance with high accuracy and stored in a storage unit (not shown) in the main control system 24. The main control system 24 controls the exposure amount for the wafer W based on the detection signal of the integrator sensor 22.

  The exposure light IL transmitted through the beam splitter 11 sequentially enters the fixed blind (fixed illumination field stop) 14 and the movable blind (movable illumination field stop) 15 through the lens systems 12 and 13 along the optical axis IAX. The fixed blind 14 has a linear slit-shaped or rectangular (hereinafter collectively referred to as “slit-shaped”) illumination field extending in a direction orthogonal to the scanning direction SD at the center in a circular field of the projection optical system PL described later. It has an opening to be formed. The movable blind 15 is configured to be movable in a plane orthogonal to the optical axis IAX, and prevents unnecessary exposure at the start and end of scanning exposure on each shot area on the wafer W or illumination. This is used to make the width of the visual field region in the scanning direction SD variable. The movable blind 15 is used to change the pattern area of the reticle R transferred to the wafer W.

  The fixed blind 14 is disposed on a surface defocused by a predetermined amount in the optical axis IAX direction from the conjugate surface with respect to the surface on which the pattern of the reticle R is formed (hereinafter referred to as the reticle surface). In this way, the fixed blind 14 is defocused and arranged in order to prevent variations in the exposure amount (DOSE amount) at an arbitrary point on the wafer W in order to prevent the exposure light IL irradiated on the wafer W from being irradiated. This is because the illuminance distribution in the scanning direction SD is trapezoidal. The exposure light IL that has passed through the movable blind 15 during exposure passes through a mirror 17 for bending an optical path, an imaging lens system 18, a condenser lens 19, and a main condenser lens system 20 in this order, and a pattern of a reticle R as a mask. The illumination field (illumination field area) IA of the surface (lower surface) is illuminated. The exposure light source 1 to the main condenser lens system 20 described above constitute an illumination optical system IS.

Under the exposure light IL, the image of the circuit pattern in the illumination field IA of the reticle R passes through the bilateral telecentric projection optical system PL at a predetermined projection magnification β (β is, for example, 1/4 or 1/5). Then, the image is transferred to a slit-like exposure field EA on the wafer W as a substrate disposed on the image plane of the projection optical system PL. The projection optical system PL may be one-side telecentric. Although the projection optical system PL of the present embodiment is a dioptric system (refractive system), it goes without saying that a catadioptric system (catadioptric system) and a reflective system can also be used. Further, as the glass material of the refractive member constituting the projection optical system PL, for example, synthetic quartz or fluorite (calcium fluoride: CaF ₂ ) is used.

  In FIG. 2, a reticle R is attracted and held on a reticle stage 31, and the reticle stage 31 can move at a constant speed in the Y direction on the reticle base 32, and can also move slightly in the X direction, with the Z axis as the center. It is placed so that it can also be rotated. A movable mirror 33 is attached to one end of the reticle stage 31, and a laser interferometer 34 is provided facing the mirror surface of the movable mirror 33. Although the illustration is simplified in FIG. 2, the movable mirror 33 includes a movable mirror having a mirror surface perpendicular to the X axis and a movable mirror having a mirror surface perpendicular to the Y axis.

  The laser interferometer 34 also includes two Y-axis laser interferometers that irradiate the moving mirror 33 with laser light along the Y axis and an X-axis laser that irradiates the moving mirror 33 with laser light along the X axis. The X and Y coordinates of the reticle stage 31 are measured by one laser interferometer for the Y axis and one laser interferometer for the X axis. Further, the rotation angle around the Z axis of the reticle stage 31 is measured by the difference between the measurement values of the two laser interferometers for the Y axis. Information on the X coordinate, the Y coordinate, and the rotation angle of the reticle stage 31 detected by the laser interferometer 34 is supplied to the main control system 24. The main control system 24 controls the positioning operation of the reticle stage 31 while monitoring the supplied stage position information.

  On the other hand, the wafer W is sucked and held on a wafer stage 37 as a substrate stage via a wafer holder 36, and the wafer stage 37 is 2 on the wafer base 38 along the XY plane parallel to the image plane of the projection optical system PL. Move dimension. That is, the wafer stage 37 moves on the wafer base 38 in the Y direction at a constant speed and also moves stepwise in the X direction and the Y direction. Further, the wafer stage 37 incorporates a Z leveling mechanism for controlling the position of the wafer W in the Z direction (focus position) and the tilt angles around the X axis and the Y axis.

  A movable mirror 39 is attached to one end of the wafer stage 37, and a laser interferometer 40 is provided facing the mirror surface of the movable mirror 39. Although the illustration is simplified in FIG. 2, the movable mirror 39 includes a movable mirror having a mirror surface perpendicular to the X axis and a movable mirror having a mirror surface perpendicular to the Y axis. The laser interferometer 40 includes two Y-axis laser interferometers that irradiate the moving mirror 39 with a laser beam along the Y-axis and an X-axis laser that irradiates the movable mirror 39 with a laser beam along the X-axis. The X and Y coordinates of the wafer stage 37 are measured by one laser interferometer for the Y axis and one laser interferometer for the X axis. Further, the rotation angle of the wafer stage 37 is measured by the difference between the measurement values of the two Y-axis laser interferometers. Information on the X coordinate, Y coordinate, and rotation angle of the wafer stage 37 measured by the laser interferometer 40 is supplied to the main control system 24. The main control system 24 controls the positioning operation of the wafer stage 37 while monitoring the supplied stage position information.

  A reference member 45 that determines the reference position of the wafer stage 37 is provided at one end on the wafer stage 37. The reference member 45 is used to measure the relative position and baseline of the reticle R with respect to the coordinate system of the wafer stage 37. Here, the base line means, for example, the distance between the center position of the projection image of the pattern formed on the reticle R by the projection optical system PL and the center of the measurement visual field of the wafer alignment sensor 44 described later. The reference member 45 has, as reference marks, slit patterns composed of, for example, five light-transmitting L-shaped patterns, and two reference patterns formed of light-reflective chrome (the duty ratio is 1: 1). And are provided.

  In the present embodiment, the imaging light beam for forming a pinhole or slit-shaped image toward the imaging surface of the projection optical system PL is obliquely oriented with respect to the optical axis AX of the projection optical system PL. An oblique incidence type focal position detection system 43 is provided which includes an irradiation optical system 43a to be supplied and a light receiving optical system 43b for receiving a reflected light beam of the imaging light beam on the surface of the wafer W. By this focal position detection system 43, the position of the wafer W surface in the Z direction with respect to the imaging plane can be detected and the in-focus state between the wafer W and the projection optical system PL can be detected.

  Further, the exposure apparatus of this embodiment includes an off-axis type wafer alignment sensor 44 on the side of the projection optical system PL. The wafer alignment sensor 44 is an FIA (Field Image Alignment) type alignment sensor. The wafer alignment sensor 44 irradiates, for example, a wide-band wavelength light beam emitted from a halogen lamp onto the wafer W as a detection beam, and images reflected light obtained from the wafer W with an imaging element such as a CCD (Charge Coupled Device). Then, position information in the X direction and the Y direction of the mark (alignment mark) formed on the wafer W is measured by performing image processing on the obtained image signal. The measurement result of the wafer alignment sensor 44 is supplied to the main control system 24.

  Furthermore, the exposure apparatus of this embodiment includes a reticle alignment sensor 46 disposed above the reticle stage 31. The reticle alignment sensor 46 simultaneously observes a position detection reticle mark formed in the vicinity of the outer periphery of the reticle R and a reference member 45 formed on the wafer stage 37 via the projection optical system PL. And directly measures (observes) the relative positional relationship between the wafer stage 37 and the wafer stage 37.

  The measurement result of the reticle / alignment sensor 46 is output to the main control system 24 and subjected to processing such as image processing, arithmetic processing, filtering processing, and the like, and a relative positional deviation amount between the reticle R and the wafer stage 37 is obtained. The main control system 24 finely moves the reticle stage 31 in accordance with the amount of positional deviation, and performs relative positioning (alignment) between the reticle R and the wafer stage 37. The reticle alignment sensor 46 is a TTR (through the reticle) type alignment sensor which is a kind of TTL (through the lens) type alignment sensor.

  The main control system 24 described above is connected to the host computer 47 and controls each part of the exposure apparatus 50 in accordance with a job as a unit instruction command from the host computer 47. The above-mentioned job is a unit of a series of processes from the start of the exposure process to the output of a signal indicating the end of the lot process from the coater / developer 51. The main control system 24 is connected to a device terminal 48 including a pointing device such as a keyboard and a mouse and a display device. The device terminal 48 is used for inputting various commands to the main control system 24 according to the operation content of the operator or service person.

  Next, the configuration of the main control system 24 will be described. FIG. 3 is a block diagram showing a schematic configuration of the main control system 24. As shown in FIG. 3, the main control system 24 includes a main processor 70, a unit controller UC that controls various processing devices (units) under the control of the main processor 70, and a log server unit 74. ing. These cooperate with each other to perform exposure processing.

  The main processor 70 comprehensively controls the exposure apparatus 50 according to the job output from the host computer 47. Further, information indicating the transition of the exposure process (sequence log) is recorded as a sequence log file LF1, and information relating to the content of the executed exposure process is recorded as a process content file LF2. Note that the sequence log recorded in the sequence log file LF1 is log information output from the main processor 70, but information relating to the content of exposure processing recorded in the processing content file LF2 is transferred from the unit controller UC to the main processor 70. This is log information to be output. Further, when the operator operates the device terminal 48, the main processor 70 controls the display content on the display device provided in the device terminal 48 according to the operation content.

  The unit controller UC includes a stage controller 71, an alignment controller 72, a wafer loader controller 73, and the like. The stage controller 71 controls operations of the reticle stage 31 and the wafer stage 37. Specifically, the positioning operation of the reticle stage 31 is controlled with reference to the position information of the reticle stage 31 detected by the laser interferometer 34. Further, the positioning operation of the wafer stage 37 is controlled while referring to the position information of the wafer stage 37 detected by the laser interferometer 40.

  The alignment controller 72 controls the reticle alignment sensor 46 and the wafer alignment sensor 44. The control performed by the alignment controller 72 includes, for example, control for moving the reticle alignment sensor 46 to the measurement position, control for starting the emission of the detection beam from the wafer alignment sensor 44, and the detected signal in accordance with a predetermined algorithm. Control to be processed. Further, the wafer loader controller 73 carries in (loads) the wafer W onto the wafer stage 36 and unloads the wafer W held on the wafer stage 36. Control the behavior. These unit controllers UC control various units in accordance with control commands output from the main processor 70.

  The log server unit 74 records various log information output from each unit. The log information recorded in the log server 74 includes, for example, trace data indicating a synchronization accuracy error between the reticle stage 31 and the wafer stage 36 at the time of scanning exposure, a focus control error, a leveling (attitude of the wafer W) control error, and the like. Waveform data (for example, alignment waveform data), optical characteristic fluctuation data indicating fluctuations in the optical characteristics of the projection optical system PL, and the like. The trace data, waveform data, and optical characteristic variation data are recorded in the trace log file LF3, the waveform log file LF4, and the optical characteristic variation log file LF5. Here, in order to facilitate understanding, a case where each of trace data, waveform data, and optical characteristic variation data is recorded in one file will be described as an example. Accordingly, it may be recorded in a different file, or may be recorded in a different file at each time when data is obtained.

  The trace data is obtained from the detection results of the laser interferometer 34 provided on the reticle stage 31, the laser interferometer 40 provided on the wafer stage 37, and the focal position detection system 43, and various waveform data are obtained from the reticle alignment. It is obtained from the measurement results of the sensor 46 and the wafer alignment sensor 44. Optical characteristic variation data is obtained from a lens control unit (not shown). Here, since the above trace data, waveform data, and optical characteristic variation data have a large data amount, they are recorded in a dedicated log server unit 74 having a large recording capacity. On the other hand, the sequence log file LF1 and the processing content file LF2, which are a kind of log information described above, have a small capacity and a high frequency of reference, and therefore a recording device provided in the main processor 70 (the recording capacity is smaller than that of the log server 74). ) Is recorded.

  As described above, in the present embodiment, the main processor 70 provided in the main control system 24 records the sequence log in the sequence log file LF1, and records information on the content of the exposure process in the process content file LF2, and the log server 74. Trace data, waveform data, and optical characteristic variation data are recorded in a trace log file LF3, a waveform log file LF4, and an optical property variation log file LF5, respectively. Here, when the main processor 70 and the log server 74 record the respective log information, the log information is recorded while being associated with each other. Note that which log information is associated is preset in a program provided in the main processor 70. For example, this program is set to associate the necessary log information based on the past empirical rules of those who perform maintenance of the substrate processing apparatus.

  Here, the main processor 70 and the log server 74 use identification information uniquely determined in order to associate log information. Since exposure information is generated in time series in the exposure apparatus 50, it is preferable to use it for identification information including information indicating time. For example, a clock common to each of the main processor 70 and the log server 74 is provided, or the clock provided in the main processor 70 and the clock provided in the log server 74 are timed. The log information is associated using identification information including the time when the log information is generated or when the log information is associated.

  The identification information is preferably used for identification information including information indicating time and information indicating the type of log information. Furthermore, instead of using information indicating time, information indicating the progress of substrate processing (exposure processing) may be used. Here, as information indicating the progress of the substrate processing, for example, information indicating the job being executed, information indicating the lot, information indicating the reticle R used in the exposure processing, and the wafer W performing the exposure processing , Information indicating a shot region on which exposure processing is performed, information indicating an alignment mark being measured among alignment marks formed on the wafer, and the like can be used.

  Here, the state in which log information is associated can be referred to other log information (may be a plurality of log information) from one log information using identification information by a simple operation such as an operator (calling) It is not always necessary that one log information and the other log information can be referred to each other. Of course, both log information may be in a state where they can be referred to each other. In this embodiment, it is possible to refer to information regarding the content of the exposure process recorded in the processing content file LF2 from the sequence log recorded in the sequence log file LF1 using the identification information, and from the sequence log using the identification information. Trace data, waveform data, and optical characteristic fluctuation data recorded in the trace log file LF3, waveform log file LF4, or optical characteristic fluctuation log file LF5 can be referred to. Further, the identification information is used to store the processing content file LF2. Take as an example a case where log information is associated with a state in which trace data, waveform data, and optical characteristic variation data can be referred to from the recorded information relating to the content of exposure processing (when reference in the reverse direction is impossible) explain.

  In the above example, the sequence log output from the main processor 70 positioned at the upper level and the information related to the content of the exposure process output from the unit controller UC positioned at the middle level are associated with each other. In addition, the sequence log is associated with data such as trace data, waveform data, and optical characteristic variation data output from each unit positioned below. Furthermore, information on the content of the exposure process output from the unit controller UC positioned at the middle level is associated with data such as trace data, waveform data, and optical characteristic variation data. Thus, in this embodiment, different types of log information are associated with each other.

  A specific method for associating log information is to record the identification information in the file name of one file in which the log information is recorded, and the same identification information as the identification information in the other file in which the log information is recorded. There is a way to record. For example, in the above example, when associating the sequence log with information related to the content of the exposure process, specific identification information is recorded in the file name of the processing content file LF2, and the specific identification information is stored in the sequence log file LF1. Record. By performing such recording, if the processing content file LF2 in which the identification information is recorded as a file name is searched based on the identification information recorded in the sequence log file LF1, the exposure processing recorded in the processing content file LF2 It is possible to refer to information on the contents of This method is suitable when the number of files for recording log information is small and the operator wants to easily determine the association from the file name.

  Also, log information can be associated only by a method of recording identification information in a file. For example, if the sequence log and information related to the content of the exposure process are recorded in the same file, the identification information is recorded in the portion of the file where the sequence log is recorded, and the content of the exposure process in the file The same identification information as the identification information is recorded in the portion where the information is recorded. By performing such recording, it is possible to refer to the sequence log and the information related to the content of the exposure process in the file. For example, when a sequence log and information related to the contents of exposure processing are recorded in a plurality of locations in one file, each log information should be recorded in a format that makes the start / end of the log information clear. Only necessary portions can be associated, and a plurality of associations can be performed in one file by using mutually different identification information. This method is suitable for a case where various types of log information are recorded in one file.

  In order to perform the association described above, it is necessary that the identification information used at the reference source and the identification information used at the reference destination have a relationship that is uniquely obtained from each other. For example, the identification information used at the reference destination and the identification information used at the reference destination need to have a one-to-one correspondence. However, the identification information of the reference source and the identification information of the reference destination are not necessarily the same. For example, if the one-to-one correspondence between the identification information of the reference source and the identification information of the reference destination is clear, the identification information of the reference destination can be traced from the identification information of the reference source using the relationship. The identification information of the reference source may be different from the identification information of the reference destination.

  Since the identification information of the reference source and the identification information of the reference destination need to have the above relationship, when the main processor 70 records information on the content of the exposure processing in the processing content file LF2, and when the log server 74 stores the trace data When recording data such as waveform data and optical characteristic fluctuation data in a file such as the trace log file LF3, waveform log file LF4, or optical characteristic fluctuation log file LF5, the main processor 70 and the log server 74 A process of determining identification information that is uniquely determined is automatically performed. Then, the determined identification information is recorded as the file name of the file or added to the file for association.

  Some log information is added to one file at a predetermined time interval or at a predetermined time. When this log information is recorded, it is desirable to record the log information together with information indicating the time when the log information is recorded in the file. If such a recording method is used, necessary data can be easily collected by searching the file using the required time or the required period as a search condition. The outline of the log information association method has been described above, but a specific example of the log information association will be described later.

  Next, an example of a basic operation of the substrate processing apparatus in the lithography process will be described. In starting the processing for the wafer, the operator first operates the apparatus terminal 48 to set the type of log information to be associated, the log information storage unit, and the association method. For example, the operator designates EGA (enhanced global alignment) measurement results, alignment waveform data, focus trace data, and synchronization accuracy trace data as log information to be associated. Here, EGA is the positional information of alignment marks formed on each of a part of typical (3 to 9) shot areas preset on the wafer W and the design information thereof. This is a method for determining the regularity of the arrangement of all shot areas set on the wafer W by a statistical method.

  The EGA measurement result corresponds to information related to the contents of the exposure process, and the alignment waveform data, focus trace data, and synchronization accuracy trace data correspond to data output from each unit. In addition, when analyzing log information, the sequence log file LF1 is a file used as a basis for searching all log information, so that the operator does not perform any special operation on a daily or weekly basis. Or automatically generated during a preset period such as monthly.

  In addition, the operator designates the execution unit for the log information storage unit, for example, the EGA measurement result, the focus trace data, and the synchronization accuracy trace data, and the alignment waveform data for each alignment mark. Specify as. In addition, regarding the above association method, the operator has a method for determining uniquely identified identification information (hereinafter also referred to as a link ID) used for correlating log information, and a method for determining the file name of a file in which log information is recorded. specify. For example, the operator designates a method for setting the job sequence start date and time as a link ID, the file name includes a link ID, information indicating the type according to the type of log information, and information indicating the progress of exposure processing. To include.

  Specifically, the file name of the file in which the EGA measurement result is recorded includes a character string including information indicating the type of log information (for example, character string “EGA_”) and the start time of the job sequence. To be specified. The file name of the file in which the alignment waveform data is recorded includes information indicating the type of log information (for example, character string “SIG_”), alignment start date and time for each wafer W, wafer number, shot number, and alignment mark. Specify to include a character string consisting of the mark number. Furthermore, the file name of the file in which various trace data is recorded includes a character string including information indicating the type of log information (for example, character strings “FCSTRC_”, “SYNCTRC_”, etc.) and the start time of the job sequence. To be specified.

  When the above settings are completed, the operator operates the apparatus terminal 48 to select a job to be executed and starts the exposure process. When the start of the exposure process is instructed, the host computer 47 reads out the job file in which the job selected by the operator from the pre-recorded job files is recorded, and sends it to the exposure apparatus 50 and the coater / developer section 51. On the other hand, a job is output to the exposure apparatus 50. Here, the job file refers to wafer transfer processing, reticle transfer processing as a mask, alignment of wafer and reticle (alignment processing) in the exposure apparatus 50, exposure conditions, etc. in order to execute substrate processing. It is a file in which parameters for controlling various operations of each part of the substrate processing apparatus are set.

  Based on the job output from the host computer 47, one wafer taken out from the wafer carrier 53 is transferred to the resist coater 54 via the transfer line 52, and a photoresist is applied thereto. The wafer coated with the photoresist is sequentially transferred along the transfer line 52 to the first arm 66 of the exposure apparatus 50 through the pre-bake device 55 and the cooling device 56. Thereafter, when the slider 65 reaches the vicinity of the transfer pin 67 along the first guide member 64, the first arm 66 rotates, and the wafer coated with the photoresist is moved from the first arm 66 to the position on the transfer pin 67. Then, the center position and the rotation angle are adjusted (pre-alignment) based on the outer shape of the wafer. Thereafter, the wafer is transferred to the second arm 69 and conveyed along the second guide member 68 to the wafer loading position, where it is loaded onto the wafer holder 36 on the wafer stage 37. A predetermined reticle R is loaded on the reticle stage 31 along with the loading of the wafer.

  The main processor 70 of the main control system 24 provided in the exposure apparatus 50 shows the transition of processing in each part of the exposure apparatus 50 after the wafer W coated with the photoresist is transferred into the exposure apparatus 50. Information (sequence log) is recorded as a sequence log file LF1. FIG. 4 is a diagram showing an example of the recorded contents of the sequence log file LF1. As shown in FIG. 4, in the row L1 of the sequence log file LF1, a character string “JOB SEQUENCE START” representing the date and time when the job was started and that the job was started is recorded. In the example shown in FIG. 4, the job is started at 8:30:14 on September 1, 2004. Also, information (job ID) indicating the job to be executed is recorded in the row L2 of the sequence log file LF1. In the example shown in FIG. 4, a character string “JOB — 1234” is recorded as the job ID. Furthermore, a link ID related to the executed job is recorded in the row L3. The link ID in this row is related to the job (job1) being executed, and a character string “20040901083012” indicating the date and time when the job was started is recorded.

  In the line L4 to line L6 of the sequence log file LF1 shown in FIG. 4, file names of files for recording EGA measurement results, focus trace data, and synchronization accuracy trace data are recorded. In the example shown in FIG. 4, the character string “EGA_ <LINK_ID (job1)>. LOG” is recorded as the file name of the file that records the EGA measurement result, and the character string “is recorded as the file name of the file that records the focus trace data. FCSTRC_ <LINK_ID (job1)>. LOG ”is recorded, and the character string“ SYNCTRC_ <LINK_ID (job1)>. LOG ”is recorded as the file name of the file for recording the synchronization accuracy trace data. These character strings are not used as actual file names, but the actual file is the one obtained by replacing the partial character string <LINK_ID (job1)> in each character string with the link ID (20040901083012) recorded in the row L3. Used as a name. In a row L7 of the sequence log file LF1, a date and time when various processes for the wafer W are started, and a character string “WAFER START” indicating that the processes are started are recorded. In the example shown in FIG. 4, processing for the wafer is started at 8: 30: 2 on September 1, 2004. Further, in the three rows L8 following the row L7, the wafer number, carrier number, and slot number of the wafer W to be processed are recorded in order.

  When the loading of the wafer W and the reticle R is completed and the wafer W and the reticle R are respectively held on the wafer holder 36 and the reticle stage 31, the main control system 24 drives the wafer stage 37 to move the wafer W below the wafer alignment sensor 44 (− In the Z direction, the position of several representative alignment marks (about 3 to 9) on the wafer W is measured using the wafer alignment sensor 44. When the EGA measurement including the measurement of the alignment mark is started, the main processor 70 records the date and time when the alignment processing is started, the date and time when the alignment processing is completed, and the link ID related to the alignment processing in the sequence log file LF1.

  In the example shown in FIG. 4, the date (September 1, 2004), the time (8:30:23) of the alignment process, and the fact that the alignment process has started are displayed in line L9 following line L8. The character string “ALIGNMENT START” representing is recorded. In a line L10 subsequent to the line L9, a character string “20040901083023” indicating the date and time when the alignment process is started is recorded as a link ID related to the wafer W. Since the alignment process is normally performed only once for one wafer W, the link ID recorded here is set as that related to the wafer W (waf1).

  When the measurement of the representative alignment mark formed on the wafer W is finished, the alignment controller 72 in the main control system 24 uses the measurement result and the design value of each shot area recorded in advance to perform EGA calculation. To obtain array coordinates of all shot areas on the wafer W. When the alignment controller 72 finishes the EGA calculation, the measurement result and calculation result of each alignment mark are output to the main processor 70 as the EGA measurement result, and the main processor 70 records the measurement result in the processing content file LF2.

  FIG. 5 is a diagram illustrating an example of recorded contents of an EGA measurement result log file that is a type of the processing content file LF2. As shown in FIG. 5, the file name of the EGA measurement result log file recorded in the line L4 of the sequence log file LF1 is used. That is, the file name “EGA — 20040901083012.LOG” in which the character string including the character string “EGA_” and the link ID (20040901083012) indicating the start time of the job sequence is recorded is used. As a result, the sequence log file LF1 is associated with the EGA measurement result log file. As shown in FIG. 5, a link ID related to the wafer W, that is, a character string “20040901083023” indicating the date and time when the alignment process is started is recorded in the row L21 of the EGA measurement result log file. This link ID is the same as that recorded in the row L10 of the sequence log file LF1. Thereby, the line L10 of the sequence log file LF1 and the line L21 of the EGA measurement result log file are associated.

  In the line L22 following the line L21 of the EGA measurement result log file, the shot number of the shot area in the vicinity of the measured alignment mark, its design coordinates, and the measurement result (coordinate value of the alignment mark) are recorded. The shot number is composed of a column number (SHOT COLUMN) and a row number (SHOT ROW). In the alignment process, the alignment waveform data is output from the wafer alignment sensor 44 to the log server 74, and the log server 74 records this as a waveform log file LF4. Therefore, a link ID for associating the EGA measurement result log file and the waveform log file LF4 with respect to the alignment mark is recorded in a line L23 following the line L22 of the EGA measurement result log file.

  As a link ID related to the alignment mark, a character string “SIG_” indicating that it is the waveform log file LF4, an alignment start date / time for each wafer W, a wafer number, a shot number, and a mark number of the alignment mark “ SIG_20040901083023_001_007006_01 "is recorded. When another alignment mark is measured, the shot number of the shot area near the alignment mark and the measurement result are recorded in L24 following the row L23, and the link ID related to the alignment mark is recorded in the row L25. The Thereafter, the same recording is performed every time the alignment mark is measured. When the EGA measurement is completed, the date (September 1, 2004), the time (8:30:28, 68) of the alignment process (EGA measurement), and the alignment process are started in line L12 of the sequence log file LF1. A character string “ALIGNMENT END” indicating that it has been recorded is recorded.

  The coordinate value of the shot area on the wafer W obtained by the above EGA calculation is the baseline amount (the distance between the projection center of the projection image via the projection optical system PL and the measurement field center of the wafer alignment sensor 44). If the corrected coordinate value is obtained and the wafer stage 37 is driven using the corrected coordinate value, each shot area on the wafer W can be aligned with the exposure area of the projection optical system PL. Since the exposure apparatus 50 of the present embodiment is a step-and-scan exposure apparatus, when exposing a shot area, the reticle stage 31 and the wafer stage 37 are moved to the operation start position and then accelerated. After reaching a predetermined speed and being synchronized, the exposure light IL is emitted from the exposure light source 1 to illuminate the reticle R, and the pattern image of the reticle R is projected onto the wafer W via the projection optical system PL. Project to. During scanning, a part of the pattern image of the reticle R is projected onto the exposure area, and the wafer is synchronized with the movement of the reticle R in the −X direction (or + X direction) at the speed V with respect to the projection optical system PL. As W moves in the + X direction (or -X direction) at a speed β · V (β is the projection magnification), the pattern of the reticle R is sequentially transferred to the shot area.

  When the exposure of one shot area is started, the sequence log file LF1 contains the date “SHOT EXPOSURE START” indicating the date and time when the exposure process for the first shot area is started and the start of the process. "Is recorded. In the example shown in FIG. 4, September 1, 2004 is recorded as the date when the exposure processing for the shot is started in the row L12 following the row L11, and the time when the exposure processing is started is 8:30:30 Is recorded. Further, in a row L13 subsequent to this row L12, the shot number, the column number and the row number of the exposure process are recorded.

  At the time of exposure, focus trace data is created in the log server 74 from the detection result output from the laser interferometer 40 provided on the wafer stage 37 and the detection result output from the focus position detection system 43, and the trace log is generated. Recorded in file LF3. Also recorded. Further, synchronization accuracy trace data is generated from the detection result output from the laser interferometer 34 provided on the reticle stage 31 and the detection result of the laser interferometer 40 provided on the wafer stage 37, and is generated in the trace log file LF3. To be recorded. When the exposure process for the first shot area is completed, the link ID related to the first shot area after the exposure process is recorded in the line L14 of the sequence log file LF1, and the exposure process for the first shot area is performed in the line L15. The date and time of completion, and a character string “SHOT EXPOSURE END” indicating that the process has been completed are recorded. In the example shown in FIG. 4, September 1, 2004 is recorded as the date when the exposure process for the shot is completed, and 8:30:32 is recorded as the time when the exposure process is completed.

  When the exposure process for one shot area is completed, the main control system 24 moves the wafer stage 37 by stepping to move the next shot area to the scanning start position and moves the reticle stage 31 to the scanning start position. After the movement of both stages is started and each reaches a constant speed and is synchronized, the reticle R is irradiated with the exposure light IL to start exposure, and the shot area is exposed. When the exposure process for the next shot area is started, the sequence log file LF1 includes the date and time when the exposure process for the next shot area is started and the character string “SHOT EXPOSURE” indicating that the process has started. “START” is recorded. In the example shown in FIG. 4, September 1, 2004 is recorded as the date when the exposure processing for the shot is started in the row L16 following the row L15, and the time when the exposure processing is started is 8:30:32 Is recorded. Further, in a row L17 following this row L16, the shot number, the column number, and the row number of the exposure process are recorded.

  When the exposure process for this shot area is completed, the link ID related to the shot area for which the exposure process has been completed is recorded in the line L18 of the sequence log file LF1, and the date when the exposure process for the first shot area is completed in the line L19. , The time, and a character string “SHOT EXPOSURE END” indicating that the processing is completed. In the example shown in FIG. 4, September 1, 2004 is recorded as the date when the exposure processing for the shot is completed, and 8: 30: 34: 66 is recorded as the time when the exposure processing is completed. Similarly, exposure processing for each shot area is sequentially performed by the step-and-scan method, and various log information is recorded.

  FIG. 6 is a diagram showing an example of recorded contents of a focus trace log file which is a kind of trace log file LF3 recorded during the exposure process, and FIG. 7 is a kind of trace log file LF3 recorded during the exposure process. It is a figure which shows an example of the recording content of a certain synchronization precision trace log file. As shown in FIG. 6, the file name of the focus trace log file is the one recorded in the line L5 of the sequence log file LF1 shown in FIG. That is, the file name “FCSTRC — 20040901083012.LOG” in which the character string including the character string “FCSTRC_”) and the link ID (20040901083012) indicating the start time of the job sequence is recorded is used. Further, as shown in FIG. 7, the file name of the synchronization accuracy trace log file is recorded in the line L6 of the sequence log file LF1 shown in FIG. That is, the file name “SYNCTRC — 20040901083012.LOG” in which the character string including the character string “SYNCTRC_”) and the link ID (20040901083012) indicating the start time of the job sequence is recorded is used. As a result, the sequence log file LF1 is associated with the focus trace log file or the synchronization accuracy trace log file.

  As shown in FIG. 6, the link ID (same as the link ID recorded in the line L14 of the sequence log file LF1) related to the shot area where the exposure process was first performed is recorded in the line L31 of the focus trace log file. In the plurality of rows L32 following the row L31, focus trace data obtained during the exposure of the shot area subjected to the first exposure process is recorded. Thereby, the line L14 of the sequence log file LF1 and the line L31 of the focus trace log file are associated. Similarly, a link ID (same as the link ID recorded in the row L18 of the sequence log file LF1) relating to the shot area to which the exposure processing is performed next is recorded in the row L33, and a plurality of lines following the row L33 are recorded. In line L34, focus trace data obtained during the exposure of the shot area subjected to the next exposure process is recorded. Thereby, the line L18 of the sequence log file LF1 and the line L33 of the focus trace log file are associated.

  Further, as shown in FIG. 7, the link ID (the same link ID recorded in the row L14 of the sequence log file LF1) relating to the shot area where the exposure process was first performed is shown in the row L41 of the synchronization accuracy trace log file. In a plurality of rows L42 following this row L41, the synchronization accuracy trace data obtained during the exposure of the shot area subjected to the first exposure process is recorded. Thereby, the line L14 of the sequence log file LF1 is associated with the line L41 of the synchronization accuracy trace log file. Similarly, a link ID (same as the link ID recorded in the row L18 of the sequence log file LF1) related to the shot area to which the exposure processing is performed next is recorded in the row L43, and a plurality of lines following the row L43 are recorded. In line L44, focus trace data obtained during the exposure of the shot area subjected to the next exposure process is recorded. Thereby, the line L18 of the sequence log file LF1 is associated with the line L43 of the synchronization accuracy trace log file.

  Further, a lens control unit (not shown) provided in the projection optical system PL constantly monitors the atmospheric pressure, the temperature in the chamber of the exposure apparatus 50, and the temperature of the projection optical system PL. From this monitoring result, the projection optical system Optical characteristic variation data such as PL magnification variation amount and focus variation amount is calculated and output at a predetermined time or a predetermined period. The log server 74 records the optical characteristic fluctuation data output from the lens control unit in the optical characteristic fluctuation log file LF5. FIG. 8 is a diagram showing an example of recorded contents of the optical characteristic variation log file LF5. As shown in FIG. 8, in each line of the optical characteristic fluctuation log file LF5, the date and date when the optical characteristic fluctuation data is recorded, and the magnification fluctuation amount and the focus fluctuation amount of the projection optical system PL, which are the optical characteristic fluctuation data, are recorded. Is done. Thus, by recording the time when the optical characteristic variation data was recorded together with the optical characteristic variation data in the optical characteristic variation log file LF5, the operator searches the file using the necessary time or the necessary period as a search condition. By doing so, the necessary data can be easily collected.

  The wafer W that has been subjected to the exposure process is transported along the guide members 64 and 68 to the transport line 52 of the coater / developer 51, and then sequentially developed along the transport line 52 through the post-paque device 57 and the cooling device 58. Sent to device 59. Then, an uneven resist pattern corresponding to the device pattern of the reticle is formed in each shot area of the wafer W developed by the developing device 59. The wafer W thus developed is stored in the wafer carrier 60 along the transfer line 52. When the above processing for the wafers W for one lot is completed, the job is completed. For example, one lot of wafers in the wafer carrier 60 is transferred to a production line for performing a pattern formation process such as etching or ion implantation, a resist stripping process, and the like after the lithography process is completed. The above is the basic operation of the basic substrate processing apparatus when performing the exposure processing in units of a plurality of wafers, for example.

  Next, a method for searching and displaying necessary information from the log information associated by the above processing will be described. The main processor 70 searches for necessary information according to the operation content of the operator's device terminal 48. The operator selects the link ID used for associating the log information and searches for necessary information. FIG. 9 is a diagram illustrating a first display example of associated log information. To start the search for log information, the operator first operates the device terminal 48 to display the sequence log file LF1. When such an operation is performed, a window WD1 displaying the contents of the sequence log file LF1 is displayed on the display device provided in the terminal device 48.

  As shown in FIG. 9, in the window WD1, the contents of the sequence log file LF1 are displayed (text display) in characters that can be read by the operator. In addition, portions associated with other log files are underlined, and the operator can select them. In the example shown in FIG. 9, the display location of the link ID indicated by the symbols LN1 and LN2 is underlined, and the display location of the file name indicated by the symbols FN1 to FN3 is underlined. . Whether the underline is added or not is determined by the display program provided in the main processor 70 analyzing the contents of the sequence log file LF1.

  When the operator performs an operation of selecting the link ID (20040901083023) indicated by the symbol LN2 (for example, double-clicking the location where the link ID is displayed) while the window WD1 is displayed, The contents of the EGA measurement result log file associated with the link ID are displayed in the new window WD2. As described with reference to FIGS. 4 and 5, since the line L10 of the sequence log file LF1 and the line L21 of the EGA measurement result log file are associated with each other, the window WD2 includes lines after the line L21 in FIG. Is displayed. In this example, the content of the EGA measurement result log file is displayed in a window WD2 different from the window WD1, but the window WD1 may be updated to display the content of the EGA measurement result log file. .

  As shown in FIG. 9, the contents of the EGA measurement result log file are displayed in text in the window WD2. Similarly to the case of displaying the contents of the sequence log file LF1, the display program provided in the main processor 70 analyzes the contents of the EGA measurement result log file, and the link IDs indicated by the symbols LN11 and LN12 are used. Display underlined. When the operator performs an operation of selecting a link ID (SIG_20040901083023_001_007006_01) indicated by, for example, the symbol LN11 in a state where the window WD2 is displayed (for example, double-clicking a location where the link ID is displayed) The alignment waveform data recorded in the waveform log file LF4 associated with the link ID in the new window WD3 is displayed.

  In the example shown in FIG. 9, the alignment waveform data associated with the EGA measurement result log file is displayed in a graph in the display area DR1 of the window WD3. Further, in the area indicated by the symbol DR2 in the window WD3 (in the example shown in FIG. 9, the upper right part of the window WD3), the information indicating the wafer number, the shot position, and the design coordinates of the alignment mark are displayed. The EGA calculation result is displayed in the indicated area (lower part of the window WD3 in the example shown in FIG. 9).

  In addition, when the operator performs an operation (for example, double-clicking a location where the file name is displayed) to select the file name (EGA_20040901083012.LOG) indicated by the symbol FN1 in the window WD1, for example, Is displayed in text in a new window (not shown). Furthermore, when the operator performs an operation (for example, double-clicking the location where the file name is displayed) to select the link ID (20040901083021) indicated by the symbol LN1 in the window WD1, for example, All the associated log files (EGA — 20040901083012.LOG, FCRTRC — 20040901083012.LOG, SYNTRC — 20040901083012.LOG) are displayed in text in a new window (not shown) in order.

  FIG. 10 is a diagram illustrating a second display example of the associated log information. First, the operator operates the apparatus terminal 48 to perform an operation for displaying the sequence log file LF1 as in the case of FIG. When such an operation is performed, a window WD1 displaying the contents of the sequence log file LF1 is displayed on the display device provided in the terminal device 48. As shown in FIG. 10, in the window WD1, the contents of the sequence log file LF1 are displayed in text (displayed by text) that can be read by the operator, and portions associated with other log files are underlined. Thus, selection by the operator is possible. In the example shown in FIG. 10, the display location of the link ID indicated by the symbols LN3 and LN4 is underlined.

  When the window WD1 is displayed, when the operator performs an operation (for example, double-clicking the location where the link ID is displayed) to select the link ID (20040901083032) indicated by the symbol LN4, for example, The trace data associated with the link ID in a new window is displayed in a graph. In the present embodiment, as described with reference to FIGS. 6 and 7, the focus trace log file and the synchronization accuracy trace log file are associated with the link ID (20040901083032) indicated by the symbol LN4. The associated focus trace data and synchronization accuracy trace data are displayed in graphs in new windows WD4 and WD5, respectively.

  The focus trace data displayed in a graph on the window WD4 includes data indicating a leveling (attitude) control error (Tilt X) in the X direction of the wafer W, data indicating a leveling control error (Tilt Y) in the Y direction, and data in the Z direction. There are data indicating a tracking error (Error Z) and data indicating a total focus error (Total), which are displayed in a graph. The synchronization accuracy trace data displayed in a graph on the window WD5 includes data indicating the tracking error in the X direction of the reticle stage 31 with respect to the wafer stage 37 (X MSD), data indicating the tracking error in the Y direction (Y MSD), And there is data (θ MSD) indicating the rotation follow-up error in the XY plane, and these are displayed in a graph.

  Further, when searching for the optical characteristic fluctuation log file LF5 in which the optical characteristic fluctuation data is recorded with time as described with reference to FIG. 8, when the operator operates the device terminal 48 to specify the time or period, The optical characteristic fluctuation data recorded at the designated time or the optical characteristic fluctuation data recorded during the designated period is retrieved and displayed on the display device of the device terminal 48. Here, the optical characteristic variation log file LF5 to be searched can be selected by an instruction from the operator, or only the one associated with the sequence log file LF1 by the link ID can be selected.

  As described above, in this embodiment, the log information recorded by the main processor 70 in the main control system 24 of the exposure apparatus 50 and the various log information output from each unit and recorded by the log server 74 are linked IDs. It is related with. For this reason, the operator can easily obtain necessary information using the link ID, and the log information is displayed on the display device in a display format corresponding to the type. It can be managed easily.

  It is also possible for the operator to manually change the association of various log information. For example, as described with reference to FIG. 5, the waveform log file LF4 is associated with the EGA measurement result log file by the link ID (SIG_20040901083023_001_007006_01) indicated by the symbol LN11. This link ID is created using information (SIG_) indicating the type of log information, alignment start date and time (20040901083023), wafer number (001), shot number (007006), and mark number (01). . The operator operates the apparatus terminal 48 to change the link ID to a link ID (SIG_20040901083023_001) composed of information indicating the type of log information (SIG_), alignment start date and time (20040901083023), and wafer number (001). it can.

  If the link ID is changed, the log information association is lost. For this reason, in this embodiment, the program provided in the main processor 70 records the change history when the link ID is changed. For example, in the above example, information indicating that the link ID (SIG_20040901083023_001_007006_01) has been changed to the link ID (SIG_20040901083023_001) and the change time are recorded as the change history. By recording such a change history, the file name of the file associated with the link ID before the change or the link ID recorded in the file can be collectively changed without losing the association. Further, the association can be maintained without changing the file name of the file or the link ID recorded in the file. As a result, even if the link ID is changed, the link ID before the change is obtained from the changed link ID by referring to the change history, and the necessary log information can be searched.

  As mentioned above, although embodiment of this invention was described, this invention is not restrict | limited to the said embodiment, It can change freely within the scope of the present invention. For example, in the above-described embodiment, information such as information indicating time and information indicating the status of exposure processing is included in the link ID. However, the link ID may use arbitrary identification information that is uniquely determined and does not include these. it can. In the above embodiment, the case where the log information recorded in the exposure apparatus 50 is associated is described as an example. However, the same method is applied to all log information recorded in the substrate processing apparatus shown in FIG. And the necessary log information can be searched from the associated log information.

  Furthermore, in the above-described embodiment, the case where various types of log information are associated according to the log information association method set by the operator has been described as an example. However, the main processor 70 positioned at the upper level and the unit positioned at the middle level You may make it link the content of log information, determining the link ID uniquely determined between the controller UC and the log server 74 positioned in the lower rank. When such association is performed, the link ID uniquely determined by the main processor 70 positioned at the upper level may be determined at once, the unit controller UC positioned at the lower level with respect to the main processor 70, and various types of The unit may be configured to output log information together with information (identifier) uniquely determined, and the main processor 70 may use this identifier as a link ID.

  Alternatively, when the operation of the second controller is based on the instruction from the first controller, such as when the alignment controller 72 measures the alignment waveform and acquires the waveform data according to the instruction from the main processor 70, The association information recorded in the log data (second log) of the second controller to be associated with the log data (first log) of one controller may be determined by an instruction from the first controller to the second controller. In addition, when an operation instruction is transmitted from the first controller to the third controller in parallel at this time, the second and second logs are used to correlate the log data (third log) of the third controller with the second log. The association information recorded in each of the third logs is determined by an instruction from the first controller to each of the second and third logs, or the second controller and the third controller directly without passing through the first controller. It is also possible to make a decision by performing communication.

In the above-described embodiment, an ArF excimer laser light source has been described as an example of the exposure light source 1. However, as the exposure light source 1, for example, g-line (wavelength 436 nm) and i-line (wavelength 365 nm) are used. Ejecting ultra-high pressure mercury lamp, KrF excimer laser (wavelength 248 nm), ArF excimer laser (wavelength 193 nm), F ₂ excimer laser (wavelength 157 nm), Kr ₂ laser (wavelength 146 nm), high-frequency generator for YAG laser, or semiconductor A laser high-frequency generator can be used.

  Further, as the exposure apparatus 50, not only an exposure apparatus used for manufacturing a semiconductor element, but also an exposure apparatus used for manufacturing a display including a liquid crystal display element (LCD) or the like and transferring a device pattern onto a glass plate, The present invention can also be applied to an exposure apparatus that is used for manufacturing a thin film magnetic head and transfers a device pattern onto a ceramic wafer, and an exposure apparatus that is used to manufacture an image sensor such as a CCD. Furthermore, in an exposure apparatus that transfers a circuit pattern onto a glass substrate or a silicon wafer in order to manufacture a reticle or mask used in an optical exposure apparatus, EUV exposure apparatus, X-ray exposure apparatus, electron beam exposure apparatus, or the like. The present invention can also be applied. Here, in an exposure apparatus using DUV (far ultraviolet) light, VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, Magnesium fluoride or quartz is used. Further, in a proximity type X-ray exposure apparatus or an electron beam exposure apparatus, a transmission mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate.

  Further, in order to manufacture reticles or masks used in not only microdevices such as semiconductor elements but also light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., from mother reticles to glass substrates and The present invention can also be applied to an exposure apparatus that transfers a circuit pattern to a silicon wafer or the like. Here, in an exposure apparatus using DUV (deep ultraviolet), VUV (vacuum ultraviolet) light, or the like, a transmission type reticle is generally used. As a reticle substrate, quartz glass, fluorine-doped quartz glass, fluorite, Magnesium fluoride or quartz is used. In proximity type X-ray exposure apparatuses, electron beam exposure apparatuses, and the like, a transmissive mask (stencil mask, membrane mask) is used, and a silicon wafer or the like is used as a mask substrate. Such an exposure apparatus is disclosed in WO99 / 34255, WO99 / 50712, WO99 / 66370, JP-A-11-194479, JP-A2000-12453, JP-A-2000-29202, and the like. .

It is a top view which shows schematic structure of the substrate processing apparatus by one Embodiment of this invention. 1 is a diagram showing an outline of the overall configuration of an exposure apparatus 50. FIG. 3 is a block diagram showing a schematic configuration of a main control system 24. FIG. It is a figure which shows an example of the recording content of the sequence log file LF1. It is a figure which shows an example of the recording content of the EGA measurement result log file which is 1 type of the processing content file LF2. It is a figure which shows an example of the recording content of the focus trace log file which is 1 type of the trace log file LF3 recorded during an exposure process. It is a figure which shows an example of the recording content of the synchronous precision trace log file which is 1 type of the trace log file LF3 recorded during an exposure process. It is a figure which shows an example of the recording content of the optical characteristic fluctuation log file LF5. It is a figure which shows the 1st display example of the log information linked | related. It is a figure which shows the 2nd example of a display of the log information linked | related.

Explanation of symbols

31 Reticle stage (lower processing unit, equipment)
37 Wafer stage (lower processing unit, equipment)
44 Wafer alignment sensor (lower processing unit, equipment)
46 Reticle alignment sensor (Lower processing unit, equipment)
66 First arm (lower processing unit, device)
69 Second arm (lower processing unit, device)
70 Main processor (recording unit, host processing unit, host recording unit, device, search unit)
74 Log server (recording unit, subordinate recording unit)
LF1 sequence log file (log file, first log file)
LF2 process content file (log file, first log file)
LF3 trace log file (log file, second log file)
LF4 waveform log file (log file, second log file)
LF5 Optical characteristics fluctuation log file (log file, second log file)
UC unit controller (upper processing unit, equipment)

Claims (32)

In a substrate processing apparatus including a recording unit that records log information related to substrate processing in a log file,
The substrate processing apparatus, wherein the recording unit records identification information uniquely determined in a file name of the log file and associates contents between the log files. In a substrate processing apparatus including a recording unit that records log information related to substrate processing in a log file,
The substrate processing apparatus, wherein the recording unit records identification information uniquely determined in the log file and associates the contents of the log file.   The substrate processing apparatus according to claim 1, wherein the recording unit uses at least one of information indicating time and information indicating a progress of the substrate processing as the uniquely determined identification information.   4. The substrate processing apparatus according to claim 1, wherein the recording unit associates different types of log information recorded in the log file using the identification information. 5. .   The substrate processing apparatus according to claim 4, wherein the log information includes information indicating transition of the substrate processing, information indicating the content of the substrate processing, and measurement information performed during the substrate processing.   The substrate processing according to claim 1, wherein the recording unit records time information indicating a time at which the log information is recorded in the log file together with the log information. apparatus.   The substrate processing apparatus according to claim 6, wherein the recording unit records the time information at a predetermined time or a predetermined period.   8. The substrate processing apparatus according to claim 1, further comprising a search unit that searches the log file in which the association has been performed according to the association. 9.   The substrate processing apparatus according to claim 8, further comprising: a display unit that displays the log information obtained by the search by the search unit on a display device in a display format corresponding to a type of the log information.   The substrate processing apparatus according to claim 8, wherein the recording unit records a change history of related information associated with the log file.   11. The board according to claim 10, wherein the search unit obtains the association of the log file before the change from the association of the log file that has been changed with reference to the change history, and searches the log file. Processing equipment. In a substrate processing apparatus comprising an upper processing unit positioned at a higher level and a lower processing unit positioned at a lower level, wherein the upper processing unit and the lower processing unit cooperate to perform substrate processing,
An upper recording unit that records log information related to processing performed in the upper processing unit in a first log file;
A lower recording unit that records log information related to processing performed in the lower processing unit in a second log file;
A substrate processing apparatus for associating contents between the first log file and the second log file while determining identification information uniquely determined between the upper recording unit and the lower recording unit . In an information management method for managing log information related to substrate processing recorded in a log file by a substrate processing apparatus for processing a substrate,
An information management method, wherein identification information that is uniquely determined is recorded in a file name of the log file to associate contents between the log files. In an information management method for managing log information related to substrate processing recorded in a log file by a substrate processing apparatus for processing a substrate,
An information management method comprising: recording identification information uniquely determined in the log file and associating the contents of the log file.   15. The information management method according to claim 13, wherein the uniquely determined identification information is at least one of information indicating time and information indicating progress of the substrate processing.   The information management method according to any one of claims 13 to 15, wherein the identification information is used to associate different types of log information recorded in the log file.   The information management method according to claim 16, wherein the log information includes information indicating transition of the substrate processing, information indicating contents of the substrate processing, and measurement information performed during the substrate processing.   The information management method according to any one of claims 13 to 17, wherein time information indicating a time at which the log information is recorded in the log file is recorded together with the log information.   19. The information management method according to claim 18, wherein the time information is recorded at a predetermined time or a predetermined period.   The information management method according to any one of claims 13 to 19, wherein the log file in which the association is performed is searched according to the association.   21. The information management method according to claim 20, wherein the log information obtained by the search is displayed in a display format corresponding to the type of the log information.   The information management method according to claim 20 or 21, wherein a change history of related information associated with the log file is recorded.   23. The information management method according to claim 22, wherein the log file is searched by obtaining the association of the log file before the change from the association of the changed log file based on the change history. A substrate processing method for processing a substrate in cooperation with two or more apparatuses,
Among the data generated by each of the two devices, information for associating the data with each other so that the other is called by selecting one of the two data that are related to each other. A substrate processing method characterized by including a step of automatically adding and recording when generating an image.   The information for associating each other's data so that the other is called by selecting one of the two data is selected by selecting one of the two data displayed on the display screen on the display screen. 25. The substrate processing method according to claim 24, comprising information for associating the two data so that the other of the data is displayed on the display screen. Each of the data generated by each of the two devices is recorded in a different file;
26. The substrate according to claim 25, wherein a file name of the file is determined and recorded in association with information for associating data with each other so that the other is called by selecting one of the two data. Processing method. Each of the data generated by each of the two devices is recorded in a different file;
26. The substrate processing method according to claim 25, further comprising, as data in the file, information for associating data with each other so that the other is called when one of the two data is selected.   26. The substrate processing method according to claim 25, wherein two pieces of data selected by using a computer program reflecting a judgment based on an empirical rule are recorded with the information for associating added thereto.   29. The substrate processing method according to claim 28, wherein the computer program controls the apparatus so as to add and record the information for associating based on information about the time when each of the two data is generated.   29. The apparatus according to claim 28, wherein the computer program controls the apparatus to add and record the information for associating based on information on the stage of the substrate processing process in which each of the two data is generated. Substrate processing method.   The computer program controls the apparatus to add and record information for associating the two data when the two data are data related to an operation based on an instruction from a common apparatus. The substrate processing method according to claim 28. The computer program is configured such that when one of the two devices generates one of the two data and the other of the two devices performs a predetermined operation based on an instruction from the one, 29. The substrate processing method according to claim 28, wherein when recording data relating to a predetermined operation on the other side, the apparatus is controlled to add and record information for associating with one of the two data. .

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