JP2000077290A - Managing system for semiconductor production process - Google Patents

Abstract

PROBLEM TO BE SOLVED: To perform inspection efficiently by an arrangement wherein a host means retrieving a data base upon request of record information from a terminal means and delivers the processing record of a semiconductor to the terminal means. SOLUTION: A host means performs process check of lot in a cassette and delivers a lot ID to a wafer outer appearance inspection unit 20 if it is correct otherwise delivers an inspection recipe along with lot information. Upon receiving the information, the outer appearance inspection unit 20 informs inspection start to the host means and mounts an inspection wafer on an inspection stage 21 according to the inspection recipe. Positioning of wafer is then performed and an inspection result input section 30 acquires inspection results and a wafer image picked up by mean of a wafer inspection image camera 31. Decision of GO/NO-GO and defective category coding is made as the inspection results. The inspection results are delivered to the host means along with the wafer image. The host means stores the data in a data base. According to the system, inspection information can be grasped visually later.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to information management in a semiconductor wafer process. In semiconductor wafer processing plants, production TAT is shortened and leveled production is aimed at in order to improve productivity.

For the purpose of improving the productivity, in recent years, an automatic production system (CIM) which combines a production process management automatic transfer system by information management using a computer system has also been constructed for improving a semiconductor wafer process.

[0003] As a result, it can be said that the manufacturing process for performing wafer processing in a recent semiconductor factory has reached a stage where wafer processing can be performed almost unattended.

[0004]

However, it is said that the only situation where this unmanned production cannot be realized is the inspection and measurement process.

In other words, inspection and measurement in the semiconductor wafer process are mainly performed by operators, and it is important to match human production activities with wafer processing cycles in manufacturing equipment in order to improve productivity. is there.

[0006] Moreover, it is expected that this step will become more and more important in the future as the wafer process becomes finer. The present invention has been made by paying attention to such a point, and it is an object of the present invention to improve productivity as a wafer process improvement by changing a work form in an inspection or measurement process in a semiconductor wafer process.

[0007]

A first means of the present invention is as follows.
Photographing means for photographing a semiconductor surface image; history input means for inputting history information of semiconductor processing; an image data area for storing a photographed image obtained by the photographing means; and a semiconductor processing history inputted by the history input means A database having a history data area storing character data as a text data area, a table associating the image data area with the history data area, and host means and terminal means connected via a communication line. The means is a semiconductor manufacturing process management system that searches the database when a history information inquiry is made from the terminal means and outputs a processing history of the corresponding semiconductor to the terminal means.

By managing the processing history information of the semiconductor and the screen information in association with each other by using a table, it is possible to examine the validity of the inspection if necessary, or to separate the photographing process and the inspection process in time. The inspection process can be efficiently performed in another room with reference to the display screen of the terminal means.

The second means is that in the host means,
A step of searching a database when an inquiry is made from the terminal means and outputting a processing history of the corresponding semiconductor to the terminal means; receiving an image information request while displaying the processing history on the terminal means; Is received, the database is searched, image data corresponding to the processing history information is searched, and the step of displaying the image data together with the processing history information on the terminal means is sequentially executed.

That is, the processing history is referred to only on the display terminal using the character information, and the image information is obtained from the host means as needed, thereby preventing a reduction in processing efficiency due to unnecessary display of the image information. .

A third means is that the history data stored in the database includes a flag indicating whether or not the inspection has been completed. When the photographing process and the inspection process are separated in time, the presence / absence of the inspection becomes clear by the flag.

In a fourth aspect, the flag is rewritable while referring to a processing history and image data displayed on the terminal means. That is, after performing an inspection such as a visual inspection while referring to the processing history and image data on the display terminal, the flag is directly rewritten from the display terminal.

In a fifth means, the host means is connected to the semiconductor carrier control means by a communication line, and the semiconductor carrier is operated in response to a request from the terminal means.
Since the transfer of the wafer can be controlled by the host means by interlocking with the transfer system, automatic positioning and image capture can be automated.

According to a sixth aspect, in the first aspect,
The semiconductor manufacturing process management system includes a semiconductor surface circuit pattern size measurement device equipped with an operation electron microscope, and a measurement result and a measurement image executed through the operation electron microscope are used as history data and image data in the database. This is stored as data.

As described above, also in the length measuring step, the history information of the measuring operation and the image information of the circuit pattern can be handled at the same time, so that the efficiency of the length measuring operation is greatly improved and the length measuring accuracy is improved. Can be.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings.

[0017]

Embodiment 1 FIG. 1 is a schematic control system diagram of a production automation system in a semiconductor wafer process factory, FIG. 2 is a process flow diagram of a semiconductor wafer process, and FIG. 3 is a display screen of a lot processing work history used in semiconductor manufacturing. 4 is a schematic explanatory view in the case of displaying a work processing history, and FIG. 5 is an explanatory view showing a wafer appearance inspection apparatus.

In FIG. 1, reference numeral 1 denotes a semiconductor process management data server, which functions as a host server for managing the entire process. That is, the semiconductor process management data server 1 handles the processing steps and processing conditions of each production wafer lot, collected data after wafer processing, and stores information. The server 1 has a database 2 configured with a large-capacity storage device for the management.

FIG. 20 shows the structure of the database 2. The database 2 has an index table 2001 in which a storage address of wafer history data and a storage address of wafer image data are associated with each other using a lot ID as a key.

The wafer history data 20 in the database 2
02 stores the processing history in the semiconductor manufacturing process as shown in FIG. 3 as text data. Also,
The wafer image data 2003 includes the appearance inspection device 2 described later.
The image data of the wafer surface obtained at 0 or the like is stored. As described above, the wafer history data 2002 and the wafer image data 2003 are stored in the index table 2001.
And are associated and managed.

The semiconductor process management data server 1 comprises:
It is connected to a LAN 3, and the LAN 3 has an automation area computer 5 for managing one area of a manufacturing process at a required point via a communication network bridge 4.
Is connected to

A display terminal for semiconductor process management 10 (see FIG. 4) is connected to the automation area computer 5 via a repeater 7. Further, various manufacturing devices 8 and measuring devices / inspection devices 9 are connected via the terminal server 6. Further, the automation area computer 5 is connected to the transfer controller 11 and connected to the transfer controller 11.
Is connected to the transport control LAN.

In the above system configuration, the semiconductor wafer is transferred and transferred to the manufacturing apparatus 8 through a transfer system controlled by the transfer controller 11. Then, the wafer processing conditions are transmitted from the database 2 to the manufacturing apparatus 8 through the LAN 3, the bridge 4, and the terminal server 6 by the semiconductor process management data server 1 (host), and the processing is performed.

After completion of the processing, the lot operation processing history information and the collected data are stored in the database 2 by the reverse route and then used in various places where data is required. After the wafer processing, a normal wafer appearance inspection is performed and the process proceeds to the next processing step.
FIG. 5 shows the configuration of the wafer appearance inspection device 20. This wafer appearance inspection device 20 is included in the measuring device / inspection device 9 in FIG. 1, and is connected to the semiconductor process management data server 1 (host) via the terminal server 6 or the like as in the above-described manufacturing device 8. Have been.

FIG. 3 shows a work history for each lot at the time of semiconductor manufacture, which is displayed on the display screen of the display terminal 10 for semiconductor process management. That is, during the wafer processing, the operator needs to check the work history of the wafer processing for each lot in order to check the progress of the processing and to check whether any problem has occurred in the wafer processing. In the prior art, a sheet in which a wafer processing work history called a lot sheet or a lot traveler is written is attached to each wafer lot together with the lot, and an operator writes a work record every time the wafer processing is performed. However, in this embodiment, the wafer cassette 1
3 is attached to the barcode reader 17
By recognizing the lot on the semiconductor process management display terminal 10, the history of the wafers 15 stored in the wafer cassette 13 is called from the semiconductor process management database 2 and displayed on the semiconductor process management display terminal 10. By calling it on the screen, the work history of the wafer can be easily confirmed.

The display screen shown in FIG. 3 includes, as lot information, a product name, the number of sheets, a current in-process and a past processing step, a processing apparatus, a processing date and time, a processing condition, and an ID of an operator who performed the processing.
And the like, and processing flow information and the like for the lot to be processed in the future.

The display terminal 10 for semiconductor process management
Can be installed not only near the manufacturing apparatus 8 but also at various places through the communication network (LAN3) in the factory.
By constructing an intranet using the / IP protocol, it is possible to confirm information at various places. further,
If security such as a firewall is established, accessing the LAN 3 from the outside makes it possible to check information from all over the world through Internet technology.

FIG. 5 is an outline of a wafer appearance inspection apparatus 20 used in a semiconductor wafer process. In the figure, reference numeral 21 denotes a wafer inspection stage, which is an inspection wafer cassette 23.
The wafer supported by the wafer transfer arm 28 is placed thereon. A wafer inspection image camera 31 is arranged above the wafer inspection stage 21, and a photographed image can be observed by the microscope 22.

Reference numeral 25 denotes a wafer transfer section, which moves on the orbit on the wafer transfer arm 28 and the wafer feeder 26 described above.
Can be moved in the horizontal direction in FIG. Numeral 24 denotes a defective wafer storage cassette in which wafers determined to be defective as a result of inspection are stored in the cassette 24. Reference numeral 27 denotes a wafer pre-alignment stage. By operating the joystick 29, the wafer on the wafer inspection stage 21 can be finely adjusted to an optimal position for inspection. Reference numeral 30 denotes an inspection result input unit on which input keys for an operator to input the appearance inspection result are arranged. Three
Reference numeral 2 denotes a monitor capable of displaying an image captured by the wafer inspection image camera 31. Reference numeral 33 denotes a network line for host communication, which is capable of transmitting / receiving inspection data to / from the semiconductor process management data server 1 (host) through the terminal server 6.

FIG. 6 shows a communication sequence with the host in the appearance inspection at this time. First, when each wafer cassette 23 is set in the visual inspection device 20 and a cassette ID is read through the bar code reader 17 of the display terminal 10 for semiconductor process management near the visual inspection device 20 (601), the ID is transmitted to the communication network. The data is sent to the semiconductor process management data server 1 (host) via the server 33.

The semiconductor process management data server 1 (host) checks the process of the lot in the cassette (602). If the result is correct (603), the inspection recipe is read together with the lot ID and lot information into the wafer appearance inspection device. Send to 20.

Upon receiving the information, the visual inspection apparatus 20 notifies the semiconductor process management data server 1 (host) of the start of the inspection and sets the inspection wafer on the inspection stage 21 according to the inspection recipe (604). Next, the position of the wear is determined (605), and the inspection result input by the inspection result input unit 30 and the wafer image captured by the wafer inspection image camera 31 are captured (606, 60).
7). Specifically, the judgment of good / defective and defective category codes is performed as the inspection result, and the result is input from the inspection result input unit 30. Then, the inspection result and the wafer image are sent to the semiconductor process management data server 1 (host). The semiconductor process management data server 1 (host) receiving these data stores the data in the database 2 (60).
8). In the wafer appearance inspection device 20, the processing described in the steps 604 to 608 is continuously repeated (60
9). Then, the end of the inspection of the lot is notified from the wafer appearance inspection apparatus 20, and the inspection completion command is input from the semiconductor process management display terminal 10 by the operator, thereby completing the wafer appearance inspection (610).

As described above, in this embodiment, it is possible to acquire the wafer image image data together with the inspection result input by the operator, and this wafer image image data is stored in the database 2 together with the data (text data) of the appearance inspection result. Since it is stored, the inspection information can be visually grasped later.

In other words, the appearance of the wafer at the time of the conventional appearance inspection can be viewed only by the operator using the appearance inspection apparatus, and the operator's comment can be left on the inspection work processing history for the phenomenon calling attention of the operator. I have been communicating information to other people. However, by enabling the image image data of the inspection wafer to be treated as the inspection operation history together with the processing history information of the inspection operation and the comment information of the operator as in the present embodiment, the inspection information for the wafer processing increases dramatically. .

[0035]

Embodiment 2 FIG. 7 shows a display screen of an inspection work processing history of a wafer appearance inspection work. That is, FIG. 3 shows the image image data of the inspection wafer acquired in the first embodiment displayed on the display screen 16 of the display terminal 10 for semiconductor process management.

As shown in FIG. 7, the display screen 16 has a display area (left side in the display screen) indicating whether the appearance inspection work has been completed or not completed yet. The display area of the wafer appearance inspection result and the defect category code can be rewritten by an operator.

FIG. 8 shows a sequence for displaying the history information of the wafer appearance work. When an operator involved in a post-process in a factory or an engineer in a living room wants to view the work processing history (step 801), first, the bar code reader 17 of the display terminal 10 for semiconductor process management is used to read the bar of the wafer cassette 13. The code 14 is read. The display terminal 10 for semiconductor process management reads the cassette I from the read barcode.
D is extracted, and the cassette ID is transmitted to the semiconductor process management data server 1 (host).

The semiconductor process management data server 1 (host) searches the database 2 using the cassette ID as a search key. Then, the process processing work history information of the cassette ID is created from the retrieved information (802).
This history information is transmitted to the display terminal 10 for semiconductor process management. The semiconductor process management display terminal 10 displays the process processing work history of the lot of the cassette ID received in this manner on the display screen 16. The display here is still mainly text data, and is history information as shown in FIG.

On the other hand, when a person in charge of inspection requests detailed information on the inspection process, the semiconductor process management data server 1 (host) transmits the processing history information of the wafer appearance inspection process and the wafer image image data. A display screen is created (804), and the screen data is transmitted to the semiconductor process management display terminal 10. Thus, the wafer image image data shown in FIG. 7 is displayed on the display screen 16 (805).

The inspector checks the inspection result while looking at the wafer image data (806), and inputs the result. When the result is input, the display terminal 10 for semiconductor process management sets an inspection completion flag after obtaining the inspection result, the failure category, etc. (808). Then, the update data is sent to the semiconductor process management data server 1 (host). The semiconductor process management data server 1 (host) updates the database 2 based on the updated data (809).

As described above, in this embodiment, the inspector who needs the information of the inspection work processing history at an arbitrary timing is the semiconductor process management display terminal 10 linked with the semiconductor process management data server 1 (host). Enables simultaneous confirmation of the wafer image image and work history, and is used for fine adjustment of wafer processing conditions in the post-inspection process, and information sharing among multiple people speeds up measures for production line quality problems. A great effect can be expected.

Further, the wafer cassette 13 is installed in the appearance inspection machine.
Even if the appearance inspection result is not determined at the timing when is set, the inspection result and the failure category can be determined at another timing.

This means that the operator of the inspection machine and the person in charge of inspection can be separated from each other when special knowledge is required for trial production or the like. Improvement can be expected.

[0044]

Embodiment 3 FIG. 9 is an outline of a scanning electron microscope for semiconductor used in a length measuring machine. In the figure, a scanning electron microscope 40 used as a length measuring device 401 includes a main body 41, a wafer cassette autoloader 42, a control unit 43, and an operation unit 44. The operation electron microscope 40 has an automatic positioning unit 48 including a scan converter 48a, a pattern recognition unit 48b, and a reference pattern storage unit 48c. The automatic positioning unit 48 holds a reference pattern for a circuit pattern to be measured in advance, compares the reference pattern with an actual circuit pattern, measures the amount of deviation of the XY coordinates, and measures To determine the position of the circuit pattern whose length is to be measured by correcting the deviation.

The image of the operation electron microscope 40 is photographed by the camera 45, displayed on the display screen of the monitor 46, and sent to the semiconductor process management data server 1 (host) through a network line.

Next, FIG. 10 shows a communication sequence with the host in the length measuring step. First, the wafer cassette 13 is set on the wafer cassette autoloader 42 in FIG.
The cassette ID is read by the barcode reader 17 of the semiconductor process control display terminal 10 near the length measuring machine 401 (1001), and this is read by the semiconductor process control data server 1.
(Host). The semiconductor process management data server 1 (host) refers to the database 2 and checks the process of the lot in the corresponding cassette (100).
2) If the result of the check is correct (1003),
The lot ID, lot information and measurement recipe are sent to the length measuring machine 401 via the communication network line 47.

The length measuring machine 401 notifies the semiconductor process management data server 1 (host) of the start of measurement,
The measurement wafer is set on the measurement stage according to the measurement recipe (1004), and the automatic positioning unit 48 is set.
Then, the wafer is positioned (1005), and measurement data is obtained by a dimension measurement operation using the scanning electron microscope 40 (1006). Specifically, the measurement data is obtained by an operator measuring a pattern dimension using a cursor that displays a circuit pattern image of the wafer surface obtained by the scanning electron microscope 40 together with the image.

At this time, the measured image is captured by the camera 45 (1007), and the measurement result and the measured image obtained by these are sent to the semiconductor process management data server 1 (host) through the communication network line 47.

The semiconductor process management data server 1 (host) stores the measurement result and the length measurement image obtained above in the database 2 as history information (1008). Then, the length measuring device 401 measures the length of the wafer at the next position (1009). This measurement result is also sent to the semiconductor process management data server 1 (host) in the same manner as in steps 1004 to 1008.

Completion of the length measurement process is performed by inputting a completion command to the semiconductor process management display terminal 10 (1010). As described above, in the present embodiment, the history information of the measurement work process and the image information of the circuit pattern are simultaneously handled in the length measurement step, so that the information obtained at the time of the length measurement is dramatically increased.

Next, a method of using the length measurement result and the length measurement image obtained above will be described. FIG. 11 is a display screen of the work processing history of the length measurement process displayed on the display terminal 10 for semiconductor process management.

FIG. 12 shows a sequence for displaying the measurement work processing history information once collected. As for the processing history of the length measurement, a display screen as shown in FIG. 11 can be obtained at an arbitrary timing at an arbitrary place on the semiconductor process management display terminal 10 in the factory as in the second embodiment. This will be described in detail with reference to FIG.

When the operator (person in charge of inspection) wants to acquire the process processing work history information of the processing lot (120
1), the cassette ID is read by the barcode reader 17 of the display terminal 10 for semiconductor process management. This cassette I
When D is sent to the semiconductor process management data server 1 (host), the database 2 is searched and process processing work history information is created (1202) and sent to the semiconductor process management display terminal 10 as display information (text data). Can be
The operator refers to the history information displayed on the semiconductor process management display terminal 10 (1203). The history information at this time has the format shown in FIG. When the operator needs more detailed information on the length measurement process, the operator instructs the detailed information or the image information on the display terminal 10 for semiconductor process management. 1 (host). In the semiconductor process management data server 1 (host),
When this request is received, the database 2 is searched, and the processing work history information of the dimension measurement process and the length measurement image information of each wafer are created as a display screen (1204), and this is displayed on the semiconductor process management display terminal 10. send.

In this way, the information shown in FIG. 11 is displayed on the display terminal 10 for semiconductor process management (120).
5). The operator (inspection person) checks the length measurement result (1206), and, if further dimension input is required, the inspection result input unit 30 of the display terminal 10 for semiconductor process management.
Input more dimension data.

When the dimension data is input, the semiconductor process control display terminal 10 transmits the dimension measurement data to the semiconductor process control data server 1 (host) (1207, 1208). The semiconductor process management data server 1 (host) that has received the dimension measurement data updates the database 2 and completes the process.

As described above, in the present embodiment, the history information of the measurement work process and the image information of the circuit pattern can be handled simultaneously in the length measurement process, so that the fine adjustment of the processing conditions in the subsequent process and the sharing of the same information can be performed. The effect can be expected to speed up and improve the accuracy of line quality evaluation due to the development.

Further, the wafer cassette 13 is
Even if dimension measurement is not performed at the timing when
The dimension can be measured at another timing. As for the dimension measurement, similarly to the second embodiment, the operator of the length measuring machine 401 and the dimension measurement staff can be separated, and the productivity of the factory can be improved.

[0058]

Fourth Embodiment FIG. 13 shows a display screen of an image of a wafer appearance and a length measurement circuit pattern. In the present embodiment, images of wafers in lot units can be listed.

FIG. 14 shows a communication sequence in the case of displaying an image of a wafer appearance and a length measurement circuit pattern on a display terminal to perform various investigations. Hereinafter, the processing of this embodiment will be described in detail with reference to FIG.

When an operator (person in charge of inspection) or an engineer wants to display an image of a processing lot for inspection (1401), the bar code reader 17 of the display terminal 10 for semiconductor process management is used to display the bar of the wafer cassette 13. Scan code 14. The semiconductor process management display terminal 10 transmits the cassette ID thus obtained to the semiconductor process management data server 1 (host).

The semiconductor process management data server 1 (host) searches the database 2 and generates required image setting display information from the requested lot process flow (1).
402), and transmits it to the semiconductor process management display terminal 10.

The display terminal 10 for semiconductor process management displays the required image setting display information (1403). Here, if the operator wants to set a required image, for example, if he wants to display a series of wafer appearance images in chronological order according to the process flow, he or she sends an image display request through the semiconductor process management display terminal 10 to the semiconductor process management. To the application data server 1 (host).

The data server 1 (host) for semiconductor process management, which has received the image display request, searches the database 2 to collect images related to the series of wafers and creates a display screen (1405, 1406). Then, the created display screen is transmitted to the semiconductor process management display terminal 10 and displayed (1407). As a result, the displayed image is the one shown in FIG. In this figure, since the wafer images are displayed in a time-series list, it is extremely easy to analyze the quality trouble of the semiconductor product. In addition, since image information of a wafer surface or a circuit pattern, which has been difficult to handle up to now, can be handled together with a wafer processing history, it becomes effective information for guaranteeing the quality of a product against a user complaint.

[0064]

Fifth Embodiment FIG. 15 is a schematic view of an automatic wafer transfer system in a wafer processing factory, and FIG. 16 is an explanatory diagram showing a transfer state in a process by a length measuring machine therein.

In the drawing, reference numeral 50 denotes an inter-process transfer path, 51 denotes an automatic warehouse (stocker), and 52 denotes an automatic warehouse moving station. 53 is an automatic warehouse AGV port,
The exchange of the wafer cassette 13 with the AGV 54 is performed.

Reference numeral 55 denotes a transport path in the AGV bay. A manufacturing apparatus 56, a wafer visual inspection apparatus 57, and a length measuring device 58 are arranged on the outer periphery of the transport path 55 in the bay. As shown in FIG. 16, the length measuring device 58 has the automatic positioning unit 48 described in FIG. 9 in order to cope with unmanned operation. The automatic positioning unit 48 holds a reference pattern for a circuit pattern to be measured in advance, compares the reference pattern with an actual circuit pattern, measures the amount of deviation of the XY coordinates, and measures To determine the position of the circuit pattern whose length is to be measured by correcting the deviation.

The AGV 54 has a robot arm 62.
Is provided so that the length measuring wafer cassette 61 of the length measuring machine 401 can be transferred to the wafer cassette storage 63 side.

FIG. 17 shows a communication sequence of a system for unmanned production of a length measuring process in a wafer processing factory. First, the length measuring machine 401 outputs a request for lot information to the semiconductor process management data server 1 (host) when the length can be measured. Data server 1 for semiconductor process management
Upon receiving a request from the length measuring machine 401, the (host) searches for a lot that can be measured by the length measuring machine 401 from an in-process lot in the factory (1701).

Here, when there is a lot whose length can be measured (1
702) issues a command to the transfer controller 11 that controls the transfer system to transfer and transfer the lot to the length measuring device 401 (1703).

The transfer controller 11 operates the automatic warehouse transfer station 52, the AGV 54 and the like so as to transfer the measurement lot to the corresponding length measuring machine 401 (170).
4). Further, when the measurement lot is set in the length measuring device 401 by the operation of the robot arm 62 of the AGV 54 shown in FIG. 16 (1705), the transfer is completed by the transfer controller to the semiconductor process management data server 1 (host). Notified. At the same time, the lottery 401 inquires the lot information of the measurement lot from the semiconductor process management data server 1 (host) to the semiconductor process management data server 1 (host). The recipe is notified to the length measuring machine 401.

The length measuring device 401 locates a circuit pattern at a specific point on the wafer surface in accordance with the above-described recipe and captures a length measurement image (1706, 1707). Then, the wafer measurement position information and the length measurement image information are transmitted to the semiconductor process management data server 1 (host). Then, a moving image capture flag is set and transmitted to the semiconductor process management data server 1 (host) to inform that the dimension measurement is not performed (1708, 1709). When the measurement of the lot length image is completed, the length measuring machine 401 transmits a lot measurement completion notification and a request to transport the lot to the next process to the semiconductor process management data server 1 (host) in order to advance the lot to the next process. .

The semiconductor process management data server 1 (host) receives this notification, searches for the next process (1711), and outputs to the transport controller 11 a transport instruction for transporting the measured lot to the next process. Based on this, the transport controller 11 instructs automatic transfer of the measured lot (17).
12), the lot is transported to the next process (1712).

In the present embodiment, as described above, the processing of the length measuring step is completed without the intervention of the operator, and the wafer lot is in a state of waiting for the processing of the next step. On the other hand, in the inspection step, the same operation as described above can be performed by using an inspection device having an automatic positioning function.

FIG. 19 shows a sequence in the case where dimensions of the length measuring circuit pattern image thus obtained are measured at another timing. For example, a case will be described in which a dimension measurement person is present in a living room other than a clean room for performing wafer processing, and the host uses a display terminal to inquire about a lot in which a length measurement circuit pattern image is captured in a length measurement process.

When the operator in the living room wants to perform dimension measurement (1901), he first inputs the request from the semiconductor process management display terminal 10. When this request arrives at the semiconductor process management data server 1 (host), the semiconductor process management data server 1 (host) searches the database 2 (1902) and sends the corresponding lot information to the semiconductor process management display terminal 10. It is transmitted and displayed (1903).

An operator operates the display terminal 1 for semiconductor process management.
When selecting a lot to be measured from the lots displayed as 0 (1904), the ID of the measured lot is input to the semiconductor process management display terminal 10. When the ID is received by the semiconductor process management data server 1 (host) via the semiconductor process management display terminal 10, the semiconductor process management data server 1 (host) searches the database 2 to perform the measurement. The work history information and the length measurement image of the lot are extracted (1905). Then, the obtained length measurement image is transmitted to the display terminal 10 for semiconductor process management, and the image is displayed on the display screen of the display terminal 10 for semiconductor process management (190).
6).

The operator measures the dimensions based on the image displayed on the display terminal 10 for semiconductor process management (19).
07), the measured dimension value is displayed on the display terminal 1 for semiconductor process management.
Input from 0. The measurement dimension value input in this manner is transmitted to the semiconductor process management data server 1 (host) together with a measurement completion flag. The semiconductor process management data server 1 (host) adds a measurement dimension value to the corresponding lot in the database 2 and sets a measurement completion flag to a set state.

As described above, in this embodiment, the measurement recipe is received, and the length measurement circuit pattern image of the length measuring machine 401 having the automatic positioning function and the in-process transfer function is transferred to the semiconductor process management data server 1 (host). And stored as image information. Therefore, the dimension measurement can be performed at a timing different from the normal timing, and
However, even in a clean room of a semiconductor wafer process factory laid out at the same place as the manufacturing apparatus 8, unmanned wafer process production can be performed without an operator.

By providing the same function to the appearance inspection apparatus 20, even if the appearance inspection apparatus 20 is laid out at the same place as the manufacturing apparatus 8, the production of the unmanned wafer process can be realized similarly.

Unmanned wafer process production not only maintains the cleanliness of the wafer surface, but also performs wafer processing according to a fine production processing schedule, which has been difficult for human work. Can be realized as planned.

[0081]

According to the present invention, the inspection information for wafer processing is greatly improved by using the image data of the inspection wafer as the inspection operation history together with the processing history information of the inspection operation and the comment information of the operator. Can be increased.

[Brief description of the drawings]

FIG. 1 is a schematic control system diagram of a production automation system in a semiconductor wafer processing factory.

FIG. 2 is a process flow chart of a semiconductor wafer process.

FIG. 3 is a display screen of a lot processing work history used in semiconductor manufacturing.

FIG. 4 is a schematic explanatory view in the case of displaying a work processing history on a display terminal for semiconductor process management.

FIG. 5 is an explanatory view showing a wafer appearance inspection apparatus.

FIG. 6 is a sequence diagram showing a communication procedure with a semiconductor process management data server in a visual inspection;

FIG. 7 is a display screen of an inspection work processing history of a wafer appearance inspection work.

FIG. 8 is a sequence diagram in the case of displaying history information of wafer appearance work.

FIG. 9 is a schematic diagram of a scanning electron microscope for semiconductors used in a length measuring machine.

FIG. 10 is a communication sequence diagram in a length measurement process.

FIG. 11 is a display screen diagram of a work processing history in the length measurement process.

FIG. 12 is a display sequence diagram of a work processing history in the length measurement process.

FIG. 13 is a view of a wafer appearance inspection apparatus and a display screen of a length measurement image.

FIG. 14 is a sequence diagram at the time of wafer appearance inspection and length measurement screen inspection.

FIG. 15 is an explanatory view showing an automatic wafer transfer system.

FIG. 16 is a partial view of an automatic wafer transfer system near a length measuring machine.

FIG. 17 is a communication sequence diagram of a length measuring process in an unmanned semiconductor wafer production system (1).

FIG. 18 is a communication sequence diagram (2) of a length measuring process in an unmanned semiconductor wafer production system.

FIG. 19 is a dimension measurement sequence diagram in an unattended semiconductor wafer production system.

FIG. 20 is a block diagram showing the internal configuration of a database.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Data server (host) for semiconductor process management 2 Database 3 LAN 4 Bridge for communication network 5 Area computer for automation 6 Terminal server 7 Repeater 8 Manufacturing device 9 Measuring machine / Inspection device 10 Display terminal for semiconductor process management 11 Transport controller 12 Transport Control LAN 13 Wafer cassette 14 Barcode 15 Wafer 16 Display screen 17 Barcode reader 20 Wafer appearance inspection device 21 Wafer inspection stage 22 Microscope 23 Inspection wafer cassette 24 Defective wafer storage cassette 25 Wafer transfer unit 26 Wafer feeder 27 Wafer pre-alignment Stage 28 Wafer delivery arm 29 Wafer inspection joystick 30 Inspection result input unit 31 Wafer inspection image camera 32 Monitor 33 Network communication for host communication Line 40 Scanning electron microscope 41 Main body 42 Wafer cassette autoloader 43 Control unit 44 Operation unit 45 Camera 46 Monitor 47 Network line for host communication 48 Automatic positioning unit 48a Scan converter 48b Pattern recognition device 48c Reference pattern storage unit

Claims (6)

[Claims] 1. A photographing means for photographing a surface image of a semiconductor, a history input means for inputting history information of semiconductor processing, an image data area for storing a photographed image obtained by the photographing means, and an input by the history input means. A database including a history data area for storing the processed semiconductor processing history as character information, a table for associating the image data area with the history data area, and host means and terminal means connected via a communication line. The semiconductor manufacturing process management system, wherein the host means searches the database when the terminal means inquires of history information from the terminal means and outputs a corresponding semiconductor processing history to the terminal means. 2. The host means searches a database when the terminal means makes an inquiry and outputs a processing history of a corresponding semiconductor to the terminal means; and displays the processing history on the terminal means. Receiving the image information request while searching for the image data corresponding to the processing history information by searching the database when receiving the image information request, and displaying the image data together with the processing history information on the terminal means. 2. The semiconductor manufacturing process management system according to claim 1, wherein the steps are sequentially executed. 3. The semiconductor manufacturing process management system according to claim 1, wherein the history data stored in the database includes a flag indicating whether or not the inspection has been completed. 4. The semiconductor manufacturing process management system according to claim 3, wherein said flag is rewritable with reference to a processing history and image data displayed on said terminal means. 5. The semiconductor device according to claim 1, wherein said host means is connected to a semiconductor carrier control means by a communication line, and activates the semiconductor carrier in response to a request from said terminal means. Manufacturing process management system. 6. The semiconductor manufacturing process management system includes a semiconductor surface circuit pattern dimension measuring device provided with a scanning electron microscope, and a measurement result and a measurement image executed through the scanning electron microscope are stored in the database. 2. The semiconductor manufacturing process management system according to claim 1, wherein the system is stored as history data and image data.