JP2008004792A - Substrate processor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve easy transition between a production information screen and a trace data screen. <P>SOLUTION: A system for linking a production information screen with a trace data screen comprises a production information file folder for saving production information files, and a trace data file folder for saving trace data files. The production information filename is composed of a wafer number and the date and time of forming the production information file, and the trace data filename is composed of a wafer number and the date and time of forming the trace data file. Retrieving between the production information filename and the trace data filename enables the transition between the production information screen and the trace data screen. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus, and more particularly, to a system that displays a production information file and a trace data file in association with each other. For example, in a semiconductor integrated circuit device (hereinafter referred to as IC) manufacturing factory, The present invention relates to a substrate processing apparatus that is effective for use in a substrate processing apparatus for forming a metal film, an insulating film, and a semiconductor film on a semiconductor wafer (hereinafter referred to as a wafer) in which an integrated circuit including the integrated circuit is formed.

In an IC manufacturing factory, as a substrate processing apparatus for forming a metal film, an insulating film and a semiconductor film on a wafer, a trace data file folder for storing a trace data file is provided separately from a production information file folder for storing a production information file. For example, when an abnormality is found in a processed wafer, there is a structure in which a trace data file can be opened to investigate the cause of the abnormality. For example, see Patent Document 1.
Japanese Patent Laid-Open No. 10-312259

However, since the production information file and the trace data file are individually managed by the production information file folder and the trace data file folder in the substrate processing apparatus described above, the production information file and the trace data are displayed on the operation screen of the display device. Each data file is opened and displayed, and the operator checks the start time, end time, recipe name, etc. on each screen visually to search for trace data necessary for pursuing the cause of the occurrence of an abnormality, for example. .
Therefore, since it is not possible to easily compare the production information and the trace data, it takes time to go back and forth between the production information file and the trace data file.
For example, when moving from a production information file to a trace data file, press the button on the production information file display screen to open the production information file selection screen, and then press the date selection button to select the file once. A screen is opened, and a desired file is selected from the wafer identifier (wafer ID), date and time on this screen. Then, a desired file is selected and displayed on the trace data file selection screen.
Since the above procedure is required for each wafer, it is extremely troublesome.

  An object of the present invention is to provide a substrate processing apparatus capable of solving the troublesomeness of going back and forth between a production information file and a trace data file, which is a conventional problem.

Representative inventions disclosed in the present application are as follows.
(1) When a substrate is processed, a transfer information screen that displays the transfer information of the substrate in association with a carrier and a substrate, a processing screen that displays the contents of a production information file that stores processing conditions of the substrate, and the like In a substrate processing apparatus comprising a trace screen for displaying the contents of a trace data file for storing trace data, and a display unit for displaying
The conveyance information screen has switching means for switching the screen,
When the switching means is selected, the substrate processing apparatus is switched to the processing screen or the trace screen related to the substrate selected on the screen.
(2) In a substrate processing apparatus comprising a production information file folder for storing a production information file and a trace data file folder for storing a trace data file,
A production information file name is constituted by a board identifier and the creation date and time of the production information file,
The trace data file name is constituted by the board identifier and the creation date and time of the trace data file,
A transition between the production information screen displaying the production information file and the trace data screen displaying the trace data file is performed by searching between the production information file name and the trace data file name. Substrate processing equipment.
(3) A transfer history screen having a transfer history file folder for storing a transfer history file in which a carrier transfer information is recorded in association with a carrier and the substrate identifier, and the transfer history file is opened and displayed. The substrate processing apparatus according to (2), wherein when the substrate identifier is selected above, the production information screen or the trace data screen is displayed.
(4) The transition between the production information screen and the trace data screen is executed by pressing a screen switching manual displayed on the production information screen and the trace data screen (2) The substrate processing apparatus according to (3).
(5) The substrate processing apparatus according to any one of (1) to (4), wherein the switching unit is configured as a pop-up screen.

According to the above (2), when a desired production information file name is selected on the production information screen when shifting from the production information screen to the trace data screen, the trace data with the trace data file name matching the production information file name is selected. The file is automatically opened and the trace data screen is displayed on the operation screen.
Therefore, the operator can easily browse desired trace data.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

In the present embodiment, the substrate processing apparatus according to the present invention is configured as a multi-chamber type continuous processing apparatus (hereinafter referred to as a continuous processing apparatus) as shown in FIGS. The continuous processing apparatus is used in a film forming process in which a desired thin film is deposited on a wafer in an IC manufacturing method.
In the continuous processing apparatus according to the present embodiment, a FOUP (front opening unified pod, hereinafter referred to as a pod) is used as a carrier for wafer transfer.
In the following description, front, rear, left and right are based on FIG. That is, the second wafer transfer chamber 40 side is the front side, the opposite side, that is, the first wafer transfer chamber 10 side is the rear side, the first auxiliary chamber 20 side is the left side, and the second auxiliary chamber 30 side is the right side.

  As shown in FIGS. 1 and 2, the continuous processing apparatus includes a first wafer transfer chamber 10 as a transfer chamber, and the first wafer transfer chamber 10 has a pressure (negative pressure) less than atmospheric pressure. It has a load lock chamber structure that can withstand A housing (hereinafter referred to as a negative pressure transfer chamber housing) 11 of a first wafer transfer chamber (hereinafter referred to as a negative pressure transfer chamber) 11 has a box shape in which a plan view is hexagonal and both upper and lower ends are closed. Is formed.

At the center of the negative pressure transfer chamber 10, a wafer transfer device 12 is installed as a transfer device that holds and transfers the wafer. The wafer transfer device 12 transfers the wafer W under a negative pressure. It is configured. A wafer transfer device (hereinafter referred to as a negative pressure transfer device) 12 is configured by a SCARA robot and is installed on the bottom wall of the negative pressure transfer chamber casing 11. The elevator 13 is configured to move up and down while maintaining an airtight seal.
The negative pressure transfer device 12 includes a pair of arms 14 and 15 as a holding unit that holds the wafer W. An upper end effector 16 formed in a bifurcated fork shape is attached to a distal end portion of a first arm (hereinafter referred to as an upper arm) 14 positioned on the upper side, and a second arm (hereinafter referred to as a lower arm) (hereinafter referred to as an upper end effector 16). The lower end effector 17 is attached to the tip of 15.

Of the six side walls of the negative pressure transfer chamber casing 11, two side walls located on the front side are first spare chambers as spare chambers for loading and unloading the wafers W with respect to the negative pressure transfer chamber 10. 20 and the second preliminary chamber 30 are connected adjacently.
Both the casing of the first preliminary chamber 20 (hereinafter referred to as the first preliminary chamber casing) 21 and the casing of the second preliminary chamber 30 (hereinafter referred to as the second preliminary chamber casing) 31 have a plan view. It is formed in a box shape in which both upper and lower ends are closed substantially in the shape of a rectangle, and has a load lock chamber structure that can withstand negative pressure.

Loading / unloading ports 22 and 23 are respectively formed on the side wall of the first preliminary chamber housing 21 and the side wall of the negative pressure transfer chamber housing 11 which are adjacent to each other, and the loading / unloading port 23 on the negative pressure transfer chamber 10 side. Is provided with a gate valve 24 for opening and closing the loading / unloading ports 22 and 23. The first preliminary chamber 20 is provided with a first preliminary chamber temporary table 25.
Loading / unloading ports 32 and 33 are respectively formed on the side wall of the second auxiliary chamber housing 31 and the side wall of the negative pressure transfer chamber housing 11 which are adjacent to each other, and the loading / unloading port 33 on the negative pressure transfer chamber 10 side. Is provided with a gate valve 34 for opening and closing the loading / unloading ports 32 and 33. The second preliminary chamber 30 is provided with a second preliminary chamber temporary table 35.

On the front side of the first preliminary chamber 20 and the second preliminary chamber 30, a second wafer transfer chamber (hereinafter referred to as a positive pressure transfer chamber) configured to maintain a pressure (positive pressure) that is equal to or higher than atmospheric pressure. ) 40 are connected adjacent to each other, and the casing of the positive pressure transfer chamber 40 (hereinafter referred to as a positive pressure transfer chamber casing) 41 is a box shape in which the upper and lower ends are closed in a horizontally long rectangle in plan view. Is formed.
The positive pressure transfer chamber 40 is provided with a second wafer transfer device (hereinafter referred to as a positive pressure transfer device) 42 for transferring the wafer W under positive pressure. The positive pressure transfer device 42 is a scalar type. The robot is configured so that two wafers can be transferred simultaneously.
The positive pressure transfer device 42 is configured to be moved up and down by an elevator 43 installed in the positive pressure transfer chamber 40 and is configured to be reciprocated in the left-right direction by a linear actuator 44.

Loading / unloading outlets 26 and 27 are respectively formed on the side wall of the first preliminary chamber housing 21 and the side wall of the positive pressure transfer chamber housing 41 which are adjacent to each other, and the loading / unloading port 27 on the positive pressure transfer chamber 40 side. Is provided with a gate valve 28 for opening and closing the loading / unloading outlets 26 and 27.
Loading / unloading ports 36 and 37 are respectively formed on the side wall of the second preliminary chamber housing 31 and the side wall of the positive pressure transfer chamber housing 41 adjacent to each other, and the loading / unloading port 37 on the positive pressure transfer chamber 40 side. Is provided with a gate valve 38 for opening and closing the loading / unloading ports 36 and 37.
As shown in FIG. 1, a notch aligning device 45 is installed on the left side of the positive pressure transfer chamber 40.
Further, as shown in FIG. 2, a clean unit 46 for supplying clean air is installed in the upper part of the positive pressure transfer chamber 40.

  As shown in FIGS. 1 and 2, three wafer loading / unloading ports 47, 48, and 49 are arranged in the left-right direction on the front wall of the positive pressure transfer chamber housing 41. The wafer loading / unloading ports 47, 48 and 49 are set so that the wafer W can be loaded into and unloaded from the positive pressure transfer chamber 40. Pod openers 50 are respectively installed at the wafer loading / unloading ports 47, 48 and 49.

The pod opener 50 includes a mounting table 51 for mounting the pod P, and a cap attaching / detaching mechanism 52 for mounting and removing the cap of the pod P mounted on the mounting table 51, and the pod P mounted on the mounting table 51. The cap insertion / removal mechanism 52 is used to open / close the pod P wafer opening / closing port.
The pod P is supplied to and discharged from the mounting table 51 of the pod opener 50 by an in-process transfer device (RGV) (not shown). Therefore, the mounting table 51 constitutes a pod stage as a carrier stage.

As shown in FIG. 1, two side walls located on the back side among the six side walls of the negative pressure transfer chamber housing 11 have a first CVD module 61 as a first processing module, A second CVD module 62 as a second processing module is connected adjacently. Each of the first CVD module 61 and the second CVD module 62 is constituted by a single wafer type CVD apparatus (single wafer type cold wall type CVD apparatus).
Further, the remaining two opposite side walls of the six side walls in the negative pressure transfer chamber housing 11 have a first cooling module 63 as a third processing module and a second cooling module as a fourth processing module. Two cooling modules 64 are connected to each other, and both the first cooling module 63 and the second cooling module 64 are configured to cool the processed wafer W.
In FIG. 1, reference numerals 65, 66, 67, and 68 denote wafer loading / unloading exits.

The continuous processing apparatus includes the control system 70 shown in FIG.
As shown in FIG. 3, the control system 70 includes a main controller 71 constructed from a personal computer or the like. The main controller 71 includes a sub controller 73 that controls the negative pressure transfer device 12, a sub controller 74 that controls the positive pressure transfer device 42, and a first CVD module (first processing module) 61 via the LAN system 72. Sub controller 75 for controlling, sub controller 76 for controlling second CVD module (second processing module) 62, sub controller 77 for controlling first cooling module (third processing module) 63, second cooling module (fourth processing) A sub-controller 78 for controlling the module 64 is connected.
The main controller 71 includes an input device 81 configured by input means such as a keyboard and a mouse, a display device 82 configured by a display unit (operation screen) such as a television monitor, and a storage device configured by a storage medium driving device. 83 etc. are connected.
The main controller can be connected to the host computer 84.

  The main controller 71 includes a GUI (graphical user interface) 85. The GUI 85 switches the screen by selecting and clicking an icon (graphic symbol representing a function) displayed on the display device 82 by pointing with the mouse pointer and clicking and determining with the cursor. Or software that makes it possible to input processes, instructions, judgments, and data (information).

The main controller 71 incorporates a program 86 (hereinafter referred to as a linkage program) that displays the production information file and the trace data file in a linked manner.
The linkage program 86 includes a production information file folder 87 as a first storage unit for storing production information files, a trace data file folder 88 as a second storage unit for storing trace data files, a pod P, and a wafer W. Are associated with each other, and the transfer history file folder 89 as third storage means for storing the transfer information of the wafer W and the linking unit 90 are associated with each other.
The linking unit 90 configures the production information file name with the wafer identifier and the creation date and time of the production information file, and configures the trace data file name with the wafer identifier and the creation date and time of the trace data file, By performing a search between the information file name and the trace data file name, the display of the production information file and the transition between the display of the trace data file are performed.
That is, the linkage program 86 is configured to execute a process flow described later.

Here, the production information is data that is stored in a designated method in accordance with a logging condition table in accordance with a designated condition, and a recipe step number (step ID), a data type, and a method are associated with each other. Are collected as one piece of data.
Data types include step time, temperature, pressure, gas flow rate, etc., and methods include maximum value, average value, minimum value, actual measurement value, set value, error, and the like.
The logging condition table is as shown in Table 1 below.

The trace data is raw data when actually produced. For example, the sub-controller 75 of the first CVD module 61 creates the trace data based on the measurement data and the sequence.
The trace data is displayed as a graph or the like and can be referred to on the operation screen of the display device 82 such as the main controller 71.

In the present embodiment, the wafer identifier is virtually given by the main controller 71 as a unique serial number (so-called serial number) for each wafer.
Since the wafer identifier (hereinafter referred to as the wafer number) according to the present embodiment is virtually given without being displayed on the wafer itself, the wafer W handled in the continuous processing apparatus is returned to the original slot in the pod P. There is a need.
Therefore, in the present embodiment, in order to place the individual wafers W in association with the positions of the slots of the pods P after the wafers W are taken out from the pods P in the continuous processing apparatus, the transfer information of the individual wafers W is set. A transfer history file folder 89 is provided for managing and storing the file number by each wafer number.

Hereinafter, an operation method of the continuous processing apparatus according to the above configuration will be described.
First, the operation of the continuous processing apparatus according to the wafer flow will be described in accordance with the film forming step (process) in the IC manufacturing method.
From now on, with 25 wafers W to be deposited in the pod P, the wafer W is transported by the in-process transport apparatus to the continuous processing apparatus for performing the film forming process.
As shown in FIGS. 1 and 2, the pod P that has been transferred is delivered from the in-process transfer device and mounted on the mounting table 51 of the pod opener 50 in the first preliminary chamber 20. . The cap of the pod P is removed by the cap attaching / detaching mechanism 52, and the wafer loading / unloading port of the pod P is opened.

When the pod P is opened by the pod opener 50, the positive pressure transfer device 42 installed in the positive pressure transfer chamber 40 picks up the wafers W from the pod P one by one through the wafer loading / unloading port 47, and the first preliminary transfer is performed. The chamber 20 is loaded (wafer loading) through the loading / unloading ports 26 and 27, and the wafer W is transferred to the first preliminary chamber temporary table 25.
During this transfer operation, the carry-in / out ports 22 and 23 on the negative pressure transfer chamber 10 side are closed by the gate valve 24, and the negative pressure in the negative pressure transfer chamber 10 is maintained.

When the transfer of the wafer W in the pod P to the temporary storage table 25 for the first preliminary chamber is completed, the loading / unloading outlets 26 and 27 on the positive pressure transfer chamber 40 side are closed by the gate valve 28, and the first preliminary chamber is closed. 20 is exhausted to a negative pressure by an exhaust device (not shown).
When the first preliminary chamber 20 is depressurized to a preset pressure value, the loading / unloading ports 22 and 23 on the negative pressure transfer chamber 10 side are opened by the gate valve 24.

Next, the negative pressure transfer device 12 in the negative pressure transfer chamber 10 picks up the wafers W before processing from the temporary storage table 25 for the first preliminary chamber through the loading / unloading ports 22 and 23 one by one, and transfers the negative pressure. Carry it into the chamber 10.
For example, the negative pressure transfer device 12 transfers the wafer W before processing to the wafer carry-in / out port 65 of the first CVD module 61, and from the wafer carry-in / out port 65, the single-wafer CVD device 61 serving as the first CVD module 61. The wafer is loaded into the processing chamber (wafer loading).

  When the predetermined film forming process is completed in the first CVD module 61, the wafer W after the film forming process (film-formed) is picked up from the first CVD module 61 by the negative pressure transfer device 12 and maintained at a negative pressure. The negative pressure transfer chamber 10 is unloaded from the wafer loading / unloading port 65 of the first CVD module 61.

When the wafer W after the film formation process is carried out from the first CVD module 61 to the negative pressure transfer chamber 10, the negative pressure transfer device 12 carries the wafer W after the film formation process into the cooling chamber of the first cooling module 63. While carrying in through the carry-out port 67 and the gate 67A, it is transferred to the wafer mounting table in the cooling chamber.
The wafer W is cooled in the first cooling module 63.

  When a preset cooling time has elapsed in the first cooling module 63, the wafer W after the cooling process is picked up from the first cooling module 63 by the negative pressure transfer device 12, and the loading / unloading port of the negative pressure transfer chamber 10 is carried out. 23, is carried out to the first preliminary chamber 20 through the loading / unloading outlet 23, and is transferred to the first preliminary chamber temporary placing table 25.

After the load lock of the first preliminary chamber 20 is released, the wafer loading / unloading port 47 corresponding to the first preliminary chamber 20 of the positive pressure transfer chamber 40 is opened by the pod opener 50 and mounted on the mounting table 51. The cap of the empty pod P is opened by the pod opener 50.
Subsequently, the positive pressure transfer device 42 in the positive pressure transfer chamber 40 picks up the wafer W from the first preliminary chamber temporary placement table 25 through the loading / unloading outlet 27 and carries it out to the positive pressure transfer chamber 40. The wafer is stored (charged) in the pod P through the wafer loading / unloading port 47 of the transfer chamber 40.

When the storage of the 25 processed wafers W in the pod P is completed, the cap of the pod P is attached to the wafer loading / unloading port by the cap attaching / detaching mechanism 52 of the pod opener 50, and the pod P is closed.
The closed pod P is transported from the top of the mounting table 51 to the next process by the in-process transport device.
By repeating the above operation, wafers are sequentially processed one by one.

  Hereinafter, the linkage program 86 will be described.

In the execution of the sequence of the film forming process described above, the linkage program 86 virtually assigns a wafer number, which is a unique serial number for each wafer W, in cooperation with the linkage unit 90 and other folders of the main controller 71. At the same time, a transfer history file is created for each wafer number, and each transfer history file is sequentially stored in the transfer history file folder 89.
At this time, the linkage program 86 stores the number of the storage slot in the pod P of each wafer W in the transfer history file of each wafer number in the linkage unit 90. That is, a transfer history file is created in the linking unit 90 by associating the wafer number with the slot number of the pod so that the wafer W taken out from the pod P can be returned to the original slot of the pod P.

Each time the processing of the first CVD module 61, the second CVD module 62, the first cooling module 63, and the second cooling module 64 is completed, the linkage program 86 cooperates with the linkage unit 90 and other folders of the main controller 71. A production information file and a trace data file are created for each wafer W, and the production information file and the trace data file are sequentially stored in the production information file folder 87 and the trace data file folder 88, respectively.
At this time, the linking unit 90 configures the production information file name by the wafer number and the creation date and time of the production information file, and configures the trace data file name by the wafer number and the creation date and time of the trace data file. To do.
Here, the end time of processing in each module is used as the creation time. That is, the transmission data of the end event from each module is used.

Next, the process flow from creation to storage of the production information file name and the trace data file name will be described using the production information file name shown in FIG. 4 as a representative example.
As shown in FIG. 4, the linking unit 90 receives an event signal (including the wafer number, processing end date, and time as data) from the display device (device driver) 82 of the main controller 71 (step). A1), the processing end date and time are acquired (step A2).
The linking unit 90 replaces the numerical value of the acquired process end date and time with a character string (step A3), and creates a production information file name based on the wafer number and the process end date and time (step A4).
Next, the linking unit 90 opens the production information file (step A5), and creates data for saving the production information file name in the production information file based on the event data (step A6).
The linking unit 90 writes the production information file name in the production information file (step A7) and closes the production information file (step A8).
The trace data file name is also created in the same manner and saved (written) in the trace data file.

Next, the operation of the linkage program 86 when moving between the production information file and the trace data file by using the production information file name and the trace data file name saved as described above is performed on the product. An example of execution by an operator in the production engineering department (hereinafter abbreviated as an operator) in order to investigate the cause when there is a problem will be described with reference to FIG.
As a premise for executing the linkage program 86, the program for executing the sequence flow of the film forming process of the main controller 71 is down for the sake of safety.

In this case, the production information and trace data history of the wafer stored in a specific slot (for example, the slot with the first slot number) in a specific pod (for example, the pod with the first pod ID) is confirmed. It is customary.
Therefore, when a menu screen (not shown) is displayed, the operator opens a transfer history file that stores the pod P and the wafer W in association with each other as in the process flow shown in FIG. The transfer history information screen 91 (see FIG. 6) is displayed on the operation screen (step B1).

As shown in FIG. 6, according to the transfer history information screen 91, the target wafer number can be searched from the pod ID and the slot number.
Accordingly, the operator searches and selects the target wafer number from the pod ID and the slot number by observing the transfer history information screen 91 (step B2).
When the target wafer number is selected, the operator presses a production information button 91a as a screen switching means on the transfer history information screen 91 (step B3).
Incidentally, when the trace data button 92a is pressed on this screen, a trace data screen 93 to be described later is displayed.

When the operator presses the production information button 91a, the linking unit 90 searches the production information file folder 87 for the production information file name including the wafer number to be investigated according to the program (step B4), and the wafer to be investigated. The production information file name of the number is extracted and the production information file is opened (step B5).
The linking unit 90 reads the production information file (step B6), expands the data of the production information file (step B7), and displays it as a production information screen 92 (see FIG. 7) on the operation screen of the display device 82 (step B8). ).

In the production information screen 92 shown in FIG. 7, a logging item, a sub item, a logging condition, and a spot time are displayed corresponding to a step number (step ID) of a certain recipe.
As logging items, step time, pressure, pressure valve opening, penning, MFC, and the like are listed, and items can be selected.
As shown in FIG. 7, a trace data button 92a as a screen switching means is displayed on the production information screen 92, so that the operator displays the trace data by pressing the trace data button 92a. You can move to the screen.
When the operator depresses the trace data button 92a (step B9), the linking unit 90 searches the trace data file folder 88 for the same trace data file name as the production information file name including the wafer number to be investigated according to the program ( In step B10), the trace data file name of the wafer number to be investigated is extracted, and the trace data file is opened (step B11).
The linking unit 90 reads the trace data file (step B12), expands the data in the trace data file (step B13), and displays the trace data screen 93 (see FIG. 8) on the operation screen of the display device 82 (step B14). ).

On the trace data screen shown in FIG. 8, a graph of the gas flow rate is displayed.
As shown in FIG. 8, since the production information button 93a as the screen switching means is displayed on the trace data screen 93, the operator presses the production information button 93a to produce the production information screen 92. You can return to again.
As described above, since it is possible to freely move between the production information screen 92 and the trace data screen 93, the operator can sufficiently and quickly investigate the defect of the wafer to be investigated.
When the operator presses a cancel button (not shown) on the production information screen 92 and the trace data screen 93, the linkage unit 90 ends and returns to the transfer history information screen 91 as shown in FIG.
Each information screen (transfer history information screen 91, production information screen 92, trace data screen 93) is provided with an end button (not shown). When the end button is pressed, the screen ends and a menu screen (not shown). Return to.

  For example, the wafer number is written on the wafer itself so as to be optically readable, and the wafer number of the wafer to be investigated is the same as when the wafer number is read optically by an optical reader. If it is known, the process flow of the linkage program shown in FIG. 5 can be started from the production information screen 92 or the trace data screen 93.

  According to the embodiment, the following effects can be obtained.

1) The production information file name is composed of the wafer number and the creation date and time of the production information file, and the trace data file name is composed of the wafer number and the creation date and time of the trace data file. Since a free transition between the trace data screens can be easily performed, the operator can investigate the defect of the wafer to be investigated sufficiently and quickly.

2) Since the transfer history file is linked to the linkage program, the production information file name and trace data file name of the wafer to be investigated can be searched from the pod ID and slot number. Even when the wafer number to be investigated is unknown, the defect of the wafer can be investigated.

3) Since the production information file name and trace data file name of the wafer to be investigated can be searched from the pod ID and the slot number, it is not necessary to write the wafer number on the wafer itself. Method The entire system need not be changed.

  Needless to say, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

  For example, the screen switching means may be configured as a pop-up screen without being limited to providing the production information button and the trace data button as the screen switching means on the transfer history information screen, the production information screen, and the trace data screen.

  In the above embodiment, the cause investigation when there is an abnormality in the processed wafer has been described. However, the linkage program can be applied to design of processing conditions (so-called condition determination), investigation of performance of a continuous processing apparatus, and the like. .

  Although the CVD apparatus has been described in the above embodiment, the present invention can be applied to all substrate processing apparatuses such as an oxidation apparatus, a diffusion apparatus, an annealing apparatus, and a heat treatment apparatus.

  Further, the case of processing a wafer has been described, but the present invention can be applied to all substrates such as a liquid crystal panel, a magnetic disk, and an optical disk.

1 is a plan sectional view showing a multi-chamber continuous processing apparatus according to an embodiment of the present invention. FIG. It is a block diagram which shows the control system. It is a flowchart which shows preparation and preservation | save of a production information file name. It is a flowchart of a linkage program. It is a schematic diagram which shows a transfer log | history information screen. It is a schematic diagram which shows a production information screen. It is a schematic diagram which shows a trace data screen.

Explanation of symbols

W ... wafer (substrate), P ... pod (substrate carrier), 10 ... negative pressure transfer chamber (transfer chamber), 11 ... negative pressure transfer chamber casing, 12 ... negative pressure transfer device (transfer device), 13 ... Elevator, 14 ... Upper arm (holding part), 15 ... Lower arm (holding part), 16, 17 ... End effector, 20 ... First spare chamber, 21 ... First spare chamber housing, 22, 23 ... Loading Unloading port, 24 ... Gate valve, 25 ... Temporary table for first spare chamber, 26, 27 ... Loading / unloading port, 28 ... Gate valve, 30 ... Second spare chamber, 31 ... Second spare chamber housing, 32, 33 ... Loading / unloading port, 34 ... Gate valve, 35 ... Temporary table for second preliminary chamber, 36, 37 ... Loading / unloading port, 38 ... Gate valve, 40 ... Positive pressure transfer chamber (wafer transfer chamber), 41 ... positive pressure transfer chamber housing, 42 ... positive pressure transfer device (wafer transfer device), 43 ... elevator, 44 ... Actuator, 45 ... Notch aligner, 46 ... Clean unit, 47, 48, 49 ... Wafer loading / unloading port, 50 ... Pod opener, 51 ... Mounting table, 52 ... Cap attaching / detaching mechanism, 61 ... First CVD module (first Processing module), 62 ... second CVD module (second processing module), 63 ... first cooling module (third processing module), 64 ... second cooling module (fourth processing module), 65, 66, 67, 68 ... wafer loading / unloading exit.
DESCRIPTION OF SYMBOLS 70 ... Control system (control device) 71 ... Main controller 72 ... LAN system 73-78 ... Sub controller 81 ... Input device 82 ... Display device 83 ... Storage device 84 ... Host computer 85 ... GUI, 86... Linkage program (a program for displaying production information files and trace data files in linkage) 87... Production information file folder 88. Trace data file folder 89. Transfer history file folder 90.
91 ... Transfer history information screen, 91a ... Production information button (screen switching means), 92 ... Production information screen, 92a ... Trace data button (screen switching means), 93 ... Trace data screen, 93a ... Production information button (screen switching) means).

Claims (1)

A transfer information screen that displays the transfer information of the substrate in association with a carrier and a substrate, a processing screen that displays the contents of a production information file that stores processing conditions of the substrate, and trace data when the substrate is processed In a substrate processing apparatus provided with a trace screen for displaying the contents of a trace data file for storing and a display unit for displaying,
The conveyance information screen has switching means for switching the screen,
When the switching means is selected, the substrate processing apparatus is switched to the processing screen or the trace screen related to the substrate selected on the screen.

Images