JP7383840B1 - Information processing device, information processing method, program, exposure device, exposure method, and article manufacturing method - Google Patents

Abstract

The present invention provides an advantageous technique for a user of an exposure apparatus to understand the cause of a decrease in exposure accuracy. An information processing apparatus includes a substrate state at the end of the exposure process of a first shot area among a plurality of shot areas on a substrate subjected to an exposure process by an exposure apparatus, and a state of the substrate at the end of the exposure process of a first shot area of a plurality of shot areas on a substrate where an exposure process is performed by an exposure apparatus. Difference information corresponding to the difference between the substrate state at the start of the exposure process of a second shot area where the exposure process is performed next to the first shot area, and the substrate state at the end of the exposure process of the first shot area. difference information corresponding to a difference between the state and a measurement result of the second shot area measured from the start of the exposure process of the first shot area to the start of the exposure process of the second shot area; Generating image information for displaying display information on a display unit, which is one of the difference information corresponding to the difference between the measurement result of the first shot area and the measurement result of the second shot area. It has a generation section. [Selection diagram] Figure 1

Description

The present invention relates to an information processing device, an information processing method, a program, an exposure device, an exposure method, and a method for manufacturing articles.

As one of the devices used in the manufacturing process (lithography process) of semiconductor devices, etc., there is an exposure device that exposes multiple shot areas on a substrate by scanning the substrate with light from a projection optical system. ing. In the exposure process of each shot area, the exposure apparatus measures the surface position of the substrate (focus/tilt measurement) prior to irradiation with light, and based on the measurement results, determines at least one of the height and orientation of the substrate. Two controls (focus/tilt control) are performed.

After the exposure process for each shot area of the substrate is completed, the user of the exposure apparatus may check whether the exposure accuracy of each shot area satisfies a desired accuracy. If there is a shot area where the exposure accuracy does not meet the desired accuracy, it is important to understand the cause (reason) in order to accurately perform exposure processing on subsequent substrates. Patent Document 1 discloses that the control error (Error Z) of the surface position of the substrate and the control error (Error Tilt(X), Error Tilt(Y)) of the substrate surface during the exposure process of each shot area are displayed graphically. has been done.

Japanese Patent Application Publication No. 2006-165122

Deterioration in exposure accuracy may be caused not only by substrate control errors during exposure processing but also by shot layout. For example, in the case of a layout in which there are height differences within a plurality of shots, the amount of drive of the substrate between shots may become large, resulting in a large control residual of the substrate. In the method described in Patent Document 1, the user of the exposure apparatus cannot grasp that the cause of the decrease in exposure accuracy is due to the shot layout.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an advantageous technique for a user of an exposure apparatus to understand the cause of a decrease in exposure accuracy.

In order to achieve the above object, an information processing apparatus according to one aspect of the present invention provides the information processing apparatus that performs the exposure process at the end of the exposure process of a first shot area among a plurality of shot areas on a substrate where an exposure process is performed by an exposure apparatus. a substrate condition indicating at least one of the height or posture of the substrate ; and the substrate condition at the start of the exposure process of a second shot area in which the exposure process is performed next to the first shot area among the plurality of shot areas. , the substrate state at the end of the exposure process of the first shot area, and the exposure process of the second shot area after the start of the exposure process of the first shot area. difference information corresponding to the difference between the measurement results obtained by measuring the surface position of the substrate for the second shot area before the start of the process, the measurement results for the first shot area, and the measurement results for the second shot area . difference information corresponding to the difference between the results and the substrate state at the start of the exposure process for each of the plurality of shot areas;
The apparatus is characterized by comprising a generation unit that generates image information for displaying the measurement results of each of the plurality of shot areas and display information that is one of the measurement results on the display unit.

One aspect of the present invention relates to an information processing apparatus, and the information processing apparatus includes a plurality of shot areas on a substrate to which an exposure apparatus performs an exposure process. a substrate condition indicating at least one of the height or posture of the substrate; and the substrate condition at the start of the exposure process of a second shot area in which the exposure process is performed next to the first shot area among the plurality of shot areas. The image forming apparatus includes a generating section that generates image information for displaying display information corresponding to the difference between the two on the display section.

According to the present invention, for example, an advantageous technique can be provided for a user of an exposure apparatus to understand the cause of a decrease in exposure accuracy.

Schematic diagram showing an example of the configuration of an exposure device A diagram showing an example of the operation when performing exposure processing on each of the first shot area and the second shot area. A diagram showing an example of the operation when performing exposure processing on each of the first shot area and the second shot area. A diagram showing an example of the operation when performing exposure processing on each of the first shot area and the second shot area. Diagram showing an example of the difference in focus and tilt Diagram showing an example of displaying difference information on the display unit Flowchart showing the operation flow of the exposure device Flowchart showing the processing flow of the information processing device Diagram showing an example of displaying statistical information on the display unit (a) Diagram showing an example of how correction values are displayed on the display unit, (b) Diagram showing an example of how prediction results of focus/tilt differences are displayed.

Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the claimed invention. Although a plurality of features are described in the embodiments, not all of these features are essential to the invention, and the plurality of features may be arbitrarily combined. Furthermore, in the accompanying drawings, the same or similar components are designated by the same reference numerals, and redundant description will be omitted.

In this specification and the accompanying drawings, directions are indicated using an XYZ coordinate system in which the XY plane is a direction parallel to the surface (upper surface) of the substrate. Directions parallel to the X, Y, and Z axes in the XYZ coordinate system are defined as the X direction, Y direction, and Z direction, and rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are Let θX, θY and θZ be. Control and drive (movement) regarding the X-axis, Y-axis, and Z-axis mean control or drive (movement) in a direction parallel to the X-axis, a direction parallel to the Y-axis, and a direction parallel to the Z-axis, respectively. Furthermore, the control or drive regarding the θX-axis, θY-axis, and θZ-axis includes control or drive regarding rotation around an axis parallel to the X-axis, rotation around an axis parallel to the Y-axis, and rotation around an axis parallel to the Z-axis, respectively. It means driving.

<First embodiment>
A system S according to a first embodiment of the present invention will be described. FIG. 1 is a schematic diagram showing a configuration example of a system S of this embodiment. The system S of this embodiment can include an exposure apparatus 100 and an information processing apparatus 200. The exposure apparatus 100 is used in a manufacturing process (lithography process) of semiconductor devices and the like, and performs an exposure process on each of a plurality of shot areas on a substrate. The exposure apparatus 100 of this embodiment is a scanning exposure apparatus that performs exposure processing for each of a plurality of shot areas on a substrate while scanning the substrate using a step-and-scan method. In this type of exposure processing, the shot area of the substrate is scanned by scanning the substrate with exposure light (slit light, pattern light) emitted from the projection optical system, and the pattern of the original is exposed in the shot area of the substrate. can be transferred onto. In the following, an example will be described in which a reticle LT is used as an original and a wafer WF is used as a substrate. However, the term "substrate" in the specification has the same meaning as wafer WF.

First, a configuration example of the exposure apparatus 100 will be described. The exposure apparatus 100 can include an illumination optical system 8 , a reticle stage 4 , a projection optical system 9 , a wafer stage 7 , an alignment detection section 10 , a focus/tilt measurement section 11 , and a control section 12 .

The illumination optical system 8 shapes light emitted from a light source (not shown) into slit light to illuminate the reticle LT. The reticle LT is made of, for example, quartz glass, and has a pattern (for example, a circuit pattern) to be transferred onto each shot area of the wafer WF formed thereon. The reticle stage 4 includes a chuck that holds the reticle LT, and is movable in at least the XY axis directions. When exposing each shot area of the wafer WF, the reticle stage 4 is scanned along the Y direction, which is a direction perpendicular to the optical axis AX of the projection optical system 9. Here, the exposure process can be defined as a process during a period in which the shot area of the wafer WF is exposed by irradiating the shot area of the wafer WF with exposure light (slit light) emitted from the projection optical system 9.

Projection optical system 9 projects the image of the pattern on reticle LT illuminated with light from illumination optical system 8 onto wafer WF at a predetermined magnification (for example, 1/2 to 1/5). The wafer WF is a substrate made of, for example, single-crystal silicon and has a resist (photosensitive agent) coated on its surface. The wafer stage 7 includes a chuck that holds the wafer WF, and is movable (rotated) in each of the XYZ axes, and further in the θX, θY, and θZ directions that are the rotational directions of the respective axes. The wafer stage 7 is scanned along the Y direction, which is a direction perpendicular to the optical axis AX of the projection optical system 9, during exposure processing of each shot area of the wafer WF.

The alignment detection unit 10 includes, for example, a projection system that projects detection light onto a reference mark on the wafer WF, and a light receiving system that receives reflected light from the reference mark, and includes Detect the position (alignment position). In the case of this embodiment, the alignment detection unit 10 is configured as an off-axis alignment detection system that can optically detect the reference mark on the wafer WF without using the projection optical system 9, for example.

The focus/tilt measurement unit 11 measures the surface position of the wafer WF held by the wafer stage 7 (focus/tilt measurement). Tilt (posture, inclination) can be measured by performing focus measurement at multiple points. The focus/tilt measurement unit 11 may be understood as a focal plane detection device. The focus/tilt measuring section 11 of this embodiment is of an oblique incidence type that irradiates light onto the wafer WF obliquely, and includes a light projecting section 11a that projects a plurality of light beams for measurement onto the wafer WF, and a light projecting section. The light receiving unit 11b may include a light receiving unit 11b that receives a plurality of light beams posted and reflected by the wafer WF. The focus/tilt measuring section 11 can measure the surface position (surface height) of each of a plurality of locations on the wafer WF into which a plurality of light beams are respectively incident by the light projecting section 11a.

The control unit 12 is configured by a computer including a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, and can collectively control the operation and adjustment of each component of the exposure apparatus 100. The control unit 12 is connected to each component of the exposure apparatus 100 via a line, and executes exposure processing for each shot area of the wafer WF by controlling each component according to a program stored in a storage unit. sell. For example, the control unit 12 controls the reticle stage 4 and the wafer stage 7 at the projection magnification of the projection optical system 9 while controlling the substrate state indicating at least one of the height and posture (tilt) of the wafer WF by the wafer stage 7. Scans relatively at a speed ratio according to. As a result, the irradiation area to which the exposure light from the projection optical system 9 is irradiated (that is, the area on which the image of the pattern of the reticle LT is projected by the projection optical system 9) is moved over the shot area of the wafer WF, and the reticle LT is pattern can be transferred to the shot area. By sequentially performing such an exposure process (scanning exposure) on each of a plurality of shot areas on the wafer WF, the exposure process on one wafer WF can be completed. Note that hereinafter, the substrate state indicating at least one of the height and posture (tilt) of the wafer WF may be referred to as "focus/tilt."

Next, a configuration example of the information processing device 200 will be described. The information processing apparatus 200 is communicably connected to the exposure apparatus 100 and may include a processing section 13 , a display section 17 , and an input section 18 . The processing unit 13 is configured by a computer including, for example, a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory. The processing unit 13 of this embodiment includes an acquisition unit 14 that acquires information from the exposure apparatus 100, a display control unit (generation unit) 15 that controls the display unit 17 based on the information acquired by the acquisition unit 14, and an exposure A supply unit 16 that supplies (transmits, provides) information to the device 100 may be included. The acquisition unit 14 and the supply unit 16 may be understood as units that constitute a communication unit that communicates with the exposure apparatus 100 to transmit and receive information. Further, the display section 17 is, for example, a display, and displays information under the control of the display control section 15. The input unit 18 is, for example, a mouse or a keyboard, and receives instruction input from the user. The display section 17 and the input section 18 may be understood as a unit that constitutes a user interface. Here, although the information processing apparatus 200 of this embodiment is configured separately from the exposure apparatus 100 (in a separate housing), it is integrated with other parts as a component of the exposure apparatus 100 (in a common (within the housing). In this case, the control section 12 of the exposure apparatus 100 can have the functions of the processing section 13 of the information processing apparatus 200. Further, in this embodiment, an example is shown in which the information processing device 200 includes the display unit 17 and the display control unit 15, but the display unit 17 and the display control unit 15 may be provided outside the information processing device 200. , for example, may be provided in the exposure apparatus 100 or an external computer. In this case, the display control unit 15 located outside the information processing device 200 controls the display on the display unit 17 based on the image information generated by the generation unit included in the information processing device 200. Although the present embodiment shows an example in which the information processing device 200 includes the input unit 18, the input unit 18 may be provided outside the information processing device 200.

[Exposure processing for each shot area]
Next, exposure processing (scanning exposure) for each of the plurality of shot areas on the wafer WF will be described with reference to FIGS. 2 to 4. Exposure processing is performed on each of the plurality of shot areas on the wafer WF in a predetermined order. Here, in order to make the explanation easier to understand, the explanation will focus on two shot areas (the first shot area 21 and the second shot area 22) in which the order of exposure processing is consecutive among the plurality of shot areas on the wafer WF. do. Here, the first shot area 21 and the second shot area 22 do not indicate specific shot areas on the wafer WF, but simply indicate shot areas arbitrarily selected from a plurality of shot areas on the wafer WF. ing. That is, the first shot area 21 indicates the (i-1)th shot area (previous shot area) in which exposure processing is performed one shot area before the second shot area. Further, the second shot area 22 indicates the i-th shot area (next shot area) in which exposure processing is performed next to the first shot area 21. Note that "i" is a natural number.

2 to 4 show operational examples when performing exposure processing on each of the first shot area 21 and the second shot area 22. FIG. 2 to 4, in addition to the first shot area 21 and the second shot area 22, an irradiation area 23 is irradiated with exposure light from the projection optical system 9, and a focus/tilt measurement section 11 performs focus/tilt measurement. A plurality of measurement points 24 are shown at which each measurement is performed. Note that the focus/tilt measurement is a measurement of the surface position. Broken arrows P in FIGS. 2 to 4 indicate the paths of the irradiation area 23 and the plurality of measurement points 24 with respect to the wafer WF (first shot area 21, second shot area 22). In the exposure process for each shot area, the exposure apparatus 100 (control unit 12) of this embodiment performs focus measurement at a plurality of measurement points 24 prior to irradiation of exposure light in the irradiation area 23, and uses the measurement results to The focus/tilt of the wafer WF is controlled based on this.

In the exposure process of the first shot area 21, as shown in FIG. Prior to this, focus and tilt measurements are performed sequentially. Based on the measurement results at the measurement point 24a, the focus and tilt of the wafer WF is adjusted so that the wafer surface (substrate surface) within the irradiation area 23 is placed at the best focus position (imaging position) of the projection optical system 9. are controlled sequentially. When the exposure process for the first shot area 21 is completed, as shown in FIG. Move by step.

In the exposure process of the second shot area 22, as shown in FIG. Prior to this, focus and tilt measurements are performed sequentially. Then, based on the measurement result at the measurement point 24b, the focus and tilt of the wafer WF are sequentially controlled so that the wafer surface within the irradiation area 23 is placed at the best focus position of the projection optical system 9. The focus/tilt measurement by the measurement point 24b and the control of the focus/tilt of the wafer WF based on the measurement results are performed when the measurement point 24b enters the second shot area 22 during step movement of the wafer WF (see FIG. 3). will be started on.

[Display difference information]
After completing the exposure process for each shot area of the wafer WF, the user of the exposure apparatus 100 checks whether the exposure accuracy (for example, overlay accuracy, line width, etc.) of each shot area satisfies the desired accuracy. Sometimes. If there is a shot area where the exposure accuracy does not meet the desired accuracy, it is important to understand the cause (reason) in order to accurately perform exposure processing on subsequent wafers WF.

One of the causes of the decrease in exposure accuracy is the focus difference between the end of the exposure process for the first shot area 21 (previous shot area) and the start of the exposure process for the second shot area 22 (next shot area).・One example is the difference in tilt. Depending on such a difference in focus and tilt, the amount of drive of the wafer WF (substrate) between the end of the exposure process for the first shot area 21 and the start of the exposure process for the second shot area 22 increases. . Accordingly, the control residual of the wafer WF after the start of the exposure process for the second shot area 22 increases, and the exposure accuracy may decrease.

For example, FIG. 5 shows an example of the difference in focus and tilt of the wafer WF between the end time t1 of the exposure process for the first shot area 21 and the start time t2 of the exposure process for the second shot area 22. As described above, in the exposure process of the second shot area 22, when the measurement point 24b enters the second shot area 22, focus measurement at the measurement point 24b and focus/tilt control of the wafer WF are started. Ru. Therefore, depending on the focus/tilt difference, it becomes necessary to drive the wafer WF sharply, and the control residual of the wafer WF in the exposure process of the second shot area 22 may become large.

In the information processing device 200 of the present embodiment, the processing unit 13 (display control unit, generation unit 15) controls the focus between the end of the exposure process of the first shot area 21 and the start of the scanning exposure of the second shot area 22. - Difference information (display information) indicating the difference in tilt is displayed on the display section 17. That is, the generation unit 15 generates information for causing the display unit 17 to display difference information indicating the difference in focus/tilt between the end of the exposure process for the first shot area 21 and the start of scanning exposure for the second shot area 22. Generate image information.

Specifically, the difference information is controlled based on the focus/tilt at the end of the exposure process of the first shot area 21 and the measurement result of the focus/tilt measurement unit 11 at the start of the scanning exposure of the second shot area 22. This information indicates the difference from the focus/tilt that was applied. As a result, the user of the exposure apparatus 100 can determine that the cause of the decrease in exposure accuracy is the difference in focus and tilt between the end of the exposure process for the first shot area 21 and the start of scanning exposure for the second shot area 22. It becomes possible to grasp whether or not. Note that in the following, the difference in focus and tilt between the end of the exposure process for the first shot area 21 and the start of scanning exposure for the second shot area 22 may be simply referred to as "difference in focus and tilt." be.

Further, in this embodiment, an example is shown in which the difference information is information indicating the difference between the substrate state at the end of the exposure process for the first shot area 21 and the substrate state at the start of the exposure process for the second shot area 22. Ta. However, the difference information includes the substrate state at the end of the exposure process for the first shot area 21 and the second condition measured from the start of the exposure process for the first shot area 21 until the start of the exposure process for the second shot area 22. It may also be information indicating a difference from the measurement results of the shot area 22. The measurement result indicates at least one of the height and posture (tilt) of the substrate.

In the former case, the focus/tilt control result at the start of scanning exposure of the second shot area 22 is used, which includes a control error including a shift amount in the Z direction when the wafer stage 7 moves horizontally. By including the control error including the amount of deviation in the Z direction when the wafer stage 7 moves horizontally, the cause of the decrease in exposure accuracy can be reduced by controlling the error including the amount of deviation in the Z direction when the wafer stage 7 moves horizontally. It can be specified with consideration.

In the latter case, the measurement results obtained by measuring the second shot area 22 by the focus/tilt measurement unit 11 are used, which do not include control errors in controlling the wafer stage 7 between the first shot area 21 and the second shot area 22. ing. In the latter case, the focus/tilt at the end of the exposure process of the first shot area 21 is, for example, information on a position corresponding to the position measured by the focus/tilt measuring unit 11 of the second shot area 22. In the latter case, a plurality of focus/tilt measurement units 11 are provided to check the substrate state at the end of the exposure process of the first shot area 21 and the second shot area 22 measured by the plurality of focus/tilt measurement units. The information may also be information indicating a difference from the measurement result of .

Further, the difference information may be the difference between the measurement result of the first shot area 21 and the measurement result of the second shot area 22. This measurement result is, for example, a measurement result measured by the focus/tilt measurement section 11.

Here, in the present embodiment, the processing unit 13 (obtaining unit 14) uses the obtaining unit 14 to obtain the difference information (that is, information indicating the difference in focus and tilt) obtained by the control unit 12 of the exposure apparatus 100. sell. In this case, the processing section 13 (display control section, generation section 15) causes the display section 17 to display the difference information acquired from the exposure apparatus 100. That is, the generation unit 15 generates image information for displaying the difference information acquired from the exposure apparatus 100 on the display unit 17. However, the processing unit 13 (acquisition unit 14) obtains first information indicating the focus/tilt at the end of the exposure process for the first shot area 21 and the focus/tilt at the start of the exposure process for the second shot area 22. You may acquire the 2nd information which shows. In this case, the processing unit 13 (display control unit, generation unit 15) generates difference information based on the first information and second information acquired from the exposure apparatus 100, and displays the generated difference information on the display unit 17. . That is, the generation unit 15 generates difference information based on the first information and second information acquired from the exposure apparatus 100, and generates image information for displaying the generated difference information on the display unit 17.

FIG. 6 shows an example of displaying the difference information on the display unit 17. In the example of FIG. 6, the difference information is a distribution that expresses the magnitude of the difference in focus/tilt for each position of the shot area SH on the wafer WF in terms of color density, in accordance with the layout of a plurality of shot areas SH on the wafer WF. is displayed as. Here, the display of the difference information is not limited to a display that matches the layout of the plurality of shot areas SH on the wafer WF, but may be a display using a table or the like. Furthermore, the display of the difference information is not limited to displaying color density, but may also be displaying color types or numerical values, or displaying numerical values superimposed on color density or type. It is sufficient if the user can visually recognize the difference information. The generation unit 15 generates image information of the difference information to be displayed on the display unit 17 so that the user can visually recognize it using at least one of the above examples.

Further, when exposure processing is performed over a plurality of wafers WF (substrates), the display control unit 15 displays a representative value of the focus/tilt difference between the plurality of wafers WF as difference information for each shot area position. 17 may be displayed. That is, the generation unit 15 may generate image information for displaying on the display unit 17 by using a representative value of the focus/tilt difference between a plurality of wafers WF as difference information for each position of the shot area. Examples of representative values include the average value, median value, maximum value, and mode value.

When the focus/tilt difference in the difference information is large, the wafer changes between the end of the exposure process of the first shot area 21 and the start of the scanning exposure of the second shot area 22 (that is, during step movement of the wafer WF). The amount of drive of the WF will increase. If the drive amount is large, as described above, it becomes a factor that increases the control residual of the wafer WF after the start of the exposure process of the second shot area 22 and the error of the focus/tilt measuring section 11. Further, when the shot area is located at the peripheral portion of the wafer WF, there may be an effect that the tilt component of the wafer WF cannot be detected or that the accuracy of focus/tilt measurement is reduced because the measurement points are limited. Since such effects are also displayed on the display section 17 as difference information, the user of the exposure apparatus 100 can easily and appropriately identify the cause of the decrease in exposure accuracy by checking the difference information on the display section 17. It becomes possible to understand.

Additionally, by displaying difference information in accordance with the layout of multiple shot areas on the wafer WF, the user can see where the waviness that occurs in the wafer WF or the structural characteristics caused by bonding the wafer WF are affecting. , can be grasped visually. In other words, the user can appropriately recognize the influence of the focus/tilt difference on the manufacturing process of the wafer WF, which may lead to improvement of the manufacturing process.

Furthermore, in addition to differences in focus and tilt, causes of a decline in exposure accuracy include, for example, unevenness of the wafer WF, errors in focus position due to lens factors, effects of air conditioning, and vibrations transmitted to the exposure equipment. . However, as in this embodiment, by focusing on the difference in focus and tilt and displaying the difference information indicating the difference in focus and tilt on the display unit 17, the user can evaluate the exposure accuracy from the perspective of the difference in focus and tilt. The cause of the decline can be easily and appropriately understood. That is, from the viewpoint of the difference in focus and tilt, it is possible to make use of the improvement in the manufacturing process of the wafer WF.

[Generation of correction value]
In the exposure apparatus 100 of this embodiment, a correction value for correcting the focus/tilt may be determined so as to reduce the difference between the focus/tilt. The correction value is calculated for each shot area position, and can be applied to each shot area of the subsequent wafer WF (second substrate).

For example, when a focus/tilt difference is obtained using the first wafer WF (first substrate), the control unit 12 controls the wafer (wafer stage) so that the focus/tilt difference is reduced during step movement. 7) Calculate (generate) a correction value for driving. Here, the correction value in this embodiment corrects at least one of the height (focus) and posture (tilt) of the substrate in the substrate state at the start of the exposure process of the second shot area 22. In this embodiment, the wafer (wafer stage 7) is driven with the substrate state at the start of the exposure process of the second shot area 22 when the correction value is applied as a target value (target focus value, target tilt value). Note that the correction value may be in the form of correcting at least one of the height (focus) and posture (tilt) of the substrate of the wafer stage (substrate holder) 7 at the start of the exposure process of the second shot area 22. That is, the correction value is a value used to correct the substrate condition or the target value of the wafer stage 7 (eg, target position, target coordinates, target focus value, target tilt value).

The correction value is calculated for each position of the shot area and stored in the storage unit. Then, the control unit 12 can apply the correction value to each shot area of the second wafer WF (second substrate) that undergoes exposure processing after the first wafer WF. Specifically, in the second wafer WF, after the exposure process of the previous shot area (first shot area 21) is completed and before the start of focus/tilt measurement of the next shot area (second shot area 22), the correction value is The focus/tilt of the second wafer WF is controlled based on this. In other words, the correction value obtained based on the focus/tilt (driving history) in the exposure process of the first wafer WF is used to correct the substrate condition or the target value of the wafer stage 7 when the second wafer WF is exposed. This is the value used for.

By applying the correction value in this way, focus/tilt control can be started before focus/tilt measurement starts. As a result, steep driving of the wafer can be reduced compared to the case where focus/tilt control is started after focus/tilt measurement is started without applying a correction value. That is, by applying the correction value, it is possible to reduce the control residual error of the wafer in the exposure process.

Here, the control unit 12 calculates a correction value for each shot area position using the first wafer WF, and calculates the correction value for the shot area selected by the user from among the plurality of shot areas on the first wafer WF. may be applied to the second wafer WF. For example, the display control unit 15 of the information processing device 200 may select a correction value for each position of the shot area according to the layout of the shot area on the wafer WF so that the user can select whether or not to apply a correction value for each position of the shot area. Then, the difference information is displayed on the display unit 17. In other words, the generation unit 15 generates difference information for each position of the shot area in accordance with the layout of the shot area on the wafer WF so that the user can select whether or not to apply a correction value for each position of the shot area. Image information to be displayed on 17 is generated. In this case, the user can refer to the difference information displayed on the display unit 17 for each position of the shot area and select the position of the shot area to which the correction value is to be applied via the input unit 18. The position information of the shot area selected by the user is supplied by the supply section 16 to the exposure apparatus 100 (control section 12). Thereby, the control unit 12 of the exposure apparatus 100 can apply the correction value to the shot area located at the same position as the shot area selected by the user among the plurality of shot areas on the subsequent second wafer WF.

Further, the control unit 12 may determine the correction value to be applied to the second wafer WF without involving the user's selection. Specifically, the control unit 12 applies, to the second wafer WF, the correction value determined for the shot area in which the difference in focus and tilt is equal to or greater than a threshold value among the plurality of shot areas on the first wafer WF. It's okay. Thereby, the correction value can be applied only to shot areas where it is predicted that the exposure accuracy will decrease significantly. In other words, it is possible to reduce the need to apply correction values to shot areas where there is a high possibility that exposure accuracy will be adversely affected by application of correction values.

Note that the selection of the correction value by the control unit 12 may be performed using machine learning or the like. However, since the result of machine learning is not 100%, it is desirable that the user selects the correction value in order to improve accuracy. In the case of this embodiment, as described above, the difference information is displayed on the display unit 17 as judgment material (evaluation index) for the user to select a correction value. Furthermore, machine learning requires sufficient learning data, but since wafer pre-processing and exposure conditions vary from time to time, it is difficult to prepare sufficient learning data. In this embodiment, since the difference information is displayed on the display unit 17, the user can select the shot area to which the correction value is applied, and there is no need to use machine learning that requires sufficient learning data.

[Operation flow of exposure equipment]
Next, the operation flow of the exposure apparatus 100 of this embodiment will be described with reference to FIG. 7. FIG. 7 is a flowchart showing the operation flow of the exposure apparatus 100 of this embodiment. Each step of the flowchart in FIG. 7 can be executed by the control unit 12. Furthermore, before starting the flowchart in FIG. 7, the wafer WF is transported onto the wafer stage 7 using a wafer transport mechanism (not shown).

In step S11, the control unit 12 moves the wafer WF in steps using the wafer stage 7 so that the target shot area for exposure processing among the plurality of shot areas on the wafer WF is placed at the exposure start position. The order of exposure processing for each of the plurality of shot areas on the wafer WF is set in advance. Next, in step S12, the control unit 12 performs exposure processing on the target shot area. In the exposure process, as described above, the focus/tilt measurement section 11 performs focus/tilt measurement prior to irradiation of the exposure light on the irradiation area 23, and the focus/tilt of the wafer WF is determined based on the measurement result. Control. In step S13, the control unit 12 stores the measurement results of the focus/tilt measurement obtained in step S12 in the storage unit.

In step S14, the control unit 12 obtains the difference between the focus tilt at the start of the exposure process in step S12 and the focus tilt at the end of the exposure process of the previous shot area as difference information. Since the difference in focus and tilt is as described above, detailed explanation will be omitted here. Here, if exposure processing has been performed on multiple wafers WF, the representative value (for example, average value) of the focus/tilt difference between the multiple wafers WF is calculated for each shot area position. It may be requested as information. Further, for the shot area where the exposure process is performed first among the plurality of shot areas on the wafer WF, the difference in focus and tilt cannot be obtained, so this step S14 may be omitted.

In step S15, the control unit 12 determines whether or not there is a shot area (hereinafter sometimes referred to as a next shot area) on the wafer WF that has not been subjected to exposure processing yet. If there is a next shot area, the next shot area is set as the target shot area, and then the process advances to step S11. On the other hand, if there is no next shot area, that is, if exposure processing has been performed on all of the plurality of shot areas on the wafer WF, the process advances to step S16.

In step S16, the control unit 12 calculates a correction value for correcting the focus/tilt so that the focus/tilt difference is reduced based on the focus/tilt difference obtained in step 14. The correction value is determined for each position of the shot area. Then, as described above, the correction value of the shot area selected by the user according to the display of the difference information among the plurality of shot areas can be applied to subsequent wafers. Alternatively, among the plurality of shot areas, the correction value of the shot area in which the focus/tilt difference is equal to or greater than the threshold value may be applied to subsequent wafers. The correction value is preferably updated sequentially for each shot area position each time the wafer exposure process is repeated.

In step S17, the control unit 12 determines whether there is a wafer WF (hereinafter sometimes referred to as next wafer WF) that has not been subjected to exposure processing yet. If there is a next wafer WF, the wafer WF on the wafer stage 7 is changed (replaced) using a wafer transport mechanism (not shown), and then the process proceeds to step S11. On the other hand, if there is no next wafer WF, the wafer WF is carried out from the wafer stage 7 using a wafer transfer mechanism (not shown), and then the flowchart ends.

[Processing flow of information processing device]
Next, the processing flow of the information processing apparatus 200 of this embodiment will be described with reference to FIG. 8. FIG. 8 is a flowchart showing the processing flow of the information processing apparatus 200 of this embodiment. Each step of the flowchart in FIG. 8 can be executed by the processing unit 13. Further, the flowchart in FIG. 8 can be executed, for example, every time the exposure process for one wafer is completed in the flowchart in FIG.

In step S21, the processing unit 13 (acquisition unit 14) acquires the difference information obtained by the exposure apparatus 100 from the exposure apparatus 100 for each position of the shot area. Next, in step S22, the processing unit 13 (display control unit, generation unit 15) displays the difference information acquired in step S21 on the display unit 17 for each position of the shot area. That is, the generation unit 15 generates image information for displaying the difference information acquired in step S21 on the display unit 17 for each position of the shot area. For example, the processing unit 13 may display the difference information on the display unit 17 for each shot area position in accordance with the layout of the shot areas on the wafer WF, or may generate image information for displaying the difference information. This allows the user to appropriately understand whether or not the cause of the decrease in exposure accuracy is due to a difference in focus and tilt.

In step S23, the processing unit 13 determines whether there is a position of the shot area selected by the user via the input unit 18. If there is a position of the shot area selected by the user, the process advances to step S24. In step S24, the processing unit 13 (supply unit 16) supplies (transmits) position information of the shot area selected by the user to the exposure apparatus 100. Thereby, the exposure apparatus 100 can apply the correction value only to the shot area located at the same position as the shot area selected by the user among the plurality of shot areas on the subsequent wafer (substrate). In other words, it becomes possible to apply the correction value to each shot area of the subsequent wafer according to the user's request.

As described above, the information processing apparatus 200 according to the present embodiment can determine the timing between the end of the exposure process of the first shot area 21 (previous shot area) and the start of scanning exposure of the second shot area 22 (next shot area). Difference information indicating the difference in focus and tilt is displayed on the display unit 17. This allows the user of the exposure apparatus 100 to appropriately understand whether or not the cause of the decrease in exposure accuracy is due to a difference in focus and tilt.

In this embodiment, the substrate state and the measurement results of the substrate have been described, but these pieces of information correspond to the state of the wafer stage (substrate holder) 7 (substrate holder state). The state of the wafer stage 7 is the focus/tilt state or its position when the wafer stage 7 is driven. In other words, the difference between the state of the substrate holder, which is the state of the wafer stage (substrate holder) 7 at the end of the exposure process for the first shot area 21, and the state of the substrate holder at the start of the exposure process for the second shot area. The difference information shown may be used as display information. Alternatively, the state of the substrate holder at the end of the exposure process of the first shot area 21 and the second shot measured from the start of the exposure process of the first shot area 21 until the start of the exposure process of the second shot area 22 It may be a difference from the measurement result of the area 22.

<Second embodiment>
A second embodiment according to the present invention will be described. In this embodiment, when exposure processing is performed over a plurality of wafers WF, statistical information (variation information, second information) indicating the variation in focus/tilt difference among the plurality of wafers WF is provided for each shot area position. An example of display on the display unit 17 will be explained. In this example, when exposure processing is performed over a plurality of wafers WF, the generation unit 15 displays statistical information on the display unit 17 indicating the variation in focus/tilt difference among the plurality of wafers WF for each position of the shot area. Generate image information for display. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for matters mentioned below.

FIG. 9 shows an example of statistical information displayed on the display unit 17. In the example of FIG. 9, the statistical information is represented by the size of a circle, and is displayed on the display unit 17 overlapping the difference information (display information). Variations in focus/tilt differences in statistical information include standard deviation and skewness. By displaying statistical information in this way, the user can better understand whether or not the cause of the decrease in exposure accuracy is due to differences in focus and tilt. It becomes possible to more appropriately select an area. For example, the user can determine, based on the display of the statistical information, that it is better not to apply the correction value to the position of the shot area where the variation is relatively large. Furthermore, by displaying multiple pieces of information including difference information and statistical information, the user can more appropriately recognize the influence of focus/tilt differences on the wafer WF manufacturing process based on the multiple pieces of information. This can lead to improvements in the manufacturing process.

Here, in the example of FIG. 9, the difference information is represented by color density and the statistical information is represented by the size of the circle, but the present invention is not limited to this, and the difference information and statistical information can be represented in other display formats. It's okay. For example, the difference information may be represented by a color type, and the statistical information may be represented by a bubble map. Further, the difference information and the statistical information may be displayed separately on the display unit 17.

<Third embodiment>
A third embodiment according to the present invention will be described. In this embodiment, an example will be described in which a correction value calculated for each position of a shot area is displayed on the display unit 17. In this example, the generation unit 15 generates image information for displaying the correction value calculated for each position of the shot area on the display unit 17. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for matters mentioned below. Further, the second embodiment may be applied to this embodiment.

FIG. 10A shows an example of how correction values are displayed on the display unit 17. In the example of FIG. 10(a), the magnitude of the correction value (i.e., the amount of wafer drive for correcting focus/tilt) is determined for each position of the shot area in accordance with the layout of the plurality of shot areas SH on the wafer WF. is expressed by color density. Here, the display of the correction value is not limited to a display that matches the layout of the plurality of shot areas SH on the wafer WF, but may be a display using a table or the like. The display of the correction value is not limited to the display based on the density of the color, but may be displayed based on the type of color or a numerical value, or may be displayed by superimposing the density or type of the color with a numerical value.

In addition, the display control unit (generation unit) 15 predicts the focus/tilt difference that will remain when applying the correction value to the subsequent wafer WF (second substrate) for each shot area position, and The results may be displayed on the display section 17. That is, the generation unit 15 predicts the focus/tilt difference that will remain when applying the correction value to the subsequent wafer WF (second substrate) for each shot area position, and displays the prediction result on the display unit 17. You may also generate image information for display on. FIG. 10B shows a display example of the prediction result of the focus/tilt difference remaining when the correction value is applied to each shot area SH of the subsequent wafer WF. As a result, the user can determine how much the focus/tilt difference will be reduced when the correction value is applied to the subsequent wafer WF, based on the display of the prediction result, and how much the focus/tilt difference will be reduced. It is possible to understand whether a difference remains. In other words, the user can more appropriately select the shot area to which the correction value is to be applied via the input unit 18 based on the display of the prediction result.

Here, in addition to the prediction result of the focus/tilt difference when the correction value is applied (FIG. 9(b)), the control unit 12 predicts the prediction result of the focus/tilt difference when the correction value is not applied. It may be displayed on the display section 17. In this case, the user can compare the prediction results with and without applying the correction value, and thus can recognize the effect of applying the correction value. In other words, the user can intuitively understand the effectiveness of the correction value and can use it to determine whether or not to apply the correction value to subsequent wafers.

<Fourth embodiment>
A fourth embodiment according to the present invention will be described. This embodiment basically inherits the first embodiment, and can follow the first embodiment except for the matters mentioned below. Furthermore, the second and third embodiments may be applied to this embodiment.

In the first embodiment, the difference information for each position of the shot area is expressed as one index, but the difference information (display information) may be divided into a plurality of directional components and displayed on the display unit 17. For example, the display control unit (generation unit) 15 divides the focus/tilt difference in the difference information into a focus component in the Z direction, a tilt component in the θX direction, and a tilt component in the θY direction, and calculates these components. They may be displayed separately on the display unit 17. That is, the generation unit 15 divides the focus/tilt difference in the difference information into a focus component in the Z direction, a tilt component in the θX direction, and a tilt component in the θY direction, and displays these components separately on the display unit 17. You may also generate image information for display on the screen. For example, the size of the focus component may be expressed by color density or color type. The magnitude of the tilt component can also be expressed by color density or color type. The direction of the tilt component may be represented by providing a gradation in the direction of change in tilt. The display of each direction component may be performed for the entire shot area, or may be performed only for the location measured by the focus/tilt measurement unit 11. This allows the user to determine which directional component has the greatest influence on the focus/tilt difference.

<Fifth embodiment>
A fifth embodiment according to the present invention will be described. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for matters mentioned below. Furthermore, the second to fourth embodiments may be applied to this embodiment.

The focus/tilt difference (difference information, display information) in the embodiment described above is the focus/tilt difference of the wafer WF driven from the end of the exposure process of the previous shot area to the start of the exposure process of the next shot area. It may also be the amount of tilt. Further, the difference in focus/tilt in the above-described embodiment can be determined by using an external measuring device without using the focus/tilt measurement unit 11, and determining the difference between the end end of the previous shot area and the start end of the next shot area. It may be a result of measuring a difference.

<Sixth embodiment>
A sixth embodiment according to the present invention will be described. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for matters mentioned below. Furthermore, the second to fifth embodiments may be applied to this embodiment.

In this embodiment, the control unit 12 applies (reflects) the correction value only to the shot area selected by the user based on the information displayed on the display unit 17 (difference information, statistical information, display information). It's okay. For example, based on the information displayed on the display unit 17, the user selects only shot areas where the correction value can be used effectively, excluding shot areas with large variations, as shot areas to which the correction value is applied. be able to.

For example, due to the structure of the wafer, there tends to be large variations in shot areas that include bonding areas and areas where resist coating unevenness is likely to occur, and applying correction values may actually reduce exposure accuracy. . By displaying the difference information and statistical information on the display unit 17, the user can appropriately select a shot area to which a correction value is applied while checking the information. Furthermore, even if the structural characteristics of such wafers are not known, selection can be made based on the dispersion index. By displaying the difference information (representative value) and statistical information (dispersion) on the display unit 17, it is possible to judge whether the correction value can be used effectively or not based on the degree of the difference. For example, even if the variation is large to some extent, it is desirable to obtain better results if the average value is sufficiently large. Furthermore, it is also possible to filter the correction values for each shot area obtained from one wafer on the time axis, select the most recent correction value that is likely to be affected, and decide whether to apply the correction value.

In addition, by selecting a plurality of wafers instead of the same wafer, the degree of influence of the wafer stage 7 (substrate holding unit including a substrate chuck) that holds the wafers can be checked from a bird's-eye view. For example, in a location where the average value is large, it can be determined that the influence is stronger on the chuck than on the wafer. In this case, in addition to effectively applying the correction value, it is also possible to consider changing the layout of the shot area.

Furthermore, in areas where the level difference is relatively small, such as near the center of the wafer, sufficient exposure accuracy may be ensured without using a correction value. For shot areas located in such locations, it is expected that the exposure accuracy will be improved even if no correction value is applied. That is, based on the display on the display unit 17, the user can determine whether to apply the correction value while checking a range such as the vicinity of the center of the wafer.

<Seventh embodiment>
A seventh embodiment according to the present invention will be described. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for matters mentioned below. Further, the second to sixth embodiments may be applied to this embodiment.

In this embodiment, difference information (display information) and exposure accuracy measurement results (inspection results) are displayed simultaneously. Specifically, the measurement results (inspection results) obtained from a measuring device (inspection device) or the like and the difference information are displayed in an overlapping manner on the display unit 17, or are displayed in a position where they can be compared. This allows the user to easily compare exposure accuracy and difference information. The generation unit 15 generates image information for displaying the difference information and the measurement result (inspection result) of exposure accuracy on the display unit 17 at the same time. The display control section 15 controls the display section 17 so as to display the difference information and the measurement result (inspection result) of the exposure accuracy on the display section 17 at the same time.

<Eighth embodiment>
An eighth embodiment according to the present invention will be described. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for matters mentioned below. Furthermore, the second to seventh embodiments may be applied to this embodiment. For example, the above embodiment described as generating image information for displaying difference information may be replaced with generating image information for displaying the information described in this embodiment. .

The generation unit 15 of the present embodiment generates one of the substrate state corresponding to at least one of the height or posture of the substrate at the start of the exposure process for each of the plurality of shot areas, and the measurement results for each of the plurality of shot areas. Image information to be displayed on the display unit 17 is generated. Here, the measurement result indicates at least one of the height or posture of the substrate.

This allows the user of the exposure apparatus to understand the cause of the decrease in exposure accuracy without calculating the difference information.

<Ninth embodiment>
A ninth embodiment according to the present invention will be described. Note that this embodiment basically inherits the first embodiment, and can follow the first embodiment except for matters mentioned below. Furthermore, the second to eighth embodiments may be applied to this embodiment.

The generation unit 15 of this embodiment is characterized in that it generates image information for displaying display information on the display unit 17 based on test results obtained from an external testing device. The external inspection device is, for example, a height detection device capable of detecting the height of each of a plurality of shot areas on the substrate. The exposure apparatus 100 or the information processing apparatus 200 generates display information based on the information detected by the detection apparatus. Then, the generation unit 15 generates image information for displaying the generated display information on the display unit 17.

Here, the display information in this embodiment may be difference information corresponding to the difference between the measurement result of the first shot area 21 and the measurement result of the second shot area 22. Alternatively, the measurement results for each of a plurality of shot areas may be used. Here, the measurement result indicates at least one of the height or posture of the substrate.

<Embodiment of article manufacturing method>
The article manufacturing method according to the embodiment of the present invention is suitable for manufacturing articles such as micro devices such as semiconductor devices and elements having fine structures. The method for manufacturing an article of the present embodiment includes a step of forming a latent image pattern on a photosensitive agent on a substrate using the above-mentioned exposure device (exposure method) (a step of exposing the substrate); It includes a process of processing (developing) a substrate and a process of manufacturing an article from the processed substrate. Additionally, such manufacturing methods include other well-known steps (oxidation, deposition, deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, etc.). The method for manufacturing an article according to the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article compared to conventional methods.

<Other Examples>
The present invention provides a system or device with a program that implements one or more functions of the embodiments described above via a network or a storage medium, and one or more processors in a computer of the system or device reads and executes the program. This can also be achieved by processing. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

<Summary of embodiments>
The disclosure of this specification includes the following exposure apparatus, exposure method, and article manufacturing method.
(Item 1)
The state of the substrate at the end of the exposure process of a first shot area among a plurality of shot areas on a substrate subjected to exposure processing by an exposure apparatus, and the exposure next to the first shot area among the plurality of shot areas. Difference information corresponding to a difference between a second shot area to be processed and the substrate state at the start of the exposure process;
The state of the substrate at the end of the exposure process of the first shot area, and the second shot measured from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Difference information corresponding to the difference between the area measurement results and
Difference information corresponding to the difference between the measurement result of the first shot area and the measurement result of the second shot area;
a substrate state corresponding to at least one of the height or posture of the substrate at the start of the exposure process for each of the plurality of shot areas;
measurement results for each of the plurality of shot areas;
An information processing device comprising: a generation unit that generates image information for displaying display information that is any of the information on a display unit.
(Item 2)
The information processing device according to item 1, wherein the substrate state and the measurement result indicate at least one of a height and a posture of the substrate.
(Item 3)
Item 1 or 2, wherein the generation unit generates the image information for displaying a distribution representing the display information on the display unit for each position of the shot area on the substrate. Information processing device.
(Item 4)
The generation unit generates the display information indicated by at least one of color density, color type, or numerical value so that the user can visually recognize the display information for each shot area position on the board. The information processing device according to any one of items 1 to 3, which generates image information.
(Item 5)
When the exposure process is performed over a plurality of substrates in the exposure process, the generation unit generates the display unit for displaying the representative value of the display information on the plurality of substrates on the display unit for each position of the shot area. The information processing device according to any one of items 1 to 4, wherein the information processing device generates image information.
(Item 6)
Item 5 is characterized in that the generation unit generates the image information for displaying statistical information indicating variations in the display information among the plurality of substrates on the display unit for each position of the shot area. The information processing device described.
(Item 7)
an acquisition unit configured to acquire information from the exposure device;
Items 1 to 1, characterized in that the generation unit generates the image information for displaying the difference information generated on the display unit based on the information acquired from the exposure device by the acquisition unit. 6. The information processing device according to any one of item 6.
(Item 8)
an acquisition unit configured to acquire information from the exposure device;
The acquisition unit acquires the display information from the exposure apparatus,
Information processing according to any one of items 1 to 6, wherein the generation unit generates the image information for displaying the display information acquired by the acquisition unit on the display unit. Device.
(Item 9)
The information processing according to any one of items 1 to 8, wherein the generation unit divides the display information into a plurality of directional components and generates the image information for displaying on the display unit. Device.
(Item 10)
The generation unit generates the display information on the display unit for each position of the shot area so that the user can select whether or not to apply the correction value for reducing the difference for each position of the shot area. 10. The information processing apparatus according to any one of items 1 to 9, wherein the information processing apparatus generates the image information to be displayed on a screen.
(Item 11)
an input unit that accepts instruction input from the user;
a supply unit that supplies positional information of the shot area selected by the user to the exposure apparatus via the input unit;
The information processing device according to item 10, further comprising:
(Item 12)
The generation unit predicts the difference that will remain at the start of the exposure process for each shot area of the subsequent substrate when a correction value for reducing the difference is applied to the subsequent substrate, and calculates the prediction. Item 1, characterized in that the image information is generated for displaying the result on the display unit so that the user can select whether or not to apply the correction value for each position of the shot area. The information processing device according to any one of items 1 to 11.
(Item 13)
The exposure device is a scanning exposure device that performs the exposure process while scanning the substrate, and in the exposure process of the second shot area, measures the surface position of the second shot area and uses the measurement result. 13. The information processing apparatus according to any one of items 1 to 12, wherein the information processing apparatus controls a substrate state or a substrate holding section that holds the substrate based on the information processing apparatus.
(Item 14)
14. The information processing apparatus according to any one of items 1 to 13, wherein the information processing apparatus is communicably connected to the exposure apparatus.
(Item 15)
The information processing device according to any one of items 1 to 13, characterized in that the information processing device is configured integrally with the exposure device as a component of the exposure device.
(Item 16)
Any one of items 1 to 15, wherein the generation unit generates the image information for simultaneously displaying the display information and the inspection result of exposure accuracy of the exposure process on the display unit. The information processing device described in .
(Item 17)
17. The information processing device according to any one of items 1 to 16, wherein the display information is information based on an inspection result of an inspection device located outside the information processing device.
(Item 18)
An information processing device communicably connected to an exposure device that performs exposure processing on each of a plurality of shot areas on a substrate,
an acquisition unit that acquires information from the exposure device;
a generation unit that generates image information to be displayed on a display unit based on the information acquired by the acquisition unit;
Equipped with
After completing the exposure process on a first shot area among the plurality of shot areas, the exposure apparatus may perform the exposure process on a second shot area after the first shot area among the plurality of shot areas. configured to measure a surface position and, based on the measurement result, control a substrate state indicating at least one of a height and a posture of the substrate in the exposure process of the second shot area;
The generation unit, based on the information acquired by the acquisition unit,
difference information corresponding to a difference between a substrate state at the end of the exposure process in the first shot area and a substrate state at the start of the exposure process in the second shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the second shot measured from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Difference information corresponding to the difference between the area measurement results and
Difference information corresponding to the difference between the measurement result of the first shot area and the measurement result of the second shot area;
a substrate state corresponding to at least one of the height or posture of the substrate at the start of the exposure process for each of the plurality of shot areas;
measurement results for each of the plurality of shot areas;
An information processing device that generates image information for displaying display information that is any of the information on a display unit.
(Item 19)
An information processing method for processing information of an exposure device that performs exposure processing on each of a plurality of shot areas on a substrate, the method comprising:
an acquisition step of acquiring information from the exposure device;
a generation step of generating image information to be displayed on a display unit based on the information acquired in the acquisition step;
including;
In the generation step,
Based on the information acquired in the acquisition step, the state of the substrate at the end of the exposure process of the first shot area among the plurality of shot areas, and the state of the substrate next to the first shot area among the plurality of shot areas. Difference information corresponding to a difference between a second shot area in which the exposure process is performed and a substrate state at the start of the exposure process;
The state of the substrate at the end of the exposure process of the first shot area, and the second shot measured from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Difference information corresponding to the difference between the area measurement results and
Difference information corresponding to the difference between the measurement result of the first shot area and the measurement result of the second shot area;
a substrate state corresponding to at least one of the height or posture of the substrate at the start of the exposure process for each of the plurality of shot areas;
measurement results for each of the plurality of shot areas;
An information processing method, comprising: generating the image information for displaying display information, which is any of the information, on the display section.
(Item 20)
A program that causes a computer to execute the information processing method described in item 19.
(Item 21)
An exposure apparatus that performs exposure processing on each of a plurality of shot areas on a substrate,
After completing the exposure process for a first shot area among the plurality of shot areas, measure the surface position of a second shot area where the exposure process is performed next to the first shot area among the plurality of shot areas. A measuring section,
in the exposure processing of the second shot area, a control unit that controls a substrate state indicating at least one of a height and a posture of the substrate or a substrate holding unit that holds the substrate based on a measurement result of the measurement unit; ,
Equipped with
The control unit includes:
difference information corresponding to a difference between a substrate state at the end of the exposure process in the first shot area and a substrate state at the start of the exposure process in the second shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the second shot measured from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Difference information corresponding to the difference between the area measurement results and
Difference information corresponding to the difference between the measurement result of the first shot area and the measurement result of the second shot area;
a substrate state corresponding to at least one of the height or posture of the substrate at the start of the exposure process for each of the plurality of shot areas;
measurement results for each of the plurality of shot areas;
An exposure apparatus that generates image information for displaying display information, which is any of the information, on a display section.
(Item 22)
An exposure method that performs exposure processing on each of a plurality of shot areas on a substrate,
After completing the exposure process for a first shot area among the plurality of shot areas, measure the surface position of a second shot area where the exposure process is performed next to the first shot area among the plurality of shot areas. measurement process,
In the exposure process of the second shot area, a control step of controlling a substrate state indicating at least one of a height and a posture of the substrate or a substrate holder that holds the substrate based on the measurement result of the measurement step; ,
a generation step of generating image information to be displayed on the display unit,
In the generation step,
difference information corresponding to a difference between a substrate state at the end of the exposure process in the first shot area and a substrate state at the start of the exposure process in the second shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the second shot measured from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Difference information corresponding to the difference between the area measurement results and
Difference information corresponding to the difference between the measurement result of the first shot area and the measurement result of the second shot area;
a substrate state corresponding to at least one of the height or posture of the substrate at the start of the exposure process for each of the plurality of shot areas;
measurement results for each of the plurality of shot areas;
An exposure method comprising: generating the image information for displaying any one of the display information on the display section.
(Item 23)
an exposure step of exposing the substrate using the exposure method described in item 22;
a processing step of processing the substrate exposed in the exposure step,
A method for manufacturing an article, comprising manufacturing an article from the substrate processed in the processing step.

The invention is not limited to the embodiments described above, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the following claims are hereby appended to disclose the scope of the invention.

4: Reticle stage, 7: Wafer stage, 8: Illumination optical system, 9: Projection optical system, 11: Focus measurement section, 12: Control section, LT: Reticle (original), WF: Wafer (substrate), 100: Exposure Device,
13: processing unit, 14: acquisition unit, 15: display control unit (generation unit), 16: supply unit, 17: display unit, 18: input unit, 200: information processing device

Claims (35)

A substrate state indicating at least one of the height or posture of the substrate at the end of the exposure process of a first shot area among a plurality of shot areas on the substrate subjected to exposure processing by an exposure apparatus, and the plurality of shot areas. generating image information for displaying on a display unit display information corresponding to a difference from the substrate state at the start of the exposure process of a second shot area where the exposure process is performed next to the first shot area; An information processing device characterized by having a generation unit that generates. A substrate state indicating at least one of the height or posture of the substrate at the end of the exposure process of a first shot area among a plurality of shot areas on the substrate subjected to exposure processing by an exposure apparatus, and the first shot area The surface of the substrate for the second shot area after the exposure process starts and before the exposure process starts for the second shot area where the exposure process is performed next to the first shot area among the plurality of shot areas. An information processing device comprising: a generation unit that generates image information for displaying display information on a display unit corresponding to a difference from a measurement result obtained by measuring a position. A measurement result obtained by measuring a surface position of the substrate at a position where the exposure process of a first shot area ends among a plurality of shot areas on the substrate where exposure processing is performed by an exposure apparatus, and the plurality of shots. This corresponds to the difference between the measurement result obtained by measuring the surface position of the substrate at the position where the exposure process starts in the second shot area where the exposure process is performed next to the first shot area among the areas. An information processing device characterized by having a generation section that generates image information for displaying display information on a display section. Information indicating at least one of the height or posture of a first shot area at a position where the exposure process ends among a plurality of shot areas on a substrate subjected to exposure processing by an exposure apparatus; Displaying on the display section display information corresponding to the difference between information indicating at least one of the height or posture at the position where the exposure process is started of the second shot area where the exposure process is performed next to the first shot area. An information processing device comprising a generation unit that generates image information for. 5. The generating unit generates the image information for displaying on the display unit a distribution representing the display information for each position of the shot area on the substrate. The information processing device according to item 1. The generation unit generates the display information indicated by at least one of color density, color type, or numerical value so that the user can visually recognize the display information for each shot area position on the board. 5. The information processing apparatus according to claim 1, wherein the information processing apparatus generates image information. When the exposure process is performed over a plurality of substrates in the exposure process, the generation unit generates the display unit for displaying the representative value of the display information on the plurality of substrates on the display unit for each position of the shot area. 5. The information processing apparatus according to claim 1, wherein the information processing apparatus generates image information. When the exposure process is performed over a plurality of substrates in the exposure process, the generation unit causes the display unit to display statistical information indicating variations in the display information on the plurality of substrates for each shot area position. The information processing apparatus according to any one of claims 1 to 4, wherein the information processing apparatus generates the image information for. an acquisition unit configured to acquire information from the exposure device;
1 . The generating unit generates the image information for displaying the display information generated based on the information acquired from the exposure device by the acquiring unit on the display unit. 10 . 5. The information processing device according to any one of 4 to 4. an acquisition unit configured to acquire information from the exposure device;
The acquisition unit acquires the display information from the exposure apparatus,
The information according to any one of claims 1 to 4, wherein the generation unit generates the image information for displaying the display information acquired by the acquisition unit on the display unit. Processing equipment. The information according to any one of claims 1 to 4, wherein the generation unit divides the display information into a plurality of directional components and generates the image information to be displayed on the display unit. Processing equipment. The generation unit generates the display information on the display unit for each position of the shot area so that the user can select whether or not to apply the correction value for reducing the difference for each position of the shot area. 5. The information processing apparatus according to claim 1, wherein the information processing apparatus generates the image information to be displayed on a screen. an input unit that accepts instruction input from the user;
a supply unit that supplies positional information of the shot area selected by the user to the exposure apparatus via the input unit;
The information processing device according to claim 12, further comprising: The generation unit predicts the difference that will remain at the start of the exposure process for each shot area of the subsequent substrate when a correction value for reducing the difference is applied to the subsequent substrate, and calculates the prediction. 5. The image information for displaying the result on the display unit so that the user can select whether or not to apply the correction value for each position of a shot area is generated. 5. The information processing device according to any one of 1 to 4. The exposure device is a scanning exposure device that performs the exposure process while scanning the substrate, and in the exposure process of the second shot area, measures the surface position of the second shot area and uses the measurement result. The information processing apparatus according to any one of claims 1 to 4, wherein the information processing apparatus controls a substrate state or a substrate holding section that holds the substrate based on the information processing apparatus. 5. The information processing apparatus according to claim 1, wherein the information processing apparatus is communicably connected to the exposure apparatus. 5. The information processing apparatus according to claim 1, wherein the information processing apparatus is configured integrally with the exposure apparatus as a component of the exposure apparatus. 5. The generating section generates the image information for simultaneously displaying the display information and the inspection result of exposure accuracy of the exposure process on the display section. The information processing device described in section. The information processing device according to any one of claims 1 to 4, wherein the display information is information based on an inspection result of an inspection device located outside the information processing device. An information processing device communicably connected to an exposure device that performs exposure processing on each of a plurality of shot areas on a substrate,
an acquisition unit that acquires information from the exposure device;
a generation unit that generates image information to be displayed on a display unit based on the information acquired by the acquisition unit;
Equipped with
After completing the exposure process on a first shot area among the plurality of shot areas, the exposure apparatus may perform the exposure process on a second shot area after the first shot area among the plurality of shot areas. configured to measure a surface position and, based on the measurement result, control a substrate state indicating at least one of a height and a posture of the substrate in the exposure process of the second shot area;
The generation unit, based on the information acquired by the acquisition unit,
information corresponding to the difference between the substrate state at the end of the exposure process in the first shot area and the substrate state at the start of the exposure process in the second shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
An information processing device that generates image information for displaying display information that is any of the information on a display unit. A substrate state indicating at least one of the height or posture of the substrate at the end of the exposure process of a first shot area among a plurality of shot areas on the substrate subjected to exposure processing by an exposure apparatus, and the plurality of shot areas. information corresponding to a difference from the substrate state at the start of the exposure process of a second shot area where the exposure process is performed next to the first shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
the substrate state at the start of the exposure process for each of the plurality of shot areas ;
It has a generation unit that generates image information for displaying display information that is any of the information on the display unit,
When the exposure process is performed over a plurality of substrates in the exposure process, the generation unit generates the display unit for displaying the representative value of the display information on the plurality of substrates on the display unit for each position of the shot area. An information processing device characterized by generating image information. A substrate state indicating at least one of the height or posture of the substrate at the end of the exposure process of a first shot area among a plurality of shot areas on the substrate subjected to exposure processing by an exposure apparatus, and the plurality of shot areas. information corresponding to a difference from the substrate state at the start of the exposure process of a second shot area where the exposure process is performed next to the first shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
the substrate state at the start of the exposure process for each of the plurality of shot areas ;
It has a generation unit that generates image information for displaying display information that is any of the information on the display unit,
When the exposure process is performed over a plurality of substrates in the exposure process, the generation unit causes the display unit to display statistical information indicating variations in the display information on the plurality of substrates for each shot area position. An information processing device characterized in that the information processing device generates the image information for. A substrate state indicating at least one of the height or posture of the substrate at the end of the exposure process of a first shot area among a plurality of shot areas on the substrate subjected to exposure processing by an exposure apparatus, and the plurality of shot areas. information corresponding to a difference from the substrate state at the start of the exposure process of a second shot area where the exposure process is performed next to the first shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
the substrate state at the start of the exposure process for each of the plurality of shot areas ;
It has a generation unit that generates image information for displaying display information that is any of the information on the display unit,
The information processing device is characterized in that the generation unit divides the display information into a plurality of directional components and generates the image information to be displayed on the display unit. A substrate state indicating at least one of the height or posture of the substrate at the end of the exposure process of a first shot area among a plurality of shot areas on the substrate subjected to exposure processing by an exposure apparatus, and the plurality of shot areas. information corresponding to a difference from the substrate state at the start of the exposure process of a second shot area where the exposure process is performed next to the first shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
a generation unit that generates image information for displaying display information on a display unit;
an input section that accepts user instruction input;
a supply unit that supplies positional information of the shot area selected by the user to the exposure apparatus via the input unit;
The generation unit generates the display information for each shot area position so that the user can select whether or not to apply a correction value for reducing the difference for each shot area position. generating the image information to be displayed on the section;
An information processing device characterized by: A substrate state indicating at least one of the height or posture of the substrate at the end of the exposure process of a first shot area among a plurality of shot areas on the substrate subjected to exposure processing by an exposure apparatus, and the plurality of shot areas. information corresponding to a difference from the substrate state at the start of the exposure process of a second shot area where the exposure process is performed next to the first shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
It has a generation unit that generates image information for displaying display information that is any of the information on the display unit,
The generation unit predicts the difference that will remain at the start of the exposure process for each shot area of the subsequent substrate when a correction value for reducing the difference is applied to the subsequent substrate, and calculates the prediction. generating the image information for displaying the result on the display unit so that the user can select whether or not to apply the correction value for each position of the shot area;
An information processing device characterized by: A substrate state indicating at least one of the height or posture of the substrate at the end of the exposure process of a first shot area among a plurality of shot areas on the substrate subjected to exposure processing by an exposure apparatus, and the plurality of shot areas. information corresponding to a difference from the substrate state at the start of the exposure process of a second shot area where the exposure process is performed next to the first shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
the substrate state at the start of the exposure process for each of the plurality of shot areas ;
It has a generation unit that generates image information for displaying display information that is any of the information on the display unit,
The information processing device is characterized in that the generation unit generates the image information for simultaneously displaying the display information and the inspection result of exposure accuracy of the exposure process on the display unit. An information processing method for processing information of an exposure device that performs exposure processing on each of a plurality of shot areas on a substrate, the method comprising:
an acquisition step of acquiring information from the exposure device;
a generation step of generating image information to be displayed on a display unit based on the information acquired in the acquisition step;
including;
In the generation step,
Based on the information acquired in the acquisition step, a substrate state indicating at least one of the height or posture of the substrate at the end of the exposure process of the first shot area among the plurality of shot areas; Information corresponding to a difference from the substrate state at the time of starting the exposure process of a second shot area in which the exposure process is performed next to the first shot area among the shot areas;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
An information processing method, comprising: generating the image information for displaying display information, which is any of the information, on the display section. An information processing method for processing information of an exposure device that performs exposure processing on each of a plurality of shot areas on a substrate, the method comprising:
an acquisition step of acquiring information from the exposure device;
a generation step of generating image information to be displayed on a display unit based on the information acquired in the acquisition step;
including;
In the generation step, based on the information acquired in the acquisition step, information indicating at least one of a height or a posture of a first shot region among the plurality of shot regions at a position where the exposure process ends; A display corresponding to a difference from information indicating at least one of a height or a posture at a position where the exposure process is started of a second shot area in which the exposure process is performed next to the first shot area among a plurality of shot areas. An information processing method, comprising: generating the image information for displaying information on the display unit. A program that causes a computer to execute the information processing method according to claim 27 or 28. An exposure apparatus that performs exposure processing on each of a plurality of shot areas on a substrate,
After completing the exposure process for a first shot area among the plurality of shot areas, measure the surface position of a second shot area where the exposure process is performed next to the first shot area among the plurality of shot areas. A measurement section;
in the exposure processing of the second shot area, a control unit that controls a substrate state indicating at least one of a height and a posture of the substrate or a substrate holding unit that holds the substrate based on a measurement result of the measurement unit; ,
Equipped with
The control unit includes:
information corresponding to the difference between the substrate state at the end of the exposure process in the first shot area and the substrate state at the start of the exposure process in the second shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
An exposure apparatus that generates image information for displaying display information, which is any of the information, on a display section. An exposure apparatus that performs exposure processing on each of a plurality of shot areas on a substrate,
After completing the exposure process for a first shot area among the plurality of shot areas, measure the surface position of a second shot area where the exposure process is performed next to the first shot area among the plurality of shot areas. A measurement section;
in the exposure processing of the second shot area, a control unit that controls a substrate state indicating at least one of a height and a posture of the substrate or a substrate holding unit that holds the substrate based on a measurement result of the measurement unit; ,
Equipped with
The control unit includes information indicating at least one of a height or an attitude of the first shot area at a position where the exposure process ends, and a height or an attitude of the second shot area at a position where the exposure process starts. What is claimed is: 1. An exposure apparatus that generates image information for displaying on a display section display information corresponding to a difference between information indicating at least one of the following. An exposure method that performs exposure processing on each of a plurality of shot areas on a substrate,
After completing the exposure process for a first shot area among the plurality of shot areas, measure the surface position of a second shot area where the exposure process is performed next to the first shot area among the plurality of shot areas. measurement process,
In the exposure process of the second shot area, a control step of controlling a substrate state indicating at least one of a height and a posture of the substrate or a substrate holder that holds the substrate based on the measurement result of the measurement step; ,
a generation step of generating image information to be displayed on the display unit,
In the generation step,
information corresponding to the difference between the substrate state at the end of the exposure process in the first shot area and the substrate state at the start of the exposure process in the second shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to the difference from the measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
An exposure method comprising: generating the image information for displaying any one of the display information on the display section. An exposure method that performs exposure processing on each of a plurality of shot areas on a substrate,
After completing the exposure process for a first shot area among the plurality of shot areas, measure the surface position of a second shot area where the exposure process is performed next to the first shot area among the plurality of shot areas. measurement process,
In the exposure process of the second shot area, a control step of controlling a substrate state indicating at least one of a height and a posture of the substrate or a substrate holder that holds the substrate based on the measurement result of the measurement step; ,
a generation step of generating image information to be displayed on the display unit,
In the generation step, information indicating at least one of the height or orientation of the first shot area at the position where the exposure process ends, and the height or orientation of the second shot area at the position where the exposure process starts. An exposure method comprising: generating the image information for displaying on the display section display information corresponding to a difference from information indicating at least one of the above. an exposure step of performing exposure processing on each of the plurality of shot areas on the substrate;
a processing step of processing the substrate exposed in the exposure step;
a manufacturing step of manufacturing an article from the substrate processed in the processing step;
including;
The exposure step includes:
After completing the exposure process for a first shot area among the plurality of shot areas, measure the surface position of a second shot area where the exposure process is performed next to the first shot area among the plurality of shot areas. measurement process,
In the exposure process of the second shot area, a control step of controlling a substrate state indicating at least one of a height and a posture of the substrate or a substrate holder that holds the substrate based on the measurement result of the measurement step; ,
a generation step of generating image information to be displayed on the display unit,
In the generation step,
information corresponding to the difference between the substrate state at the end of the exposure process in the first shot area and the substrate state at the start of the exposure process in the second shot area;
The state of the substrate at the end of the exposure process of the first shot area, and the state of the second shot area from the start of the exposure process of the first shot area until the start of the exposure process of the second shot area. Information corresponding to a difference from a measurement result obtained by measuring the surface position of the substrate;
Measurement results obtained by measuring the surface position of the substrate at the position where the exposure process ends in the first shot area, and the surface position of the substrate at the position where the exposure process starts in the second shot area. Information corresponding to the difference between the measurement results obtained by measuring the
generating the image information for displaying display information on the display unit;
A method of manufacturing an article characterized by: an exposure step of performing exposure processing on each of the plurality of shot areas on the substrate;
a processing step of processing the substrate exposed in the exposure step;
a manufacturing step of manufacturing an article from the substrate processed in the processing step;
including;
The exposure step includes:
After completing the exposure process for a first shot area among the plurality of shot areas, measure the surface position of a second shot area where the exposure process is performed next to the first shot area among the plurality of shot areas. measurement process,
In the exposure process of the second shot area, a control step of controlling a substrate state indicating at least one of a height and a posture of the substrate or a substrate holder that holds the substrate based on the measurement result of the measurement step; ,
a generation step of generating image information to be displayed on the display unit,
In the generation step, information indicating at least one of the height or orientation of the first shot area at the position where the exposure process ends, and the height or orientation of the second shot area at the position where the exposure process starts. A method for manufacturing an article, comprising: generating the image information for displaying on the display section display information corresponding to a difference from information indicating at least one of the above.